Chip package with microlens array

Claim 2

A chip package holding a light-emitting array integrated circuit chip having an electrical-signal input/output section, and an optical-signal output section which has a predetermined number of bit positions, said chip package comprising: a microlens array provided on said chip and having multiple microlenses each corresponding to a respectively different one of said bit positions and which convey optical control and data signals in parallel from the optical-signal output section of the processor chip; a component provided on an upper part of said microlens array and adapted to fix a plurality of optical-signal transmitting elements in a predetermined spatial position, to convey, through said optical-signal transmitting elements, multiple parallel control bits and data bits of optical signals to be output from said processor chip via said microlens array and said optical-signal output section; and adjusting means for adjusting one of the component and the processor chip in position; wherein the processor chip includes means, coupled to the electrical signal input/output section, for causing the optical-signal output section to produce optical signals at predetermined locations in the optical signal output section, while the adjusting means is adjusting the position of the one of the component and the processor chip, to facilitate alignment of the optical signal transmitting elements with the optical-signal output section.

Claim 3

A chip package holding an integrated circuit (IC) chip having an electrical-signal input/output section and an optical-signal input section which has a predetermined number of bit positions, said IC chip being adapted to perform digital data processing, said chip package comprising: a microlens array provided on an upper part of said IC chip and having multiple microlenses, each corresponding to a respectively different one of said bit positions; a container-like chip carrier which holds said IC chip and said microlens array and which has a group of electrical-signal input/output terminals that are connected to the electrical-signal input/output section of said IC chip; a cover bonded to said chip carrier to seal said chip carrier and having a window for optical-signal input to said microlens array; a connector plate holding a plurality of optical-signal transmitting elements which transmit a respective plurality of optical signals en bloc to be applied to said optical-signal input section via said cover window and said microlens array; and adjusting means for adjusting the connector plate in position relative to the IC chip; wherein the IC chip includes means, coupled to the optical-signal input section for generating signals via the electrical-signal input/output section while the relative positions of the component and the processor chip are adjusted via the adjusting means, to facilitate alignment of the optical signal transmitting elements with the optical-signal input section and; wherein, upon achieving alignment, said chip carrier and said connector plate are securely attached to a circuit board in configuration where said optical-signal transmitting elements are fixedly positioned with respect to said IC chip, and said electrical input/output terminal group is connected to said circuit board.

Claim 4

A chip package holding an integrated circuit (IC) chip having an electrical-signal input/output section and an optical-signal input section which has a predetermined number of bit positions, said IC chip being adapted to perform digital data processing, said chip package comprising: a microlens array provided on an upper part of said IC chip and having multiple microlenses, each corresponding to a respectively different one of said bit positions; a container-like chip carrier which holds said IC chip and said microlens array and which has a group of electrical-signal input/output terminals that are connected to the electrical-signal input/output section of said IC chip; a cover bonded to said chip carrier to seal said chip carrier and having a window for optical-signal input to said microlens array; a connector plate holding a plurality of optical-signal transmitting elements which transmit a respective plurality of optical signals en bloc to be applied to said optical-signal input section via said cover window and said microlens array; and adjusting means for adjusting the connector plate in position relative to the IC chip; wherein the IC chip includes means, coupled to the optical-signal input section for generating signals via the electrical-signal input/output section while the relative positions of the component and the processor chip are adjusted via the adjusting means, to facilitate alignment of the optical signal transmitting elements with the optical-signal input section and; wherein, upon achieving alignment, said chip carrier and said connector plate are securely attached to a circuit board in configuration where said optical-signal transmitting elements are fixedly positioned with respect to said IC chip, and said electrical input/output terminal group is connected to said circuit board.

Claim 5

A chip package holding an integrated circuit (IC) chip having an electrical-signal input/output section and an optical-signal input section which has a predetermined number of bit positions, said IC chip being adapted to perform digital data processing, said chip package comprising: a microlens array provided on an upper part of said IC chip and having multiple microlenses, each corresponding to a respectively different one of said bit positions; a chip carrier which holds said IC chip and said microlens array and which has a group of electrical-signal input/output terminals that are connected to the electrical-signal input/output section of said IC chip; a connector plate holding a plurality of optical-signal transmitting elements which transmit a respective plurality of optical signals en bloc to be applied to said optical-signal input section via said microlens array; and adjusting means for adjusting one of the connector plate and the IC chip in position; wherein the IC chip includes means, coupled to the optical-signal input section for generating signals via the electrical-signal input/output section, while the adjusting means is adjusting the position of the one of the connector plate and the IC chip to facilitate alignment of the optical signal transmitting elements with the optical-signal input section and; wherein, upon achieving alignment, said chip carrier and said connector plate are securely attached to a circuit board in the state where said optical-signal transmitting elements are fixedly positioned with respect to said IC chip, and said electrical input/output terminal group is connected to said circuit board.

