← Back to Patent Explorer
US5384470A Expired / Lapsed US ⏱️ 0.0 years remaining

High temperature rectifying contact including polycrystalline diamond and method for making same

Assignee: Kobe Steel USA Inc
•
Filing: 1992-11-02
•
Granted: 1995-01-24
•
Expires: 2012-11-02
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A rectifying contact including a refractory metal carbide layer on a polycrystalline diamond layer provides high temperature operation and may be included in semiconductor devices, such as diodes and field effect transistors. The refractory metal carbide layer forms a substantially chemically non-reactive interface with the polycrystalline diamond. A single layer of substantially stoichiometric proportions of the refractory metal layer is provided in one embodiment of the rectifying contact. Another embodiment includes a second metal-rich refractory metal carbide layer on the stoichiometric layer. Yet another embodiment includes a carbon-rich refractory metal layer between the stoichiometric layer and the polycrystalline diamond layer. A metal field effect transistor including the rectifying contact may also be fabricated. A method for making the rectifying contact includes depositing a layer, or layers, of the refractory metal carbide on the polycrystalline diamond, as contrasted with a solid state reaction to form the refractory metal carbide. Another method includes depositing the polycrystalline diamond on a refractory metal carbide layer.

Inventors

  • 👤 Takeshi Tachibana
  • 👤 Dale G. Thompson, Jr.
  • 👤 Jeffrey T. Glass

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-28 20:06
CPC Classifications
H; H10; H10D; H10D62/00; H10D62/80; H10D62/83; H10D62/8303; H10D64/00; H10D64/60; H10D64/64

