Method of exposing patttern of semiconductor devices and stencil mask for carrying out same

Claim 1

A method of exposing a device pattern onto a semiconductor substrate by repeatedly exposing in an adjoining arrangement a plurality of unit patterns, thereby connecting pattern lines of the unit patterns to complete the device pattern on the substrate, said method comprising: (a) dividing at least part of the device pattern into the plurality of unit patterns; (b) preparing a stencil mask provided with transmitting openings having shapes respectively conforming to the unit patterns, wherein the pattern lines of the unit patterns which are to be connected with each other have at least one connecting end provided with at least one semicircular protrusion having a maximum width less than that of the corresponding pattern lines; (c) placing the stencil mask in an optical arrangement for projecting the unit patterns onto the substrate; (d) irradiating a beam of charged particles or light through one of the openings for exposing one corresponding unit pattern onto predetermined sites of the substrate; and (e) repeating said irradiation through other openings for exposing respective corresponding unit patterns onto respective predetermined sites of the substrate until the device pattern is completely transferred onto the substrate.

Claim 2

A method of exposing a device pattern onto a semiconductor substrate by repeatedly exposing in an adjoining arrangement a plurality of unit patterns, thereby connecting pattern lines of the unit patterns to complete the device pattern on the substrate, said method comprising: (a) dividing at least part of the device pattern into the plurality of unit patterns; (b) preparing a stencil mask provided with transmitting openings having shapes respectively conforming to the unit patterns, wherein the pattern lines of the unit patterns which are to be connected with each other have at least one connecting end provided with at least one semicircular protrusion having a maximum width less than that of the corresponding pattern lines; (c) placing the stencil mask in an optical arrangement for projecting the unit patterns onto the substrate; (d) irradiating a beam of charged particles or light through one of the openings for exposing one corresponding unit pattern onto predetermined sites of the substrate; and (e) repeating said irradiation through other openings for exposing respective corresponding unit patterns onto respective predetermined sites of the substrate until the device pattern is completely transferred onto the substrate.

Claim 5

A method of exposing a device pattern onto a semiconductor substrate by repeatedly exposing in an adjoining arrangement a plurality of unit patterns, thereby connecting pattern lines of the unit patterns to complete the device pattern on the substrate, said method comprising: (a) dividing at least part of the device pattern into the plurality of unit patterns; (b) preparing a stencil mask provided with transmitting openings having shapes respectively conforming to the unit patterns, wherein each pair of the pattern lines of the unit patterns which are to be connected with each other has a first connecting end which is smooth and a second connecting end provided with at least one semicircular protrusion having a maximum width less than that of the first connecting end; (c) placing the stencil mask in an optical arrangement for projecting the unit patterns onto the substrate; (d) irradiating a beam of charged particles or light through one of the openings for exposing one corresponding unit pattern onto predetermined sites of the substrate; and (e) repeating said irradiation through other openings for exposing respective corresponding unit patterns onto respective predetermined sites of the substrate until the device pattern is completely transferred onto the substrate.

Claim 6

A method of exposing a device pattern onto a semiconductor substrate by repeatedly exposing in an adjoining arrangement a plurality of unit patterns, thereby connecting pattern lines of the unit patterns to complete the device pattern on the substrate, said method comprising: (a) dividing at least part of the device pattern into the plurality of unit patterns; (b) preparing a stencil mask provided with transmitting openings having shapes respectively conforming to the unit patterns, wherein each pair of the pattern lines of the unit patterns which are to be connected with each other has a first connecting end which is smooth and a second connecting end provided with at least one semicircular protrusion having a maximum width less than that of the first connecting end; (c) placing the stencil mask in an optical arrangement for projecting the unit patterns onto the substrate; (d) irradiating a beam of charged particles or light through one of the openings for exposing one corresponding unit pattern onto predetermined sites of the substrate; and (e) repeating said irradiation through other openings for exposing respective corresponding unit patterns onto respective predetermined sites of the substrate until the device pattern is completely transferred onto the substrate.

