US5387331A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wafer cutting device
Assignee: United States Department of the Air Force
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Filing: 1994-05-19
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Granted: 1995-02-07
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Expires: 2014-05-19
Abstract
Abstract A wafer cutting device has a plurality of individually highly tensioned diamond impregnated wires that are mounted in a translatable head. Each wire has a tension monitor connected thereto for the purpose of insuring uniform tension and also alerting to breakage. Further, a differential DC voltage is applied to the wires and the crystal with the assistance of electrolytes to improve the removal of material for minimizing damage to the surfaces. The crystal is mounted on a two dimensional stage. During normal cutting the crystal is moved vertically into the cutting wire. The vertical cutting rate is adjusted due to the configuration of the crystal. At the end of cutting, the crystal is moved laterally so as to place a notch in the wafers for the purpose of removing the wafer in a clean break.
Inventors
- 👤 Brian S. Ahern
- 👤 David W. Weyburne
- 👤 Gerald W. Iseler
- 👤 Harry R. Clark, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 08:07
CPC Classifications
B; B23; B23H; B23H7/00; B23H7/02; B23D; B23D57/00; B23D57/003; B23D57/0069
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
193 words
A wafer cutting device, said wafer cutting device comprising: a support structure, said support structure providing a closed environment; a guide track, said guide track attached to a top of said support structure, said guide track having an electrically insulating material thereon; means for holding cutting wires, said holding means including means for monitoring tension in said cutting wires, means for adjusting the tension in said cutting wires, and means for placing a voltage on said cutting wires; means for reciprocating said holding means, said reciprocating means attached fixedly to said support structure and flexibly connected to said means for holding; means for holding a crystal, said means for holding said crystal translatably mounted to said support structure, said means for holding said crystal being adjustable; means for providing a preselected electrolyte, said electrolyte being placed in an area where said cutting wires are cutting said crystal; and electronic control means, said electronic control means providing at least a controllable voltage to said means for reciprocating, providing a controllable voltage to a means for translating said holding means upon said support structure, and providing a controllable voltage to said crystal and cutting wires.
Claim 2
Dependent Claim
193 words
A wafer cutting device, said wafer cutting device comprising: a support structure, said support structure providing a closed environment; a guide track, said guide track attached to a top of said support structure, said guide track having an electrically insulating material thereon; means for holding cutting wires, said holding means including means for monitoring tension in said cutting wires, means for adjusting the tension in said cutting wires, and means for placing a voltage on said cutting wires; means for reciprocating said holding means, said reciprocating means attached fixedly to said support structure and flexibly connected to said means for holding; means for holding a crystal, said means for holding said crystal translatably mounted to said support structure, said means for holding said crystal being adjustable; means for providing a preselected electrolyte, said electrolyte being placed in an area where said cutting wires are cutting said crystal; and electronic control means, said electronic control means providing at least a controllable voltage to said means for reciprocating, providing a controllable voltage to a means for translating said holding means upon said support structure, and providing a controllable voltage to said crystal and cutting wires.
Claim 3
Dependent Claim
137 words
A wafer cutting device as defined in claim 1 wherein said means for holding said cutting wires comprises a translatable head, said head being mounted on said guide track, said head having an upside down U shape, said head being movable in the x-axis, said translatable head further comprising: a first leg, said first leg having a bottom side, said bottom side having means thereon for holding ends of a plurality of cutting wires; a plurality of tension gauges, said tension gauges being mounted to said first leg, one cutting wire end being mounted to each tension gauge; a second leg, said second leg having a bottom side, said bottom side having means thereon for holding the other ends of said plurality of cutting wires said means for holding the other ends having adjustable tensioning means therein.
Claim 4
Dependent Claim
22 words
A wafer cutting device as defined in claim 2 wherein said means for holding the other ends comprises helical and pinion gears.
Claim 5
Dependent Claim
121 words
A wafer cutting device as defined in claim 1 wherein said reciprocating means comprises: means for translating said translatable head in a reciprocating manner, said means for translating comprising: a push rod, said push rod connected to said head, a connection therebetween being electrically insulated; a drive arm, said drive arm flexibly connected to said push rod; a flywheel, said drive arm flexibly connected to said drive arm; and drive means, said drive means comprising: an electric motor, said motor being driven in a predetermined manner; and a gear box, said gear box being connected to said electric motor and to said flywheel, said drive means being fixedly mounted onto a support arm which is fixedly attached to said support structure.
Claim 6
Dependent Claim
36 words
A wafer cutting device as defined in claim 1 wherein said means for monitoring tension in said cutting wires indicates a tension in each wire and indicates a tension out-of-range condition to terminate the cutting process.
Claim 7
Dependent Claim
41 words
A wafer cutting device as defined in claim 1 wherein said means for placing a voltage on said cutting wires further places a voltage on said crystal, a difference of said voltages being in the range of 0 to 40 volts.
Claim 8
Dependent Claim
44 words
A wafer cutting device as defined in claim 1 wherein said means for holding said crystal further includes means for translating said crystal in an y-axis direction being perpendicular to said x-axis, said y-axis translation placing a lateral cut in said wafers after slicing.
Claim 9
Dependent Claim
120 words
A wafer cutting device as defined in claim 1 wherein said means for holding said crystal comprises: a goniometer for holding said crystal; a vertically adjustable platform, said goniometer mounted to said platform; a pair of vertical supports, said platform being adjustably mounted therein; a first base, said first base having said vertical supports mounted thereto; a second base, said second base having said first base adjustably connected thereto; a frame, said frame having said second base connected thereto, said frame further comprising: a pair of support brackets; a horizontal brace, said brace attached to said support brackets; and a guide sleeve, said sleeve attached to said brace; and a guide track, said frame slidably connected to said guide track.
Claim 10
Dependent Claim
38 words
A wafer cutting device as defined in claim 8 wherein a linear actuator motor having a screw thereon engages with said guide sleeve of said frame from the purpose of moving said crystal holder in a z-axis direction.
References Cited (Backward Citations)
US3128213A
Cited
US4096619A
Cited
US4193852A
Cited
US4409075A
Cited
US4646710A
Cited
US4574769A
Cited
US4655191A
Cited
US4920946A
Cited
US4903682A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-02-06 | 1998-08-08 | 1999-02-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-02-06 | 2002-08-08 | 2003-02-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-02-06 | 2006-08-08 | 2007-02-07 | $7700.00 | Window Closed / Lapsed |