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US5372901A
Expired / Lapsed
US
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Removable bandpass filter for microlithographic aligners
Assignee: Micron Technology Inc
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Filing: 1992-08-05
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Granted: 1994-12-13
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Expires: 2012-08-05
Abstract
Abstract A removable bandpass filter layer (22), which is preferably part of a pattern transfer tool (10), improves the resolution of a semiconductor wafer aligner that uses a relatively broad bandwidth radiation source. A narrower bandwidth filter layer provides more complete destructive interference of undesirable diffraction patterns when it is used with a phase-shift pattern transfer tool and removes radiation of longer wavelengths to improve resolution when it is used with a nonphase-shift pattern transfer tool. Using a removable bandpass filter layer, rather than permanently installing a narrow bandpass filter in the aligner, does not affect the speed of patterning layers that do not require the enhanced resolution. The same aligner can thus be used for either high resolution or high throughput without substantial modification to the aligner.
Inventors
- 👤 J. Brett Rolfson
- 👤 David A. Cathey
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:48
CPC Classifications
G; G03; G03F; G03F1/00; G03F1/26; G03F7/00; G03F7/70; G03F7/70483; G03F7/7055; G03F7/70575
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
108 words
A pattern transfer tool for use with a microlithographic aligner system to selectively improve its resolution for the fabrication of semiconductor wafers, the aligner system including a fixed first bandpass radiation filter, the pattern transfer tool comprising: a transparent supporting substrate; and a second bandpass radiation filter layer positioned in optical series with the first bandpass radiation filter, the second bandpass filter being removable from the microlithographic aligner system and having a pass band overlapping that of the first bandpass radiation filter to selectively limit wavelengths of exposing radiation received from the fixed first bandpass filter and transmitted through the pattern transfer tool when improved resolution is desired.
Claim 2
Dependent Claim
108 words
A pattern transfer tool for use with a microlithographic aligner system to selectively improve its resolution for the fabrication of semiconductor wafers, the aligner system including a fixed first bandpass radiation filter, the pattern transfer tool comprising: a transparent supporting substrate; and a second bandpass radiation filter layer positioned in optical series with the first bandpass radiation filter, the second bandpass filter being removable from the microlithographic aligner system and having a pass band overlapping that of the first bandpass radiation filter to selectively limit wavelengths of exposing radiation received from the fixed first bandpass filter and transmitted through the pattern transfer tool when improved resolution is desired.
Claim 3
Dependent Claim
20 words
The pattern transfer tool of claim 1 in which the second bandpass radiation filter layer is supported by the substrate.
Claim 4
Dependent Claim
20 words
The pattern transfer tool of claim 1 in which the second bandpass radiation filter layer includes a compound of fluorine.
Claim 5
Dependent Claim
20 words
The pattern transfer tool of claim 1 in which the second bandpass radiation filter layer includes a compound of oxygen.
Claim 6
Dependent Claim
34 words
The pattern transfer tool of claim 1 in which the material comprising the second bandpass radiation filter layer is selected from the group consisting of magnesium fluoride, aluminum oxides, silicon oxides, and selenium oxides.
Claim 7
Dependent Claim
16 words
The pattern transfer tool of claim 1, further comprising an opaque layer supported by the substrate.
Claim 8
Dependent Claim
16 words
The pattern transfer tool of claim 1, further comprising a phase-shifting layer supported by the substrate.
Claim 9
Dependent Claim
15 words
The pattern transfer tool of claim 7 in which the phase-shifting layer includes an oxide.
Claim 10
Dependent Claim
15 words
The pattern transfer tool of claim 7 in which the phase-shifting layer includes a nitride.
Claim 11
Dependent Claim
30 words
The pattern transfer tool of claim 7 in which the material comprising the phase-shifting layer is selected from the group consisting of silicon nitride, indium oxide, and indium tin oxide.
Claim 12
Independent Claim
133 words
A method for selectively changing the resolution of a microlithographic aligner system using an exposing radiation source providing a relatively broad bandwidth of exposing radiation, comprising: providing a microlithographic aligner including a fixed first bandpass radiation filter decreasing the bandwidth of the exposing radiation from that of the radiation source; and selectively positioning within the microlithographic aligner in optical series with the first bandpass filter a removable, second bandpass filter having a pass band that overlaps that of the first bandpass filter to selectively further decrease the bandwidth of the exposing radiation received from the fixed first bandpass filter, thereby allowing the aligner to be operable as a high resolution aligner with the bandpass filter in place or a high throughput aligner with the bandpass filter removed without substantial modification to the aligner.
