US5374829A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Vacuum chuck
Assignee: Canon Inc
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Filing: 1994-04-25
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Granted: 1994-12-20
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Expires: 2014-04-25
Abstract
Abstract A wafer holding device of the vacuum attraction type includes a structural member having a protrusion for supporting a wafer and elastic members made of a material having an elasticity modulus smaller than that of the wafer and that of the structural member. The elastic members are distributed on a wafer attraction plane of the structural member.
Inventors
- 👤 Eiji Sakamoto
- 👤 Ryuichi Ebinuma
- 👤 Shinichi Hara
- 👤 Mitsuji Marumo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 09:03
CPC Classifications
C; C30; C30B; C30B31/00; C30B31/06; C30B31/14; C30B25/00; C30B25/02; C30B25/12; H; H10; H10P; H10P72/00; H10P72/70; H10P72/78; Y; Y10; Y10T; Y10T279/00; Y10T279/11
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
89 words
A wafer holding device, comprising: a structural member defining a wafer attraction plane and having protrusions for supporting a wafer to be exposed; and elastic members provided in associated with said protrusions and being made of a material having an elasticity modulus smaller than that of the wafer and that of said protrusions, said elastic members being distributed within an exposure field of the wafer attraction plane of said structural member, wherein the wafer attracted to said attraction plane is urged toward said protrusions to provide a flat wafer.
Claim 2
Dependent Claim
89 words
A wafer holding device, comprising: a structural member defining a wafer attraction plane and having protrusions for supporting a wafer to be exposed; and elastic members provided in associated with said protrusions and being made of a material having an elasticity modulus smaller than that of the wafer and that of said protrusions, said elastic members being distributed within an exposure field of the wafer attraction plane of said structural member, wherein the wafer attracted to said attraction plane is urged toward said protrusions to provide a flat wafer.
Claim 3
Dependent Claim
24 words
A device according to claim 1, wherein when the wafer is not attracted to said structural member, each elastic member projects beyond said protrusions.
Claim 4
Dependent Claim
24 words
A device according to claim 1, wherein said protrusions include a plurality of pins, and wherein each elastic member surrounds one of said pins.
Claim 5
Dependent Claim
21 words
A device according to claim 1, wherein said protrusions and said elastic members are disposed symmetrically on the wafer attraction plane.
Claim 6
Independent Claim
138 words
A method of manufacturing semiconductor devices, comprising the steps of: preparing a wafer holding device for holding a wafer to be exposed through vacuum attraction, the holding device including a structural member defining a wafer attraction plane and having protrusions, and elastic members distributed within an exposure field of the wafer attraction plane of the holding device, wherein each elastic member is made of a material having an elasticity modulus smaller than that of the protrusions; placing the wafer on the wafer holding device so that it is held by the wafer holding device; urging the wafer toward the protrusions in the wafer attraction plane to provide a flat wafer; and applying an exposure energy to the wafer held by the wafer holding device so that a pattern for manufacturing a semiconductor device is transferred to the wafer.
Claim 7
Independent Claim
138 words
A method of manufacturing semiconductor devices, comprising the steps of: preparing a wafer holding device for holding a wafer to be exposed through vacuum attraction, the holding device including a structural member defining a wafer attraction plane and having protrusions, and elastic members distributed within an exposure field of the wafer attraction plane of the holding device, wherein each elastic member is made of a material having an elasticity modulus smaller than that of the protrusions; placing the wafer on the wafer holding device so that it is held by the wafer holding device; urging the wafer toward the protrusions in the wafer attraction plane to provide a flat wafer; and applying an exposure energy to the wafer held by the wafer holding device so that a pattern for manufacturing a semiconductor device is transferred to the wafer.
Claim 8
Dependent Claim
25 words
A method according to claim 5, wherein when the wafer is not attracted to the wafer holding device, the elastic member projects beyond the protrusions.
Claim 9
Dependent Claim
24 words
A method according to claim 5, further comprising placing a mask, having the pattern, with a proximity gap interposed between it and a wafer.
Claim 10
Dependent Claim
98 words
A wafer holding device for chucking a wafer through vacuum attraction, said device comprising: a structural member having protrusions for supporting the wafer; and elastic members made of a material having an elasticity modulus smaller than that of the wafer and that of said protrusions, at least one of said elastic members being disposed within a field of said structural member corresponding to an exposure field of the wafer, wherein the wafer held through the vacuum attraction and supported by said protrusions causes deformation of said elastic members and is itself urged toward said protrusions to become flatter.
Claim 11
Dependent Claim
98 words
A wafer holding device for chucking a wafer through vacuum attraction, said device comprising: a structural member having protrusions for supporting the wafer; and elastic members made of a material having an elasticity modulus smaller than that of the wafer and that of said protrusions, at least one of said elastic members being disposed within a field of said structural member corresponding to an exposure field of the wafer, wherein the wafer held through the vacuum attraction and supported by said protrusions causes deformation of said elastic members and is itself urged toward said protrusions to become flatter.
Claim 12
Dependent Claim
93 words
A wafer holding device for chucking a wafer through vacuum attractions, said device comprising: a structural member having an outer circumferential wall and protrusions for supporting the wafer, said protrusions being distributed inside said outer circumferential wall; and elastic members made of a material having an elasticity modulus smaller than that of the wafer and that of said protrusions, said elastic members being distributed inside said outer circumferential wall, wherein the wafer held through the vacuum attraction and supported by said outer circumferential wall and said protrusions causes deformation of said elastic members.
Claim 13
Dependent Claim
93 words
A wafer holding device for chucking a wafer through vacuum attractions, said device comprising: a structural member having an outer circumferential wall and protrusions for supporting the wafer, said protrusions being distributed inside said outer circumferential wall; and elastic members made of a material having an elasticity modulus smaller than that of the wafer and that of said protrusions, said elastic members being distributed inside said outer circumferential wall, wherein the wafer held through the vacuum attraction and supported by said outer circumferential wall and said protrusions causes deformation of said elastic members.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-12-19 | 1998-06-20 | 1998-12-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-12-19 | 2002-06-20 | 2002-12-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-12-19 | 2006-06-20 | 2006-12-20 | $7700.00 | Window Closed / Lapsed |