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US5374568A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for forming a base link in a bipolar transistor

Assignee: Motorola Solutions Inc
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Filing: 1993-09-23
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Granted: 1994-12-20
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Expires: 2013-09-23
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Abstract

Abstract A method for forming an improved base link for a bipolar transistor is provided. The wall where the base link (44) is formed is substantially vertical (32,34). An oxide mask (24) is use during etching of the polysilicon layer (18) that provides the wall, instead of a conventional photoresist mask. The preferred method is compatible with manufacturing BiCMOS devices.

Inventors

  • 👤 Wen-Ling M. Huang
  • 👤 Shrinath Ramaswami
  • 👤 Maureen F. Grimaldi

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-07 14:18
CPC Classifications
H; H10; H10D; H10D10/00; H10D10/01; H10D10/041; H10D10/311; H10D62/00; H10D62/10; H10D62/17; H10D62/177; H10D62/184; H10D84/00; H10D84/01; H10D84/0107; H10D84/0109; H10D84/02; H10D84/03; H10D84/038; Y; Y10; Y10S; Y10S148/00; Y10S148/01

Claims Analysis

Total Claims: 13
Claim 1
Independent Claim 113 words
A method for forming a base link in a bipolar transistor comprising the steps of: providing a semiconductor structure comprising an active layer, a first oxide layer above the active layer and a polysilicon layer above the first oxide layer; forming a second oxide layer above the polysilicon layer; forming a mask over a portion of the second oxide layer to provide an unprotected portion of the second oxide layer; etching the unprotected portion of the second oxide layer; removing the mask; etching the polysilicon layer using the second oxide layer as a mask; etching the second oxide layer and the first oxide layer simultaneously; and forming a base link contacting active layer.
Claim 2
Independent Claim 113 words
A method for forming a base link in a bipolar transistor comprising the steps of: providing a semiconductor structure comprising an active layer, a first oxide layer above the active layer and a polysilicon layer above the first oxide layer; forming a second oxide layer above the polysilicon layer; forming a mask over a portion of the second oxide layer to provide an unprotected portion of the second oxide layer; etching the unprotected portion of the second oxide layer; removing the mask; etching the polysilicon layer using the second oxide layer as a mask; etching the second oxide layer and the first oxide layer simultaneously; and forming a base link contacting active layer.
Claim 3
Dependent Claim 20 words
The method of claim 1, wherein the step of etching the polysilicon layer comprises detecting disappearance of the polysilicon layer.
Claim 4
Dependent Claim 23 words
The method of claim 1, further comprising the step of forming a nitride layer between the polysilicon layer add the second oxide layer.
Claim 5
Dependent Claim 27 words
The method of claim 3, wherein the step of etching the second oxide layer and the first oxide layer simultaneously comprises detecting appearance of the nitride layer.
Claim 6
Dependent Claim 93 words
The method of claim 3, wherein the step of forming the second oxide layer comprises forming the second oxide layer thinner than the first oxide layer such that the first oxide layer is thicker than the second oxide layer by a known percentage, and wherein the step of etching the second oxide layer and the first oxide layer simultaneously comprises detecting appearance of the nitride layer to establish a second oxide layer etch time, and continuing to etch the first oxide layer by the known percentage of the second oxide layer etch time.
Claim 7
Dependent Claim 26 words
The method of claim 3, wherein the step of forming the base link comprises etching a polysilicon layer and detecting the appearance of the nitride layer.
Claim 8
Dependent Claim 20 words
The method of claim 1, wherein the step of forming the second oxide layer comprises forming a layer of TEOS.
Claim 9
Independent Claim 126 words
A method for forming a base link in a bipolar transistor comprising the steps of: providing a semiconductor structure comprising a first oxide layer overlying a protective layer overlying a polysilicon layer overlying a second oxide layer overlying an active layer, wherein the second oxide layer is a known percentage thicker than the first oxide layer; etching the polysilicon layer using the first oxide layer as a mask; etching the second oxide layer and the first oxide layer simultaneously; determining a first oxide layer etch time by detecting appearance of the protective layer; further etching the second oxide layer for an amount of time which is the known percentage of the first oxide layer etch time; and forming a polysilicon base link contacting the active layer.
Claim 10
Independent Claim 126 words
A method for forming a base link in a bipolar transistor comprising the steps of: providing a semiconductor structure comprising a first oxide layer overlying a protective layer overlying a polysilicon layer overlying a second oxide layer overlying an active layer, wherein the second oxide layer is a known percentage thicker than the first oxide layer; etching the polysilicon layer using the first oxide layer as a mask; etching the second oxide layer and the first oxide layer simultaneously; determining a first oxide layer etch time by detecting appearance of the protective layer; further etching the second oxide layer for an amount of time which is the known percentage of the first oxide layer etch time; and forming a polysilicon base link contacting the active layer.
Claim 11
Dependent Claim 31 words
The method of claim 8, wherein the step of etching the polysilicon layer comprises producing a polysilicon layer edge angle of greater than 80° but less than or equal to 90°.
Claim 12
Dependent Claim 39 words
The method of claim 8, wherein the step of etching the second oxide layer and the first oxide layer simultaneously comprises providing a second oxide layer edge angle of greater than 75° but less than or equal to 90°.
Claim 13
Dependent Claim 20 words
The method of claim 8, wherein the step of etching the polysilicon layer comprises detecting disappearance of the polysilicon layer.

References Cited (Backward Citations)

US4892837A Cited
US5204276A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-12-19 1998-06-20 1998-12-20 $2000.00 Window Closed / Lapsed
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