Claim 13
Independent Claim
133 words
A method for selectively changing the resolution of a microlithographic aligner system using an exposing radiation source providing a relatively broad bandwidth of exposing radiation, comprising: providing a microlithographic aligner including a fixed first bandpass radiation filter decreasing the bandwidth of the exposing radiation from that of the radiation source; and selectively positioning within the microlithographic aligner in optical series with the first bandpass filter a removable, second bandpass filter having a pass band that overlaps that of the first bandpass filter to selectively further decrease the bandwidth of the exposing radiation received from the fixed first bandpass filter, thereby allowing the aligner to be operable as a high resolution aligner with the bandpass filter in place or a high throughput aligner with the bandpass filter removed without substantial modification to the aligner.
Claim 14
Dependent Claim
19 words
The method of claim 11 in which the second bandpass filter is positioned adjacent to a pattern transfer tool.
Claim 15
Dependent Claim
18 words
The method of claim 11 in which the second bandpass filter is deposited onto a pattern transfer tool.
Claim 16
Independent Claim
53 words
A method for improving the resolution of a semiconductor wafer microlithographic aligner that includes a radiation source emitting a relatively broad bandwidth of exposing radiation and a pattern transfer tool, comprising: reducing the bandwidth of the exposing radiation as it passes through the pattern transfer tool, thereby improving the pattern on the wafer.
Claim 17
Independent Claim
53 words
A method for improving the resolution of a semiconductor wafer microlithographic aligner that includes a radiation source emitting a relatively broad bandwidth of exposing radiation and a pattern transfer tool, comprising: reducing the bandwidth of the exposing radiation as it passes through the pattern transfer tool, thereby improving the pattern on the wafer.
Claim 18
Dependent Claim
24 words
The method of claim 14 in which reducing the bandwidth includes absorbing at the pattern transfer tool exposing radiation outside of the desired bandwidth.
Claim 19
Dependent Claim
35 words
The method of claim 14, further comprising shifting the phase of a first portion of exposing radiation passing through the pattern transfer tool relative to a second portion of exposing radiation passing through the tool.
Claim 20
Dependent Claim
23 words
The method of claim 14 in which reducing the bandwidth of the exposing radiation includes reducing the maximum wavelength of the exposing radiation.
Claim 21
Dependent Claim
25 words
The method of claim 14 in which reducing the bandwidth of the exposing radiation includes shifting the center of the bandwidth to a shorter wavelength.
Claim 22
Dependent Claim
102 words
A microlithographic aligner system having selectively improved resolution for the fabrication of semiconductor wafers, comprising: a radiation source providing exposing radiation having a relatively broad bandwidth; a first bandpass radiation filter for reducing the bandwidth of the exposing radiation produced by the radiation source; and a second, removable bandpass radiation filter receiving radiation from the first bandpass filter and further reducing the bandwidth of the exposing radiation, thereby allowing the aligner to be operable as a high resolution aligner with the second bandpass filter in place or a high throughput aligner with the bandpass filter removed without substantial modification to the aligner.
Claim 23
Dependent Claim
102 words
A microlithographic aligner system having selectively improved resolution for the fabrication of semiconductor wafers, comprising: a radiation source providing exposing radiation having a relatively broad bandwidth; a first bandpass radiation filter for reducing the bandwidth of the exposing radiation produced by the radiation source; and a second, removable bandpass radiation filter receiving radiation from the first bandpass filter and further reducing the bandwidth of the exposing radiation, thereby allowing the aligner to be operable as a high resolution aligner with the second bandpass filter in place or a high throughput aligner with the bandpass filter removed without substantial modification to the aligner.
Claim 24
Dependent Claim
48 words
A pattern transfer tool for use with a microlithographic aligner system to selectively improve its resolution for the fabrication of semiconductor wafers, comprising: a transparent supporting substrate; and a bandpass filter layer positioned on the substrate and reducing the bandwidth of radiation passing through the pattern transfer tool.
Claim 25
Dependent Claim
48 words
A pattern transfer tool for use with a microlithographic aligner system to selectively improve its resolution for the fabrication of semiconductor wafers, comprising: a transparent supporting substrate; and a bandpass filter layer positioned on the substrate and reducing the bandwidth of radiation passing through the pattern transfer tool.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-12-12 | 1998-06-13 | 1998-12-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-12-12 | 2002-06-13 | 2002-12-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-12-12 | 2006-06-13 | 2006-12-13 | $7700.00 | Window Closed / Lapsed |