US5354955A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Direct jump engineering change system
Assignee: International Business Machines Corp
•
Filing: 1992-12-02
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Granted: 1994-10-11
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Expires: 2012-12-02
Abstract
Abstract A multi-layer interposer in which the X-Y engineering change wiring pattern in the interposer terminates in a pattern of pads on the upper surface of the interposer around the periphery of the chip. In order to make an engineering change, a jumper wire connect pads on adjacent interposers mounted on the multi-chip module.
Inventors
- 👤 Lawrence V. Gregor
- 👤 Michael F. McAllister
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 05:43
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/092; H10W70/60; H10W70/611; H10W70/62; H10W70/641; H10W70/63; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
164 words
A system to facilitate establishing an engineering change wiring path between one I/O pad of an integrated circuit chip mounted on a module and another I/O pad of an integrated circuit chip mounted on said module, comprising in combination: a peripheral pattern of pads accessible from a top surface of said module, said peripheral pattern of pads including, engineering change pads, X jumper wire pads, Y jumper wire pads, and X-Y change pads; an X wiring layer interconnecting X jumper wire pads located at opposite sides of said module and also connecting X-Y change pads in a line with said X jumper wire pads located at opposite sides of said module; a Y wiring layer interconnecting Y jumper wire pads located at opposite sides of said module and interconnecting X-Y change pads in a line with said Y jumper wire pads at located opposite sides of said module; and wires connecting said I/O pads of an integrated circuit chip to said engineering change pads.
Claim 2
Independent Claim
164 words
A system to facilitate establishing an engineering change wiring path between one I/O pad of an integrated circuit chip mounted on a module and another I/O pad of an integrated circuit chip mounted on said module, comprising in combination: a peripheral pattern of pads accessible from a top surface of said module, said peripheral pattern of pads including, engineering change pads, X jumper wire pads, Y jumper wire pads, and X-Y change pads; an X wiring layer interconnecting X jumper wire pads located at opposite sides of said module and also connecting X-Y change pads in a line with said X jumper wire pads located at opposite sides of said module; a Y wiring layer interconnecting Y jumper wire pads located at opposite sides of said module and interconnecting X-Y change pads in a line with said Y jumper wire pads at located opposite sides of said module; and wires connecting said I/O pads of an integrated circuit chip to said engineering change pads.
Claim 3
Dependent Claim
35 words
A system to facilitate establishing a engineering change wiring path as in claim 1, wherein said X-Y change pads are each comprised of four discrete sections with a removable conductive link between, in each section.
Claim 4
Dependent Claim
25 words
A system to facilitate establishing a wiring path as in claim 1, wherein said engineering change pads comprise a majority of pad in said pattern.
Claim 5
Dependent Claim
34 words
A system to facilitate establishing a wiring path as in claim 1, wherein said X jumper wire pads and said Y jumper wire pads are located at an outer peripheral edge of said pattern.
Claim 6
Dependent Claim
25 words
A system to facilitate establishing a wiring path as in claim 2, wherein said engineering change pads comprise a majority of pad in said pattern.
Claim 7
Dependent Claim
34 words
A system to facilitate establishing a wiring path as in claim 2, wherein said X jumper wire pads and said Y jumper wire pads are located at an outer peripheral edge of said pattern.
Claim 8
Dependent Claim
34 words
A system to facilitate establishing a wiring path as in claim 3, wherein said X jumper wire pads and said Y jumper wire pads are located at an outer peripheral edge of said pattern.
Claim 9
Dependent Claim
171 words
An interposer to facilitate establishing an engineering change wiring path between one I/O pad of an integrated circuit chip mounted on one interposer and another I/O pad of an integrated circuit chip mounted on another interposer, each of said interposers comprising in combination: a peripheral pattern of pads accessible from a top surface of said interposer, said peripheral pattern of pads including, engineering change pads, X jumper wire pads, Y jumper wire pads, and X-Y change pads; an embedded X wiring layer interconnecting X jumper wire pads located at opposite sides of said interposer and also connecting X-Y change pads in a line with said X jumper wire pads located at opposite sides of said interposer; an embedded Y wiring layer interconnecting Y jumper wire pads located at opposite sides of said interposer and interconnecting X-Y change pads in a line with said Y jumper wire pads at located opposite sides of said interposer; and embedded wires connecting said I/O pads of an integrated circuit chip to said engineering change pads.
Claim 10
Dependent Claim
171 words
An interposer to facilitate establishing an engineering change wiring path between one I/O pad of an integrated circuit chip mounted on one interposer and another I/O pad of an integrated circuit chip mounted on another interposer, each of said interposers comprising in combination: a peripheral pattern of pads accessible from a top surface of said interposer, said peripheral pattern of pads including, engineering change pads, X jumper wire pads, Y jumper wire pads, and X-Y change pads; an embedded X wiring layer interconnecting X jumper wire pads located at opposite sides of said interposer and also connecting X-Y change pads in a line with said X jumper wire pads located at opposite sides of said interposer; an embedded Y wiring layer interconnecting Y jumper wire pads located at opposite sides of said interposer and interconnecting X-Y change pads in a line with said Y jumper wire pads at located opposite sides of said interposer; and embedded wires connecting said I/O pads of an integrated circuit chip to said engineering change pads.
Claim 11
Dependent Claim
27 words
An interposer as in claim 8, wherein said X-Y change pads are each comprised of four discrete sections with a removable conductive link between, in each section.
Claim 12
Dependent Claim
19 words
An interposer as in claim 9, wherein said engineering change pads comprise a majority of pad in said pattern.
Claim 13
Dependent Claim
28 words
An interposer as in claim 10, wherein said X jumper wire pads and said Y jumper wire pads are located at an outer peripheral edge of said pattern.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-10-10 | 1998-04-11 | 1998-10-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-10-10 | 2002-04-11 | 2002-10-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-10-10 | 2006-04-11 | 2006-10-11 | $7700.00 | Window Closed / Lapsed |