US5371403A
Expired / Lapsed
US
⏱️ 0.0 years remaining
High performance package using high dielectric constant materials for power/ground and low dielectric constant materials for signal lines
Assignee: Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Filing: 1993-09-24
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Granted: 1994-12-06
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Expires: 2013-09-24
Abstract
Abstract A multi-layer package for semiconductor dies using two different types of dielectric materials improves the performance of a semiconductor package. The first material having a high dielectric constant is placed between the power and ground planes to form a decoupling capacitor and the second material having a low dielectric constant is used to contact the signal traces. Silicon carbide is preferred for the high dielectric constant material.
Inventors
- 👤 Chin-Ching Huang
- 👤 Elizabeth C. Galindo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 08:36
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/692; H10W44/00; H10W44/601; H10W70/68; H10W70/682; H10W70/685; H10W90/00; H10W90/701; H10W90/731; H10W90/737; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
119 words
A multi-layer package with leads or pads comprising: conductive planes including a power plane electrically connected to a power lead or pad of the package and a ground plane electrically connected to a ground lead or pad of the package; signal traces electrically connected to signal leads or pads of the package; a first material arranged between and contacting the power plane and the ground plane, said first material having a dielectric constant greater than twenty; and a second material supporting said signal traces, said second material having a dielectric constant less than twenty wherein the first material has a higher thermal conductivity than said second material and wherein said first material contacts a die in said multi-layer package.
Claim 2
Dependent Claim
119 words
A multi-layer package with leads or pads comprising: conductive planes including a power plane electrically connected to a power lead or pad of the package and a ground plane electrically connected to a ground lead or pad of the package; signal traces electrically connected to signal leads or pads of the package; a first material arranged between and contacting the power plane and the ground plane, said first material having a dielectric constant greater than twenty; and a second material supporting said signal traces, said second material having a dielectric constant less than twenty wherein the first material has a higher thermal conductivity than said second material and wherein said first material contacts a die in said multi-layer package.
Claim 3
Dependent Claim
24 words
The multi-layer package of claim 1, wherein said second material is arranged between and contacts the signal traces and one of said conductive planes.
Claim 4
Dependent Claim
19 words
The multi-layer package of claim 1, wherein the first material forms a die bond pad for supporting the die.
Claim 5
Dependent Claim
13 words
The multi-layer package of claim 1, wherein the first material is silicon carbide.
Claim 6
Dependent Claim
11 words
The multi-layer package of claim 1, wherein second material is alumina.
Claim 7
Dependent Claim
16 words
The multi-layer package of claim 1, wherein second material has a dielectric constant less than ten.
Claim 8
Dependent Claim
12 words
The multi-layer package of claim 6, wherein second material is aluminum nitride.
Claim 9
Dependent Claim
16 words
The multi-layer package of claim 6, wherein second material has a dielectric constant less than five.
Claim 10
Dependent Claim
12 words
The multi-layer package of claim 8, wherein the second material is polyimide.
Claim 11
Dependent Claim
11 words
The multi-layer package of claim 8, wherein second material is FR4.
Claim 12
Dependent Claim
11 words
The multi-layer package of claim 8, wherein second material is Teflon.
Claim 13
Dependent Claim
16 words
The multi-layer package of claim 1, wherein said first material and said second material are ceramic.
Claim 14
Dependent Claim
118 words
A multi-layer package with leads or pads comprising: conductive planes including a power plane electrically connected to a power lead or pad of the package and a ground plane electrically connected to a ground lead or pad of the package; signal traces electrically connected to signal leads or pads of the package; a silicon carbide layer arranged between and contacting the power plane and the ground plane, said silicon carbide layer forming a die bond pad adapted for contacting a die in the multilayer package so as to remove heat from the die; and another material supporting said signal traces, said second material having a dielectric constant less than twenty and a lower thermal conductivity than silicon carbide.
Claim 15
Dependent Claim
118 words
A multi-layer package with leads or pads comprising: conductive planes including a power plane electrically connected to a power lead or pad of the package and a ground plane electrically connected to a ground lead or pad of the package; signal traces electrically connected to signal leads or pads of the package; a silicon carbide layer arranged between and contacting the power plane and the ground plane, said silicon carbide layer forming a die bond pad adapted for contacting a die in the multilayer package so as to remove heat from the die; and another material supporting said signal traces, said second material having a dielectric constant less than twenty and a lower thermal conductivity than silicon carbide.
Claim 16
Dependent Claim
24 words
The multi-layer package of claim 13, wherein said another material is arranged between and contacts the signal traces and one of said conductive planes.
Claim 17
Dependent Claim
12 words
The multi-layer package of claim 13, wherein said another material is ceramic.
Claim 18
Dependent Claim
21 words
The multi-layer package of claim 13, further comprising a die attached to said die attach pad of the silicon carbide layer.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-12-05 | 1998-06-06 | 1998-12-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-12-05 | 2002-06-06 | 2002-12-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-12-05 | 2006-06-06 | 2006-12-06 | $7700.00 | Window Closed / Lapsed |