Preparation of semiconductor device

Abstract

Abstract PURPOSE:To easily realize chip replacement even in the junction system as in the case of the flat package by covering it with a substance which cannot be bonded with the element sealing resin or makes difficult the bonding thereto. CONSTITUTION:The LSI chip 3 having the plurality of electrode connecting bump 4 is placed on the substrate 1 forming the wiring conductor 2 and is sealed by the resin 5 after connecting the bump 4 and wiring 2. At this time, a substance which cannot be bonded with the resin 5 or makes difficult the bonding thereto (Si system resin for the epoxy resin) is coated to the area other than the wiring conductor between the substrate 1 and resin 5. According to this structure, chip can be replaced easily by heating the junction part of bump and conductor without causing any damage on the substrate and thereby manufacturing cost can be reduced with excellent yield of substrate.

Inventors

• 👤 Yoshio Okajima
• 👤 良男 岡嶋

Bibliographic Details