Claim 6

A chip package holding an integrated circuit (IC) chip having an electrical-signal input/output section and an optical-signal input section which has a predetermined number of bit positions, said IC chip being adapted to perform digital data processing, said chip package comprising: a microlens array provided on an upper part of said IC chip and having multiple microlenses, each corresponding to a respectively different one of said bit positions; a chip carrier which holds said IC chip and said microlens array and which has a group of electrical-signal input/output terminals that are connected to the electrical-signal input/output section of said IC chip; a connector plate holding a plurality of optical-signal transmitting elements which transmit a respective plurality of optical signals en bloc to be applied to said optical-signal input section via said microlens array; and adjusting means for adjusting one of the connector plate and the IC chip in position; wherein the IC chip includes means, coupled to the optical-signal input section for generating signals via the electrical-signal input/output section, while the adjusting means is adjusting the position of the one of the connector plate and the IC chip to facilitate alignment of the optical signal transmitting elements with the optical-signal input section and; wherein, upon achieving alignment, said chip carrier and said connector plate are securely attached to a circuit board in the state where said optical-signal transmitting elements are fixedly positioned with respect to said IC chip, and said electrical input/output terminal group is connected to said circuit board.

Claim 7

A chip package holding an integrated circuit (IC) chip having an electrical-signal input/output section and an optical-signal input section which has a predetermined number of bit positions, said IC chip being adapted to perform digital data processing, said chip package comprising: a microlens array provided on an upper part of said IC chip and having multiple microlenses, each corresponding to a respectively different one of said bit positions; a chip carrier which holds said IC chip and said microlens array and which has a group of electrical-signal input/output terminals that are connected to the electrical-signal input/output section of said IC chip; and a connector plate holding a plurality of optical-signal transmitting elements which transmit a respective plurality of optical signals en bloc to be applied to said optical-signal input section via said microlens array; means for coupling the chip carrier and the connector plate to a circuit board having a front side, a rear side and an opening from the front side to the rear side; wherein, said connector plate is securely attached by said coupling means to the front side of the circuit board, said chip carrier is positioned with respect to and held in a fixed position with respect to said optical-signal transmitting elements via said opening from the rear side of said circuit board, and said electrical input/output terminal group are connected to said circuit board.

Claim 8

A chip package holding an integrated circuit (IC) chip having an electrical-signal input/output section and an optical-signal input section which has a predetermined number of bit positions, said IC chip being adapted to perform digital data processing, said chip package comprising: a microlens array provided on an upper part of said IC chip and having multiple microlenses, each corresponding to a respectively different one of said bit positions; a chip carrier which holds said IC chip and said microlens array and which has a group of electrical-signal input/output terminals that are connected to the electrical-signal input/output section of said IC chip; and a connector plate holding a plurality of optical-signal transmitting elements which transmit a respective plurality of optical signals en bloc to be applied to said optical-signal input section via said microlens array; means for coupling the chip carrier and the connector plate to a circuit board having a front side, a rear side and an opening from the front side to the rear side; wherein, said connector plate is securely attached by said coupling means to the front side of the circuit board, said chip carrier is positioned with respect to and held in a fixed position with respect to said optical-signal transmitting elements via said opening from the rear side of said circuit board, and said electrical input/output terminal group are connected to said circuit board.

Claim 9

A chip package as set forth in claim 1, 2, 3 or 4, wherein said optical-signal transmitting elements are a plurality of optical fibers in an optical-fiber bundle.

Claim 10

A chip package as set forth in claim 2, 3 or 4, wherein said optical-signal transmitting elements are inserted into a hole provided on said connector plate, and securely attached to said connector plate with a cementing medium.

Claim 11

A chip package holding an integrated circuit (IC) chip having an electrical-signal input/output section and an optical-signal input section which has a predetermined number of bit positions, said IC chip being adapted to perform digital data processing, said chip package comprising: a microlens array provided on an upper part of said IC chip and having multiple microlenses, each corresponding to a respectively different one of said bit positions; a container-like chip carrier which holds said IC chip and said microlens array and which has a group of electrical-signal input/output terminals that are connected to the electrical-signal input/output section of said IC chip; a cover bonded to said chip carrier to seal said chip carrier and having a window for optical-signal input to said microlens array; and a connector plate holding a plurality of optical-signal transmitting elements which transmit a respective plurality of optical signals en bloc to be applied to said optical-signal input section via said cover window and said microlens array, wherein said connector plate has position-adjusting pins protruding downwards, which are passed through holes provided on circuit board; wherein, said chip carrier and said connector plate are securely attached to said circuit board in a configuration where said optical-signal transmitting elements are fixedly positioned with respect to said IC chip, and said electrical input/output terminal group is connected to said circuit board.

Claim 12

A chip package holding an integrated circuit (IC) chip having an electrical-signal input/output section and an optical-signal input section which has a predetermined number of bit positions, said IC chip being adapted to perform digital data processing, said chip package comprising: a microlens array provided on an upper part of said IC chip and having multiple microlenses, each corresponding to a respectively different one of said bit positions; a container-like chip carrier which holds said IC chip and said microlens array and which has a group of electrical-signal input/output terminals that are connected to the electrical-signal input/output section of said IC chip; a cover bonded to said chip carrier to seal said chip carrier and having a window for optical-signal input to said microlens array; and a connector plate holding a plurality of optical-signal transmitting elements which transmit a respective plurality of optical signals en bloc to be applied to said optical-signal input section via said cover window and said microlens array, wherein said connector plate has position-adjusting pins protruding downwards, which are passed through holes provided on circuit board; wherein, said chip carrier and said connector plate are securely attached to said circuit board in a configuration where said optical-signal transmitting elements are fixedly positioned with respect to said IC chip, and said electrical input/output terminal group is connected to said circuit board.

Claim 13

A chip package holding an integrated circuit (IC) chip having an electrical-signal input/output section and an optical-signal input section which has a predetermined number of bit positions, said IC chip being adapted to perform digital data processing, said chip package comprising: a microlens array provided on the upper part of said IC chip and having multiple microlenses, each corresponding to a respectively different one of said bit positions; a chip carrier which holds said IC chip and said microlens array and which has a group of electrical-signal input/output terminals that are connected to the electrical-signal input/output section of said IC chip; and a connector plate holding a plurality of optical-signal transmitting elements which transmit a respective plurality of optical signals en bloc to be applied to said optical-signal input section via said microlens array; wherein, said connector plate is securely attached to a circuit board having an opening, said chip carrier is positioned with respect to and held in a fixed position with respect to said optical-signal transmitting elements via said opening from the rear side of said circuit board, said electrical input/output terminal group is connected to said circuit board and said chip carrier has position-adjusting pins protruding downwards.

Claim 14

A chip package holding an integrated circuit (IC) chip having an electrical-signal input/output section and an optical-signal input section which has a predetermined number of bit positions, said IC chip being adapted to perform digital data processing, said chip package comprising: a microlens array provided on the upper part of said IC chip and having multiple microlenses, each corresponding to a respectively different one of said bit positions; a chip carrier which holds said IC chip and said microlens array and which has a group of electrical-signal input/output terminals that are connected to the electrical-signal input/output section of said IC chip; and a connector plate holding a plurality of optical-signal transmitting elements which transmit a respective plurality of optical signals en bloc to be applied to said optical-signal input section via said microlens array; wherein, said connector plate is securely attached to a circuit board having an opening, said chip carrier is positioned with respect to and held in a fixed position with respect to said optical-signal transmitting elements via said opening from the rear side of said circuit board, said electrical input/output terminal group is connected to said circuit board and said chip carrier has position-adjusting pins protruding downwards.

Claim 15

A chip package which holds a light-emitting element array which generates optical output signals having a predetermined number of bit positions, said chip package comprising: a microlens array having multiple microlenses each corresponding to a respectively different one of said bit positions; a container-like chip carrier holding a chip and said microlens array and having a group of electrical-signal input/output terminals; a cover bonded to said chip carrier to seal said chip carrier and having a window which passes said optical output signals from said chip; an adapter which holds optical-signal transmitting elements that transmit a plurality of optical signals en bloc to output optical signals from said chip through said cover window; and a heat sink which is coupled to said chip to dissipate heat generated by said light-emitting element array; wherein, said chip carrier and said adapter are securely attached to a front surface of a circuit board in a configuration where said optical-signal transmitting elements are held in a fixed position with respect to said IC chip, said electrical input/output terminal group is connected to the circuit board, and said heat sink is securely attached to said circuit board.

Claim 16

A chip package which holds a light-emitting element array which generates optical output signals having a predetermined number of bit positions, said chip package comprising: a microlens array having multiple microlenses each corresponding to a respectively different one of said bit positions; a container-like chip carrier holding a chip and said microlens array and having a group of electrical-signal input/output terminals; a cover bonded to said chip carrier to seal said chip carrier and having a window which passes said optical output signals from said chip; an adapter which holds optical-signal transmitting elements that transmit a plurality of optical signals en bloc to output optical signals from said chip through said cover window; and a heat sink which is coupled to said chip to dissipate heat generated by said light-emitting element array; wherein, said chip carrier and said adapter are securely attached to a front surface of a circuit board in a configuration where said optical-signal transmitting elements are held in a fixed position with respect to said IC chip, said electrical input/output terminal group is connected to the circuit board, and said heat sink is securely attached to said circuit board.

