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EP0323902A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Apparatus for thermal transfer with a semiconductor wafer in vacuum

Assignee: Varian Semiconductor Equipment Associates Inc
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Filing: 1989-01-05
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Granted: —
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Expires: 2009-01-05
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Abstract

Abstract Thermal transfer between a semiconductor wafer and a platen during vacuum processing is provided through a soft, thermally-conductive polymer layer having a thin, hard surface film. The soft polymer layer, which is preferably silicone rubber containing thermally-conductive particles, conforms to surface irregularities on the wafer and has low thermal resistance. The surface film is preferably silicon dioxide in the form of a multiplicity of flat plates integrally formed on the silicone rubber. Adherence of the wafer and of foreign matter to the polymer layer is prevented by the surface film. In addition, the underlying polymer layer is protected by the surface film. A high purity polymer layer is fabricated by evacuating the mold cavity and the resin container prior to injection of resin. The mold for the polymer layer utilizes a hard, smooth mold release surface and a resilient gasket between the platen and the mold release surface. The gasket establishes the dimensions of the polymer layer and seals the mold cavity. The surface film is formed by oxygen plasma treatment of the silicone rubber layer.

Inventors

  • 👤 Eric Loring Mears

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-10-31 16:47
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0431; H10P72/0432; C; C23; C23C; C23C14/00; C23C14/22; C23C14/50; C30; C30B; C30B25/00; C30B25/02; C30B25/10; C30B31/00; C30B31/06; C30B31/12; C30B31/20; C30B31/22; H10P72/0402; H10P72/0418; H10P72/0421; H10P72/0451; H10P72/0468; H10P72/0471; H10P72/70; H10P72/76; H10P72/7604; H10P72/7618; H10P72/7621

Claims Analysis

Total Claims: 13
Claim 1
Independent Claim 69 words
Apparatus for effecting thermal transfer with a workpiece in vacuum, comprising: a thermally-conductive member including a heat transfer surface; a first resilient, thermally-conductive layer, affexed to said heat transfer surface for conforming to the shape of a surface of said workpiece; and a second thermally-conductive layer, thin relative to said first layer, affixed to said first layer and having a smooth surface for contacting said workpiece without adhering thereto.
Claim 2
Dependent Claim 69 words
Apparatus for effecting thermal transfer with a workpiece in vacuum, comprising: a thermally-conductive member including a heat transfer surface; a first resilient, thermally-conductive layer, affexed to said heat transfer surface for conforming to the shape of a surface of said workpiece; and a second thermally-conductive layer, thin relative to said first layer, affixed to said first layer and having a smooth surface for contacting said workpiece without adhering thereto.
Claim 3
Dependent Claim 23 words
Apparatus as claimed in claim 1 further including means for pressing said workpiece firmly into contact with smooth surface of said second layer.
Claim 4
Dependent Claim 31 words
Apparatus as claimed in claim 2 wherein said pressing means comprises centrifugal means for pressing said workpiece against said second layer without physical contact to the front surface of said workpiece.
Claim 5
Dependent Claim 23 words
Apparatus as claimed in any one of claims 1 to 3 wherein said first layer comprises silicone ruhber having thermally-conductive particles dispersed therein.
Claim 6
Dependent Claim 19 words
Apparatus as claimed in claim 4 wherein said first layer has a durometer value less than 20 Shore A.
Claim 7
Dependent Claim 21 words
Apparatus as claimed in claim 4 or claim 5 wherein said second layer is hard relative to said silicone rubber layer.
Claim 8
Dependent Claim 20 words
Apparatus as claimed in any one of claims 1 to 6 wherein said second layer comprises a quartz surface film.
Claim 9
Independent Claim 61 words
A method for effecting thermal transfer with workpiece in vacuum, comprising the steps of providing a thermally-conductive platen including a heat transfer surface affixing a soft, thermally-conductive polymer layer to the heat transfer surface forming on said ploymer layer a thin surface film for contacting said workpiece without adhering thereto and pressing the workpiece firmly into contact with the surface film.
Claim 10
Independent Claim 61 words
A method for effecting thermal transfer with workpiece in vacuum, comprising the steps of providing a thermally-conductive platen including a heat transfer surface affixing a soft, thermally-conductive polymer layer to the heat transfer surface forming on said ploymer layer a thin surface film for contacting said workpiece without adhering thereto and pressing the workpiece firmly into contact with the surface film.
Claim 11
Independent Claim 45 words
A method of treating a thermally-conductive polymer layer used for thermal transfer with a semiconductor wafer to prevent adherence of the wafer to the polymer layer, comprising forming a thin surface film on said polymer layer, said surface film being harder than said polymer layer.
Claim 12
Independent Claim 45 words
A method of treating a thermally-conductive polymer layer used for thermal transfer with a semiconductor wafer to prevent adherence of the wafer to the polymer layer, comprising forming a thin surface film on said polymer layer, said surface film being harder than said polymer layer.
Claim 13
Dependent Claim 21 words
A method as defined in claim 9 further including the step of fracturing the surface film into a plurality of plates.

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