Claims Analysis

Total Claims: 29
Claim 1
Independent Claim 95 words
A semiconductor device comprising: a doped polycrystalline semiconducting diamond layer; and a refractory metal carbide layer on said polycrystalline semiconducting diamond layer and forming a rectifying contact therewith, said refractory metal carbide layer and said polycrystalline semiconducting diamond layer defining a substantially chemically nonreactive interface therebetween for reducing outdiffusion of carbon atoms from said polycrystalline semiconducting diamond layer to said refractory metal carbide layer to thereby reduce electrically active defects in said polycrystalline semiconducting diamond layer, said refractory metal carbide layer having a plurality of portions of different predetermined proportions of refractory metal and carbon.
Claim 2
Dependent Claim 95 words
A semiconductor device comprising: a doped polycrystalline semiconducting diamond layer; and a refractory metal carbide layer on said polycrystalline semiconducting diamond layer and forming a rectifying contact therewith, said refractory metal carbide layer and said polycrystalline semiconducting diamond layer defining a substantially chemically nonreactive interface therebetween for reducing outdiffusion of carbon atoms from said polycrystalline semiconducting diamond layer to said refractory metal carbide layer to thereby reduce electrically active defects in said polycrystalline semiconducting diamond layer, said refractory metal carbide layer having a plurality of portions of different predetermined proportions of refractory metal and carbon.
Claim 3
Dependent Claim 47 words
A semiconductor device according to claim 1, wherein one of said plurality of portions of said refractory metal carbide layer having substantially stoichiometric proportions of refractory metal and carbon so that a ratio of carbon to refractory metal is in a range of about 0.8 to 1.2.
Claim 4
Dependent Claim 32 words
A semiconductor device according to claim 1 wherein a refractory metal of said refractory metal carbide layer is selected from the group consisting of Group IV, V, and VI transition element metals.
Claim 5
Dependent Claim 31 words
A semiconductor device according to claim 1 wherein a refractory metal of said refractory metal carbide layer is selected from the group consisting of titanium, tantalum, tungsten, molybdenum, hafnium and niobium.
Claim 6
Dependent Claim 49 words
A semiconductor device according to claim 1 wherein said semiconductor device is a metal semiconductor field effect transistor; wherein said polycrystalline diamond layer includes a source region, a drain region, and a channel region; and wherein said refractory metal carbide layer defines a gate electrode overlying said channel region.
Claim 7
Dependent Claim 15 words
A semiconductor device according to claim 1 wherein said polycrystalline semiconducting diamond layer is p-type.
Claim 8
Dependent Claim 23 words
A semiconductor device according to claim 1 further comprising a nondiamond substrate on said polycrystalline diamond layer opposite said refractory metal carbide layer.
Claim 9
Dependent Claim 116 words
A semiconductor device comprising: a polycrystalline semiconducting diamond layer; a first refractory metal carbide layer on said polycrystalline diamond layer, said first refractory metal carbide layer having substantially stoichiometric proportions of refractory metal and carbon so that a ratio of carbon to refractory metal is in a range of about 0.8 to 1.2; and a second refractory metal carbide layer on said first refractory metal carbide layer, said second refractory metal carbide layer having proportions of refractory metal and carbon so that a ratio of carbon to refractory metal is less than about 0.8 defining a metal-rich layer; whereby said polycrystalline diamond layer and said first and second refractory carbide metal layers form a rectifying contact.
Claim 10
Dependent Claim 116 words
A semiconductor device comprising: a polycrystalline semiconducting diamond layer; a first refractory metal carbide layer on said polycrystalline diamond layer, said first refractory metal carbide layer having substantially stoichiometric proportions of refractory metal and carbon so that a ratio of carbon to refractory metal is in a range of about 0.8 to 1.2; and a second refractory metal carbide layer on said first refractory metal carbide layer, said second refractory metal carbide layer having proportions of refractory metal and carbon so that a ratio of carbon to refractory metal is less than about 0.8 defining a metal-rich layer; whereby said polycrystalline diamond layer and said first and second refractory carbide metal layers form a rectifying contact.
Claim 11
Dependent Claim 43 words
A semiconductor device according to claim 8 wherein said polycrystalline diamond layer and said first refractory metal carbide layer define a chemically non-reactive interface therebetween for reducing outdiffusion of carbon atoms from said polycrystalline diamond layer to said first refractory metal carbide layer.
Claim 12
Dependent Claim 22 words
A semiconductor device according to claim 8 wherein said first and second refractory metal carbide layers define a graded interface region therebetween.
Claim 13
Dependent Claim 21 words
A semiconductor device according to claim 8 wherein said first and second refractory metal carbide layers include a same refractory metal.
Claim 14
Dependent Claim 26 words
A semiconductor device according to claim 11 wherein said refractory metal is selected from the group consisting of Group IV, V, and VI transition element metals.
Claim 15
Dependent Claim 25 words
A semiconductor device according to claim 11 wherein said refractory metal is selected from the group consisting of titanium, tantalum, tungsten, molybdenum, hafnium and niobium.
Claim 16
Dependent Claim 52 words
A semiconductor device according to claim 8 wherein said semiconductor device is a metal semiconductor field effect transistor; wherein said polycrystalline diamond layer includes a source region, a drain region, and a channel region; and wherein said first and second refractory metal carbide layers define a gate electrode overlying said channel region.
Claim 17
Dependent Claim 15 words
A semiconductor device according to claim 8 wherein said polycrystalline semiconducting diamond layer is p-type.
Claim 18
Dependent Claim 24 words
A semiconductor device according to claim 8 further comprising a nondiamond substrate on said polycrystalline diamond layer opposite said first refractory metal carbide layer.
Claim 19
Dependent Claim 160 words
A semiconductor device comprising: a polycrystalline semiconducting diamond layer; a first refractory metal carbide layer on said diamond layer, said first refractory metal carbide layer having proportions of refractory metal and carbon so that a ratio of carbon to refractory metal is greater than about 1.2 defining a carbon-rich layer; a second refractory metal carbide layer on said first refractory metal carbide layer, said second refractory metal carbide layer having substantially stoichiometric proportions of refractory metal and carbon so that a ratio of carbon to refractory metal is in a range of about 0.8 to 1.2; and a third refractory metal carbide layer on said second refractory metal carbide layer, said third refractory metal carbide layer having proportions of refractory metal and carbon so that a ratio of carbon to refractory metal is less than about 0.8 defining a metal-rich layer; whereby said polycrystalline diamond layer and said first, second, and third refractory metal carbide layers form a rectifying contact.
Claim 20
Dependent Claim 160 words
A semiconductor device comprising: a polycrystalline semiconducting diamond layer; a first refractory metal carbide layer on said diamond layer, said first refractory metal carbide layer having proportions of refractory metal and carbon so that a ratio of carbon to refractory metal is greater than about 1.2 defining a carbon-rich layer; a second refractory metal carbide layer on said first refractory metal carbide layer, said second refractory metal carbide layer having substantially stoichiometric proportions of refractory metal and carbon so that a ratio of carbon to refractory metal is in a range of about 0.8 to 1.2; and a third refractory metal carbide layer on said second refractory metal carbide layer, said third refractory metal carbide layer having proportions of refractory metal and carbon so that a ratio of carbon to refractory metal is less than about 0.8 defining a metal-rich layer; whereby said polycrystalline diamond layer and said first, second, and third refractory metal carbide layers form a rectifying contact.
Claim 21
Dependent Claim 43 words
A semiconductor device according to claim 17 wherein said polycrystalline diamond layer and said first refractory metal carbide layer define a chemically non-reactive interface therebetween for reducing outdiffusion of carbon atoms from said polycrystalline diamond layer to said first refractory metal carbide layer.
Claim 22
Dependent Claim 23 words
A semiconductor device according to claim 17 wherein said first and second refractory metal carbide layers define a first graded interface region therebetween.
Claim 23
Dependent Claim 23 words
A semiconductor device according to claim 19 wherein said second and third refractory metal carbide layers define a second graded interface region therebetween.
Claim 24
Dependent Claim 22 words
A semiconductor device according to claim 17 wherein said first, second, and third refractory metal carbide layers include a same refractory metal.
Claim 25
Dependent Claim 26 words
A semiconductor device according to claim 21 wherein said refractory metal is selected from the group consisting of Group IV, V, and VI transition element metals.
Claim 26
Dependent Claim 25 words
A semiconductor device according to claim 21 wherein said refractory metal is selected from the group consisting of titanium, tantalum, tungsten, molybdenum, hafnium and niobium.
Claim 27
Dependent Claim 53 words
A semiconductor device according to claim 17 wherein said semiconductor device is a metal semiconductor field effect transistor; wherein said polycrystalline diamond layer includes a source region, a drain region, and a channel region; and wherein said first, second and third refractory metal carbide layers define a gate electrode overlying said channel region.
Claim 28
Dependent Claim 15 words
A semiconductor device according to claim 17 wherein said polycrystalline semiconducting diamond layer is p-type.
Claim 29
Dependent Claim 24 words
A semiconductor device according to claim 17 further comprising a nondiamond substrate on said polycrystalline diamond layer opposite said first refractory metal carbide layer.

References Cited (Backward Citations)

US4982243A Cited
JPH02223437A Cited
EP0417645A1 Cited
US5087322A Cited
JPH04196489A Cited
US5155559A Cited
US5294814A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1998-01-23 1998-07-25 1999-01-24 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2002-01-23 2002-07-25 2003-01-24 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2006-01-23 2006-07-25 2007-01-24 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag