Patent US5356658A successfully refreshed from Google Patents.
US5356658A
Expired / Lapsed
US
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Flexible high speed liquid dispenser
Assignee: Motorola Solutions Inc
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Filing: 1993-07-19
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Granted: 1994-10-18
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Expires: 2013-07-19
Abstract
Abstract The method for dispensing liquid on a substrate includes providing a plate (108) having a plurality apertures (110). These apertures (110) conform to the pattern of a plurality of pads (104, 106) of at least one component of a substrate (102). The apertures (110) are filled with the liquid to be dispensed, and are then aligned with the plurality of pads (104, 106) on the substrate (102). The liquid is simultaneously transferred out of the apertures (110)and onto the plurality of pads (104, 106) using a blower (112 ).
Inventors
- 👤 Allen D. Hertz
- 👤 Henry F. Liebman
- 👤 Frank C. Immacolato
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 10:06
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/12; H05K3/1216; H05K3/1233; B; B05; B05C; B05C9/00; B05C9/02; B05D; B05D1/00; B23; B23K; B23K1/00; B23K1/20; B23K1/203; B23K2101/00; B23K2101/36; B23K2101/42; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0113; H05K2203/08; H05K2203/081
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
91 words
A method for dispensing liquid on a substrate, comprising the steps of: providing a circuit carrying substrate having a plurality of pads: providing a plate above the circuit carrying substrate, the plate having a plurality of apertures which conform to the pattern of the plurality of pads of at least one component on the circuit carrying substrate; providing liquid in the plurality of apertures; aligning the plurality of apertures with the plurality of pads; and transferring the liquid out of the plurality of apertures onto the plurality of pads substantially simultaneously.
Claim 2
Independent Claim
91 words
A method for dispensing liquid on a substrate, comprising the steps of: providing a circuit carrying substrate having a plurality of pads: providing a plate above the circuit carrying substrate, the plate having a plurality of apertures which conform to the pattern of the plurality of pads of at least one component on the circuit carrying substrate; providing liquid in the plurality of apertures; aligning the plurality of apertures with the plurality of pads; and transferring the liquid out of the plurality of apertures onto the plurality of pads substantially simultaneously.
Claim 3
Dependent Claim
23 words
The method of claim 1, wherein the step of transferring includes the step of blowing the liquid out of the plurality of apertures.
Claim 4
Dependent Claim
21 words
The method of claim 2, wherein the step of blowing includes the step of blowing air at the plurality of apertures.
Claim 5
Dependent Claim
17 words
The method of claim 1, wherein the step of providing liquid includes the step of providing epoxy.
Claim 6
Dependent Claim
18 words
The method of claim 1, wherein the step of providing liquid includes the step of providing solder flux.
Claim 7
Dependent Claim
18 words
The method of claim 1, wherein the step of providing liquid includes the step of providing solder paste.
Claim 8
Dependent Claim
20 words
The method of claim 1, wherein the step of providing a plate includes providing a plate having a variable thickness.
Claim 9
Independent Claim
102 words
A method for providing liquid on the pads of a substrate, comprising the steps of: providing a circuit carrying substrate having a plurality of pads which conform to the pattern of at least one multi pin component; providing a plate above the circuit carrying substrate, the plate having a plurality of apertures which conform to the plurality of pads; providing a liquid in the apertures; moving the plate to substantially align the plurality of apertures with the plurality of pads; and blowing air through the plurality of apertures to substantially simultaneously transfer the liquid out of the apertures and onto the pads.
Claim 10
Independent Claim
102 words
A method for providing liquid on the pads of a substrate, comprising the steps of: providing a circuit carrying substrate having a plurality of pads which conform to the pattern of at least one multi pin component; providing a plate above the circuit carrying substrate, the plate having a plurality of apertures which conform to the plurality of pads; providing a liquid in the apertures; moving the plate to substantially align the plurality of apertures with the plurality of pads; and blowing air through the plurality of apertures to substantially simultaneously transfer the liquid out of the apertures and onto the pads.
Claim 11
Dependent Claim
16 words
The method of claim 8, further including the step of removing excess liquid off the plate.
Claim 12
Dependent Claim
22 words
The method of claim 8, further including the step of retrieving information on the location of the pads from a data bank.
Claim 13
Dependent Claim
17 words
The method of claim 8, further including the step of locating an air blower over the apertures.
Claim 14
Dependent Claim
30 words
The method of claim 11, further including the step of aligning the air blower to substantially align the air blower to the plurality of apertures and the plurality of pads.
Claim 15
Dependent Claim
24 words
The method of claim 8, wherein the step of providing the liquid includes the step of dispensing solder flux in the plurality of apertures.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-10-17 | 1998-04-18 | 1998-10-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-10-17 | 2002-04-18 | 2002-10-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-10-17 | 2006-04-18 | 2006-10-18 | $7700.00 | Window Closed / Lapsed |