US5355580A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for replacing semiconductor chips
Assignee: Ultratech Inc
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Filing: 1992-11-16
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Granted: 1994-10-18
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Expires: 2012-11-16
Abstract
Abstract A face-down bonded semiconductor chip 4 encapsulated with a resin 14 is removed from the substrate 2 with a cutting end mill 26. The resin 14 and bump electrodes 6 remaining on the substrate 2 are then cut with a finishing end mill to a height of about one half of the original height to planarize the surface. Another chip 4A having bump electrodes 6A is aligned with the bump electrodes 6 on the substrate 2, and bonded face down on the substrate. Finally, resin 14A is flowed into the gap between the chip 4A and the substrate 2 and around the chip 4A to encapsulate the chip.
Inventors
- 👤 Yutaka Tsukada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 10:22
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20; H10W72/251; H10W72/252; H10W72/851; H10W72/853; H10W72/856; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49815; Y10T29/49821
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
97 words
A method for replacing a semiconductor chip bonded face down to a substrate by bump electrodes with the space between the bottom surface of said semiconductor chip and said substrate being filled with an encapsulation resin, comprising the steps of: mechanically removing said chip from said substrate; planarizing the surface of said resin and said bump electrodes remaining on said substrate; bonding another chip to the bump electrodes on said substrate through the use of other bump electrodes; and filling the space between the bottom surface of said another chip and said substrate with an encapsulation resin.
Claim 2
Independent Claim
97 words
A method for replacing a semiconductor chip bonded face down to a substrate by bump electrodes with the space between the bottom surface of said semiconductor chip and said substrate being filled with an encapsulation resin, comprising the steps of: mechanically removing said chip from said substrate; planarizing the surface of said resin and said bump electrodes remaining on said substrate; bonding another chip to the bump electrodes on said substrate through the use of other bump electrodes; and filling the space between the bottom surface of said another chip and said substrate with an encapsulation resin.
Claim 3
Dependent Claim
23 words
The method for replacing a semiconductor chip as claimed in claim 1, in which the removal of said chip is accomplished by milling.
Claim 4
Dependent Claim
20 words
The method for replacing a semiconductor chip as claimed in claim 1, in which said planarizing is performed by milling.
Claim 5
Dependent Claim
44 words
The method for replacing a semiconductor chip as claimed in claim 3, in which said milling is performed such that the height of said resin and bump electrodes left on said substrate is about half or more the original height of the bump electrodes.
Claim 6
Dependent Claim
49 words
The method for replacing a semiconductor chip as claimed in claim 1, in which the bump electrodes on said substrate and the bump electrodes for bonding said another chip to the bump electrodes on said substrate comprises solder, and the latter bump electrodes are attached to said another chip.
Claim 7
Dependent Claim
63 words
The method for replacing a semiconductor chip as claimed in claim 5, further including the step of depositing a solder, having a melting point lower than the melting points of the solder bumps on said substrate and the solder bumps of said another chip, to at least one of the solder bumps on said substrate and the solder bumps of said another chip.
Claim 8
Dependent Claim
59 words
The method for replacing a semiconductor chip as claimed in claim 6, in which the bonding of said another chip is performed by exposing said substrate to a temperature higher than the melting point of said deposited solder but lower than the melting points of the solder bumps of said another chip and the solder bumps on said substrate.
References Cited (Backward Citations)
JPS5848932A
Cited
JPS62276837A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-10-17 | 1998-04-18 | 1998-10-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-10-17 | 2002-04-18 | 2002-10-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-10-17 | 2006-04-18 | 2006-10-18 | $7700.00 | Window Closed / Lapsed |