Claim 9

A method of exposing a device pattern onto a semiconductor substrate by repeatedly exposing in an adjoining arrangement a plurality of unit patterns, thereby connecting pattern lines of the unit patterns to complete the device pattern on the substrate, said method comprising: (a) dividing at least part of the device pattern into the plurality of unit patterns; (b) preparing a stencil mask provided with transmitting openings having shapes respectively conforming to the unit patterns, wherein the pattern lines of the unit patterns which are to be connected with each other have at least one connecting end provided with at least one square protrusion having a maximum width less than that of the corresponding pattern lines; (c) placing the stencil mask in an optical arrangement for projecting the unit patterns onto the substrate; (d) irradiating a beam of charged particles or light through one of the openings for exposing one corresponding unit pattern onto predetermined sites of the substrate; and (e) repeating said irradiation through other openings for exposing respective corresponding unit patterns onto respective predetermined sites of the substrate until the device pattern is completely transferred onto the substrate.

Claim 10

A method of exposing a device pattern onto a semiconductor substrate by repeatedly exposing in an adjoining arrangement a plurality of unit patterns, thereby connecting pattern lines of the unit patterns to complete the device pattern on the substrate, said method comprising: (a) dividing at least part of the device pattern into the plurality of unit patterns; (b) preparing a stencil mask provided with transmitting openings having shapes respectively conforming to the unit patterns, wherein the pattern lines of the unit patterns which are to be connected with each other have at least one connecting end provided with at least one square protrusion having a maximum width less than that of the corresponding pattern lines; (c) placing the stencil mask in an optical arrangement for projecting the unit patterns onto the substrate; (d) irradiating a beam of charged particles or light through one of the openings for exposing one corresponding unit pattern onto predetermined sites of the substrate; and (e) repeating said irradiation through other openings for exposing respective corresponding unit patterns onto respective predetermined sites of the substrate until the device pattern is completely transferred onto the substrate.

Claim 13

A method of exposing a device pattern onto a semiconductor substrate by repeatedly exposing in an adjoining arrangement a plurality of unit patterns, thereby connecting pattern lines of the unit patterns to complete the device pattern on the substrate, said method comprising: (a) dividing at least part of the device pattern into the plurality of unit patterns; (b) preparing a stencil mask provided with transmitting openings having shapes respectively conforming to the unit patterns, wherein the pattern lines of the unit patterns which are to be connected with each other have at least one connecting end provided with at least one pointed protrusion having a maximum width less than that of the corresponding pattern lines; (c) placing the stencil mask in an optical arrangement for projecting the unit patterns onto the substrate; (d) irradiating a beam of charged particles or light through one of the openings for exposing one corresponding unit pattern onto predetermined sites of the substrate; and (e) repeating said irradiation through other openings for exposing respective corresponding unit patterns onto respective predetermined sites of the substrate until the device pattern is completely transferred onto the substrate.

Claim 14

A method of exposing a device pattern onto a semiconductor substrate by repeatedly exposing in an adjoining arrangement a plurality of unit patterns, thereby connecting pattern lines of the unit patterns to complete the device pattern on the substrate, said method comprising: (a) dividing at least part of the device pattern into the plurality of unit patterns; (b) preparing a stencil mask provided with transmitting openings having shapes respectively conforming to the unit patterns, wherein the pattern lines of the unit patterns which are to be connected with each other have at least one connecting end provided with at least one pointed protrusion having a maximum width less than that of the corresponding pattern lines; (c) placing the stencil mask in an optical arrangement for projecting the unit patterns onto the substrate; (d) irradiating a beam of charged particles or light through one of the openings for exposing one corresponding unit pattern onto predetermined sites of the substrate; and (e) repeating said irradiation through other openings for exposing respective corresponding unit patterns onto respective predetermined sites of the substrate until the device pattern is completely transferred onto the substrate.