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Method of making transparent polysilicon gate for imaging arrays

Assignee: Micron Technology Inc
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Filing: 1993-04-12
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Granted: 1994-11-29
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Expires: 2013-04-12
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Abstract

Abstract An improved MOS photodetector having polysilicon gate material which is made more transparent to visible light by the addition of up to 50% carbon, and preferably about 10% carbon. The surfaces of the polysilicon-carbon gates are oxidized to form a silicon dioxide dielectric layer, thus eliminating the need to deposit a separate dielectric layer for isolation of adjacent gates in an overlapping gate array. The elimination of a separate dielectric layer permits all gates to be formed directly on the substrate dielectric layer, thus providing a uniform drive voltage requirement across the array.

Inventors

  • 👤 James Halvis
  • 👤 Nathan Bluzer
  • 👤 Robert R. Shiskowski
  • 👤 Li-Shu Chen

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 01:52
CPC Classifications
H; H10; H10D; H10D84/00; H10D84/01; H10D84/0198; H10D84/02; H10D84/03; H10D84/038

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 158 words
A method of making a transparent polysilicon gate, comprising the steps of: forming an active photon absorber from a semiconductor substrate; forming a gate dielectric layer on said active photon absorber; depositing a first layer of polysilicon-carbon over said gate dielectric layer; defining a first array of gates by placing a first resist pattern over said first layer of polysilicon-carbon whereby portions of said first layer of polysilicon-carbon are exposed; forming said first array of gates by removing said exposed polysilicon-carbon in said first resist pattern; removing said first resist pattern; forming an insulating layer on said first array of gates; depositing a second layer of polysilicon-carbon ever said first array of gates; defining a second array of gates by placing a second resist pattern over said second layer of polysilicon-carbon whereby portions of said second layer of polysilicon-carbon are exposed; and forming said second array of gates by removing said exposed polysilicon-carbon in said second resist pattern.
Claim 2
Independent Claim 158 words
A method of making a transparent polysilicon gate, comprising the steps of: forming an active photon absorber from a semiconductor substrate; forming a gate dielectric layer on said active photon absorber; depositing a first layer of polysilicon-carbon over said gate dielectric layer; defining a first array of gates by placing a first resist pattern over said first layer of polysilicon-carbon whereby portions of said first layer of polysilicon-carbon are exposed; forming said first array of gates by removing said exposed polysilicon-carbon in said first resist pattern; removing said first resist pattern; forming an insulating layer on said first array of gates; depositing a second layer of polysilicon-carbon ever said first array of gates; defining a second array of gates by placing a second resist pattern over said second layer of polysilicon-carbon whereby portions of said second layer of polysilicon-carbon are exposed; and forming said second array of gates by removing said exposed polysilicon-carbon in said second resist pattern.
Claim 3
Dependent Claim 29 words
The method as recited in claim 1, wherein said first layer of polysilicon-carbon comprises S 1-x C x , where x is greater than 0.0 and less than 0.5.
Claim 4
Dependent Claim 29 words
The method as recited in claim 2, wherein said second layer of polysilicon-carbon comprises S 1-x C x , where x is greater than 0.0 and less than 0.5.
Claim 5
Dependent Claim 13 words
The method as recited in claim 3, wherein said semiconductor substrate comprises silicon.
Claim 6
Dependent Claim 15 words
The method as recited in claim 4, wherein said gate dielectric layer comprises silicon dioxide.
Claim 7
Dependent Claim 20 words
The method as recited in claim 4, wherein said gate dielectric layer comprises silicon dioxide and silicon nitride in combination.
Claim 8
Dependent Claim 23 words
The method as recited in claim 4, wherein said insulating layer is formed by oxidizing the surface of said first array of gates.

References Cited (Backward Citations)

US4113515A Cited
JPS5350981A Cited
US4189826A Cited
US4352237A Cited
JPS57204165A Cited
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JPH0260542A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-11-28 1998-05-30 1998-11-29 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2001-11-28 2002-05-30 2002-11-29 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2005-11-28 2006-05-30 2006-11-29 $7700.00 Window Closed / Lapsed

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