De-coupling capacitor on the top of the silicon die by eutectic flip bonding

Claim 1

An electronic package, comprising: a semiconductive die that has a plurality of first gold bumps located along a first edge of said die and a plurality of second gold bumps located on an inner area of said die; and, a capacitor module attached to said second gold bumps, wherein said capacitor module includes a plurality of conductive power planes separated from a plurality of conductive ground planes by layers of dielectric material constructed from dielectric tape, said conductive power planes having tabs that extend in a first direction and an opposite second direction, said powers tabs extending in said first direction being coupled by first conductive power areas and said power tabs extending in said second direction being coupled by second conductive power areas, said conductive ground planes also having tabs that extend in a first direction and an opposite second direction, said ground tabs extending in said first direction being coupled by first conductive ground areas and said around tabs extending in said second direction being coupled by second conductive around areas, said conductive power planes being further coupled together by a plurality of power vias, and said conductive ground planes being further coupled together by a plurality of around vias.

Claim 4

A method for coupling a capacitor module to a semiconductive device, comprising the steps of: a) providing a first layer of dielectric tape which has a first layer of patterned metal, said first layer of patterned metal including a plurality of tabs extending in a first direction and a plurality of tabs extending in a second direction; b) placing a plurality of first conductive dots on said first layer of patterned metal; c) attaching a second layer of dielectric to said first layer of patterned metal, said second layer of dielectric tape having a second layer of patterned metal separated from said first layer of patterned metal by said second layer of dielectric tape, said second layer of patterned metal including a plurality of tabs extending in a first direction and a plurality of tabs extending in a second direction, said tabs of said second layer of patterned metal being offset from said tabs of said first layer of patterned metal, said second layer of dielectric tape having a plurality of first through holes that are aligned with said first conductive dots; d) placing a plurality of second conductive dots on said second layer of patterned metal; e) attaching a third layer of dielectric tape to said second layer of patterned metal, said third layer of dielectric tape having a third layer of patterned metal separated from said second layer of patterned metal by said third layer of dielectric material, said third layer of patterned metal including a plurality of tabs extending in a first direction and a plurality of tabs extending in a second direction, said tabs of said third layer of patterned metal being offset from said tabs of said second layer of patterned metal and essentially aligned with said tabs of said first layer of patterned metal, said third layer of dielectric tape having a plurality of second through holes that are aligned with said second conductive dots; f) repeating steps (b) and (c) a predetermined number of times; g) applying outer layers of metal to said tabs to interconnect said tabs; h) curing said dielectric lavers to harden said dielectric layers; i) placing a plurality of gold bumps on a first surface of a semiconductive die; and, j) attaching said outer layers of metal to said gold bumps and said semiconductive die.

Claim 5

A method for coupling a capacitor module to a semiconductive device, comprising the steps of: a) providing a first layer of dielectric tape which has a first layer of patterned metal, said first layer of patterned metal including a plurality of tabs extending in a first direction and a plurality of tabs extending in a second direction; b) placing a plurality of first conductive dots on said first layer of patterned metal; c) attaching a second layer of dielectric to said first layer of patterned metal, said second layer of dielectric tape having a second layer of patterned metal separated from said first layer of patterned metal by said second layer of dielectric tape, said second layer of patterned metal including a plurality of tabs extending in a first direction and a plurality of tabs extending in a second direction, said tabs of said second layer of patterned metal being offset from said tabs of said first layer of patterned metal, said second layer of dielectric tape having a plurality of first through holes that are aligned with said first conductive dots; d) placing a plurality of second conductive dots on said second layer of patterned metal; e) attaching a third layer of dielectric tape to said second layer of patterned metal, said third layer of dielectric tape having a third layer of patterned metal separated from said second layer of patterned metal by said third layer of dielectric material, said third layer of patterned metal including a plurality of tabs extending in a first direction and a plurality of tabs extending in a second direction, said tabs of said third layer of patterned metal being offset from said tabs of said second layer of patterned metal and essentially aligned with said tabs of said first layer of patterned metal, said third layer of dielectric tape having a plurality of second through holes that are aligned with said second conductive dots; f) repeating steps (b) and (c) a predetermined number of times; g) applying outer layers of metal to said tabs to interconnect said tabs; h) curing said dielectric lavers to harden said dielectric layers; i) placing a plurality of gold bumps on a first surface of a semiconductive die; and, j) attaching said outer layers of metal to said gold bumps and said semiconductive die.