Claim 17

A chip package as set forth in claim 9, wherein said optical-signal transmitting elements are a plurality of optical fibers contained in an optical-fiber bundle.

Claim 18

A chip package which holds a light-emitting element array that generates optical output signals having a predetermined number of bit positions, said chip package comprising: a microlens array having multiple microlenses each corresponding to a respectively different one of said bit positions; a container-like chip carrier holding said chip and said microlens array and having a group of electrical-signal input/output terminals; a cover bonded to said chip carrier to seal said chip carrier and having a window which passes said optical output signals from said chip; an adapter which holds optical-signal transmitting elements that transmit a plurality of optical signals en bloc to output optical signals from said chip through said cover window; and a heat sink which is coupled to said IC Chip to dissipate heat generated by said light-emitting element array; wherein, said chip carrier and said adapter are securely attached to a front surface of a circuit board in a configuration where said optical-signal transmitting elements are held in a fixed position with respect to said IC Chip, said electrical input/output terminal group is connected to the circuit board, said heat sink is securely attached to said circuit board, said optical-signal transmitting elements are a plurality of optical fibers contained in an optical-fiber bundle, and said adapter has position-adjusting pins protruding downwards, said pins being passed through holes provided on the circuit board and holes provided on the heat sink.

Claim 19

A chip package which holds a light-emitting element array that generates optical output signals having a predetermined number of bit positions, said chip package comprising: a microlens array having multiple microlenses each corresponding to a respectively different one of said bit positions; a container-like chip carrier holding said chip and said microlens array and having a group of electrical-signal input/output terminals; a cover bonded to said chip carrier to seal said chip carrier and having a window which passes said optical output signals from said chip; an adapter which holds optical-signal transmitting elements that transmit a plurality of optical signals en bloc to output optical signals from said chip through said cover window; and a heat sink which is coupled to said IC Chip to dissipate heat generated by said light-emitting element array; wherein, said chip carrier and said adapter are securely attached to a front surface of a circuit board in a configuration where said optical-signal transmitting elements are held in a fixed position with respect to said IC Chip, said electrical input/output terminal group is connected to the circuit board, said heat sink is securely attached to said circuit board, said optical-signal transmitting elements are a plurality of optical fibers contained in an optical-fiber bundle, and said adapter has position-adjusting pins protruding downwards, said pins being passed through holes provided on the circuit board and holes provided on the heat sink.

Claim 20

A chip package holding an integrated circuit (IC) chip having an electrical-signal input/output section and an optical-signal input section which has a predetermined number of bit positions, said IC chip being adapted to perform digital data processing, said chip package comprising: a microlens array provided on an upper part of said IC chip and having multiple microlenses, each corresponding to a respectively different one of said bit positions; a chip carrier which holds said IC chip and said microlens array and which has a group of electrical-signal input/output terminals that are connected to the electrical-signal input/output section of said IC chip; and a connector plate holding a plurality of optical-signal transmitting elements which transmit a respective plurality of optical signals en bloc to be applied to said optical-signal input section via said microlens array; wherein, said chip carrier and said connector plate are securely attached to a circuit board in the state where said optical-signal transmitting elements are fixedly positioned with respect to said IC chip, and said electrical input/output terminal group is connected to said circuit board and the connector plate includes position-adjusting pins which protrude downwards and are passed through holes provided on the circuit board.

Claim 21

A chip package holding an integrated circuit (IC) chip having an electrical-signal input/output section and an optical-signal input section which has a predetermined number of bit positions, said IC chip being adapted to perform digital data processing, said chip package comprising: a microlens array provided on an upper part of said IC chip and having multiple microlenses, each corresponding to a respectively different one of said bit positions; a chip carrier which holds said IC chip and said microlens array and which has a group of electrical-signal input/output terminals that are connected to the electrical-signal input/output section of said IC chip; and a connector plate holding a plurality of optical-signal transmitting elements which transmit a respective plurality of optical signals en bloc to be applied to said optical-signal input section via said microlens array; wherein, said chip carrier and said connector plate are securely attached to a circuit board in the state where said optical-signal transmitting elements are fixedly positioned with respect to said IC chip, and said electrical input/output terminal group is connected to said circuit board and the connector plate includes position-adjusting pins which protrude downwards and are passed through holes provided on the circuit board.