US5376756A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wire support and guide
Assignee: Philips Semiconductors Inc
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Filing: 1991-12-20
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Granted: 1994-12-27
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Expires: 2011-12-20
Abstract
Abstract Single, continuous bonding wires for an integrated-circuit die are supported in mid-span by a support ring which is snap-fit or adhesively bonded to a die-attach paddle of a leadframe. The support member includes a groove formed in its distal end for receiving an adhesive material, if necessary, for securing the bonding wires in position to prevent wire-wash and electrically shorting of the bonding wires when a plastic molding compound is formed around the die and leadframe. Alternatively the bonding wires are contained within notches formed in the distal end of the support ring. A lid placed over the support ring provides an enclosure for the integrated-circuit die. Stacking of support rings on each other and concentric support rings provide various optional arrangements for supporting bonding wires.
Inventors
- 👤 Young I. Kwon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:21
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/464; H10W72/00; H10W72/071; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/581; H10W72/59; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
94 words
An assembly for supporting bonding wires in a molded-plastic package for an integrated-circuit comprising: an integrated circuit die centrally attached to a die-attach paddle portion of a leadframe, said leadframe having a plurality of inwardly-extending bonding fingers peripherally surrounding said die-attach paddle portion of said leadframe, support means for supporting the approximate midportion of each of a plurality of single, continuous bonding wires extending from said integrated-circuit die to said inwardly-extending bonding fingers of said leadframe, and resilient attachment means for snap-fit attaching said support means to said die-attach paddle of said lead frame.
Claim 2
Dependent Claim
94 words
An assembly for supporting bonding wires in a molded-plastic package for an integrated-circuit comprising: an integrated circuit die centrally attached to a die-attach paddle portion of a leadframe, said leadframe having a plurality of inwardly-extending bonding fingers peripherally surrounding said die-attach paddle portion of said leadframe, support means for supporting the approximate midportion of each of a plurality of single, continuous bonding wires extending from said integrated-circuit die to said inwardly-extending bonding fingers of said leadframe, and resilient attachment means for snap-fit attaching said support means to said die-attach paddle of said lead frame.
Claim 3
Dependent Claim
118 words
An assembly for supporting bonding wires in a molded-plastic package for an integrated-circuit comprising: an integrated circuit die centrally attached to a die-attach paddle portion of a leadframe, said leadframe having a plurality of inwardly-extending bonding fingers peripherally surrounding said die-attach paddle portion of said leadframe, support means for supporting the approximate midportion of each of a plurality of single, continuous bonding wires extending from said integrated-circuit die to said inwardly-extending bonding fingers of said leadframe, and resilient attachment means for snap-fit attaching said support means to said die-attach paddle of said lead frame, said resilient attachment means having at least one resilient member which engages at least one edge of said die-attach paddle portion of said leadframe.
Claim 4
Dependent Claim
118 words
An assembly for supporting bonding wires in a molded-plastic package for an integrated-circuit comprising: an integrated circuit die centrally attached to a die-attach paddle portion of a leadframe, said leadframe having a plurality of inwardly-extending bonding fingers peripherally surrounding said die-attach paddle portion of said leadframe, support means for supporting the approximate midportion of each of a plurality of single, continuous bonding wires extending from said integrated-circuit die to said inwardly-extending bonding fingers of said leadframe, and resilient attachment means for snap-fit attaching said support means to said die-attach paddle of said lead frame, said resilient attachment means having at least one resilient member which engages at least one edge of said die-attach paddle portion of said leadframe.
Claim 5
Independent Claim
105 words
A method of supporting bonding wires in a molded-plastic integrated-circuit package comprising the steps of: centrally attaching an integrated circuit die to a die-attach paddle portion of a leadframe, said leadframe formed having a plurality of inwardly-extending bonding fingers peripherally surrounding said die-attach paddle portion of said leadframe, snap-fit attaching the base end of a support member, having a base and a distal end, to said die-attach paddle of said leadframe, supporting a plurality of bonding wires extending from a plurality of respective bonding pads on said integrated-circuit die to said inwardly-extending bonding fingers of said leadframe with said distal end of said support member.
Claim 6
Independent Claim
105 words
A method of supporting bonding wires in a molded-plastic integrated-circuit package comprising the steps of: centrally attaching an integrated circuit die to a die-attach paddle portion of a leadframe, said leadframe formed having a plurality of inwardly-extending bonding fingers peripherally surrounding said die-attach paddle portion of said leadframe, snap-fit attaching the base end of a support member, having a base and a distal end, to said die-attach paddle of said leadframe, supporting a plurality of bonding wires extending from a plurality of respective bonding pads on said integrated-circuit die to said inwardly-extending bonding fingers of said leadframe with said distal end of said support member.
Claim 7
Dependent Claim
115 words
An assembly for supporting bonding wires in a molded-plastic package for an integrated-circuit comprising: an integrated circuit die centrally attached to a die-attach paddle portion of a leadframe, said leadframe having a plurality of inwardly-extending bonding fingers peripherally surrounding said die-attach paddle portion of said leadframe, support means for supporting the approximate midportion of each of a plurality of single, continuous bonding wires extending from said integrated-circuit die to said inwardly-extending bonding fingers of said leadframe, attachment means for attaching said support means to die-attach paddle portion of said leadframe, and a lid member coupled to said support member and disposed over said integrated-circuit die such that said integrated-circuit die is covered by said lid.
Claim 8
Dependent Claim
115 words
An assembly for supporting bonding wires in a molded-plastic package for an integrated-circuit comprising: an integrated circuit die centrally attached to a die-attach paddle portion of a leadframe, said leadframe having a plurality of inwardly-extending bonding fingers peripherally surrounding said die-attach paddle portion of said leadframe, support means for supporting the approximate midportion of each of a plurality of single, continuous bonding wires extending from said integrated-circuit die to said inwardly-extending bonding fingers of said leadframe, attachment means for attaching said support means to die-attach paddle portion of said leadframe, and a lid member coupled to said support member and disposed over said integrated-circuit die such that said integrated-circuit die is covered by said lid.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-12-26 | 1998-06-27 | 1998-12-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-12-26 | 2002-06-27 | 2002-12-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-12-26 | 2006-06-27 | 2006-12-27 | $7700.00 | Window Closed / Lapsed |