Flexible copper/polyimide and barbituric acid modified bismaleimide blend/polyimide laminate
Abstract
Abstract An improved polyimide-based coating composition comprising a polyimide upper layer and a polyimide-modified bismaleimide lower layer for use as a coating on metal substrate, such as an electrolytic copper foil. The polyimide are prepared from reactions between diamines, such as p-phenylene diamine and 4-4'-diaminodiphenyl ether, and dianhydrides, such as 3,3',4,4'-benzophenone tetracarboxylic dianhydride and biphenyl-3,3',4,4'-tetracarboxylic dianhydride. The modified bismaleimide can be prepared from reacting an N,N',4,4'-diphenyl bismaleimide with a barbituric acid or its derivative. A double-layered extrusion coating technique having a double-layered extrusion die is utilized to apply the coating composition onto the metal substrate. The final laminated products show improved peel strength between the polyimide coating and the substrate, as well as improved dimensional stability and surface flatness thereof.
Inventors
- 👤 Tsai-An Yu
- 👤 Jing-Pin Pan
- 👤 Han-Lung Chen
- 👤 Jinn-Shing King
- 👤 Tsung-Hsiung Wang
Bibliographic Details
Claims Analysis
Total Claims: 9References Cited (Backward Citations)
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