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US5395783A Expired / Lapsed US ⏱️ 0.0 years remaining

Electronic device and process achieving a reduction in alpha particle emissions from boron-based compounds essentially free of boron-10

Assignee: Texas Instruments Inc
•
Filing: 1993-02-16
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Granted: 1995-03-07
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Expires: 2013-02-16
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Abstract

Abstract Reduced soft errors in charge-sensitive circuit elements such as volatile memory cells 200 occur by using boron-11 to the exclusion of boron-10 or essentially free of boron-10 in borosilicate glass 230, 240 deposited on the substrate 206 directly over the arrays of memory cells. Boron-10 exhibits a high likelihood of fission to release a 1.47 MeV alpha particle upon capture of a naturally occurring cosmic ray neutron. This capture occurs frequently in boron-10 because of its high neutron capture cross-section. Boron-11 does not fission.

Inventors

  • 👤 Robert C. Baumann
  • 👤 Timothy Z. Hossain

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 20:41
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/20; H10W42/25; Y; Y10; Y10S; Y10S257/00; Y10S257/921; Y10S438/00; Y10S438/953

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 56 words
A process of making a dynamic random access memory part comprising: A. forming an array of memory cells in a semiconductor substrate with each cell including a pass transistor and a capacitor; and B. forming a layer of borosilicate glass over at least the capacitor with the boron in the borosilicate glass consisting essentially of boron-11.
Claim 2
Dependent Claim 56 words
A process of making a dynamic random access memory part comprising: A. forming an array of memory cells in a semiconductor substrate with each cell including a pass transistor and a capacitor; and B. forming a layer of borosilicate glass over at least the capacitor with the boron in the borosilicate glass consisting essentially of boron-11.
Claim 3
Dependent Claim 37 words
A process of forming a coating comprising: A. forming a substrate of material consisting of silicon; and B. forming a coating of borosilicate glass on the substrate, the boron in the borosilicate glass consisting essentially of boron-11.
Claim 4
Dependent Claim 37 words
A process of forming a coating comprising: A. forming a substrate of material consisting of silicon; and B. forming a coating of borosilicate glass on the substrate, the boron in the borosilicate glass consisting essentially of boron-11.
Claim 5
Dependent Claim 49 words
A process of making a device comprising: forming an alpha particle charge sensitive part, including forming a dynamic memory cell having a single transistor connected to a charge sensitive capacitor; and forming a boron-containing material proximate to the alpha particle charge sensitive capacitor, the boron consisting essentially of boron-11.
Claim 6
Dependent Claim 49 words
A process of making a device comprising: forming an alpha particle charge sensitive part, including forming a dynamic memory cell having a single transistor connected to a charge sensitive capacitor; and forming a boron-containing material proximate to the alpha particle charge sensitive capacitor, the boron consisting essentially of boron-11.
Claim 7
Dependent Claim 17 words
The process of claim 3 in which forming the dynamic memory cell includes forming a trench capacitor.
Claim 8
Dependent Claim 16 words
The process of claim 3 in which forming the boron-containing material includes forming a borosilicate glass.
Claim 9
Dependent Claim 23 words
The process of claim 3 in which forming the boron-containing material includes forming the boron-containing material over the alpha particle charge sensitive parts.
Claim 10
Dependent Claim 17 words
The process of claim 3 including forming the alpha particle charge sensitive part of a semiconducting material.
Claim 11
Dependent Claim 33 words
The process of claim 3 including forming the alpha particle charge sensitive part of a substrate semiconducting material and forming the boron-containing material of borosilicate glass over the alpha particle charge sensitive part.

References Cited (Backward Citations)

JPS58120533A Cited
JPS60183768A Cited
US4894693A Cited
US4833647A Cited
US4892840A Cited
JPS62281358A Cited
US5168366A Cited
JPH02114665A Cited
JPH04334015A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1998-03-06 1998-09-05 1999-03-07 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2002-03-06 2002-09-05 2003-03-07 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2006-03-06 2006-09-05 2007-03-07 $7700.00 Window Closed / Lapsed

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