US5360873A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Actinic radiation-reactive pressure-sensitive adhesive composition
Assignee: Adeka Corp
•
Filing: 1993-08-20
•
Granted: 1994-11-01
•
Expires: 2013-08-20
Abstract
Abstract An actinic radiation-reactive pressure-sensitive adhesive composition which can be cured in air at a high speed, without irritation and bad smell, comprises +E,crc/1/ a pressure-sensitive adhesive compound comprising an acrylate copolymer and +E,crc/2/ an actinic radiation-curable resin comprising (1) one or more polythiol compounds and (2) one or more polyene compounds each having an least two actinic radiation-reactive acrylate carbon-to-carbon double bonds in the molecule.
Inventors
- 👤 Kazuo Ohkawa
- 👤 Seiichi Saito
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 23:42
CPC Classifications
H; H10; H10P; H10P50/00; C; C08; C08F; C08F299/00; C09; C09J; C09J167/00; C09J201/00; G; G03; G03F; G03F7/00; G03F7/0012; C08L; C08L2666/00; C08L2666/02
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
87 words
An actinic radiation-reactive pressure-sensitive adhesive composition having as essential components: a pressure-sensitive adhesive compound comprising an acrylate copolymer, which is optionally mixed with a cross linking agent, and an actinic radiation-curable resin comprising one or more polythiol compounds and one or more polyene compounds, said polyene compounds each having at least two actinic radiation-reactive carbon-to-carbon double bonds from an acrylate compound and the equivalent ratio of carbon-to-carbon double bonds to the thiol groups being between 0.7:1.0 and 1.5:1.0, said composition having a reduced adhesion strength after curing.
Claim 2
Dependent Claim
87 words
An actinic radiation-reactive pressure-sensitive adhesive composition having as essential components: a pressure-sensitive adhesive compound comprising an acrylate copolymer, which is optionally mixed with a cross linking agent, and an actinic radiation-curable resin comprising one or more polythiol compounds and one or more polyene compounds, said polyene compounds each having at least two actinic radiation-reactive carbon-to-carbon double bonds from an acrylate compound and the equivalent ratio of carbon-to-carbon double bonds to the thiol groups being between 0.7:1.0 and 1.5:1.0, said composition having a reduced adhesion strength after curing.
Claim 3
Dependent Claim
43 words
An actinic radiation-reactive pressure-sensitive adhesive composition as set forth in claim 1, wherein the actinic radiation-curable resin is contained in the adhesive composition in an amount of 1 to 500 parts by weight per 100 parts by weight of the pressure-sensitive adhesive compound.
Claim 4
Dependent Claim
43 words
An actinic radiation-reactive pressure-sensitive adhesive composition as set forth in claim 1, wherein the actinic radiation-curable resin is contained in the adhesive composition in an amount of 10 to 200 parts by weight per 100 parts by weight of the pressure-sensitive adhesive compound.
Claim 5
Dependent Claim
40 words
An actinic radiation-reactive pressure-sensitive composition as set forth in claim 1, having an adhesive force of from 200 to 1000 g/20 mm for a semiconductor wafer before curing and an adhesive force of 100 g/20 mm or lower after curing.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-10-31 | 1998-05-02 | 1998-11-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-10-31 | 2002-05-02 | 2002-11-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-10-31 | 2006-05-02 | 2006-11-01 | $7700.00 | Window Closed / Lapsed |