Patent US5354593A successfully refreshed from Google Patents.
US5354593A
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Multilayer circuit board having microporous layers and method for making same
Assignee: Schneider Electric Systems USA Inc
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Filing: 1992-11-10
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Granted: 1994-10-11
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Expires: 2012-11-10
Abstract
Abstract A microporous, photoprocessable, moderately hydrophilic material on which metal can be deposited directly using electroless plating techniques, and its use in preparing printed wiring boards and circuit components.
Inventors
- 👤 Paul E. Grandmont
- 👤 Harold Lake
- 👤 Richard A. Anderson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:18
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/465; H05K3/0011; H05K3/0017; H05K3/0023; H05K3/0041; H05K3/4652; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/0364; H05K2201/0376; H05K2201/0388; H05K2201/0394; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09563; H05K2203/00; H05K2203/05; H05K2203/0548; H05K2203/0554; H05K2203/10; H05K2203/107; H05K3/002; H05K3/0026; H05K3/0032; H05K3/0035; H05K3/10; H05K3/108; H05K3/18; H05K3/181; H05K3/182; H05K3/184; H05K3/22; H05K3/24; H05K3/244; H05K3/38; H05K3/389; H05K3/40; H05K3/42; H05K3/422; H05K3/4661; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10S428/913; Y10T; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24322; Y10T428/24802; Y10T428/24917; Y10T428/31504; Y10T428/31678
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
37 words
A printed wiring board comprising a patternable circuit layer made of a first material and a via layer made of a cured microporous photopolymer whose chemical composition is different from the chemical composition of said first material.
Claim 2
Dependent Claim
37 words
A printed wiring board comprising a patternable circuit layer made of a first material and a via layer made of a cured microporous photopolymer whose chemical composition is different from the chemical composition of said first material.
Claim 3
Dependent Claim
24 words
The printed wiring board of claim 1 wherein said photopolymer is a moderately hydrophilic photopolymer having a wetting tension of at least 52 dynes/cm.
Claim 4
Dependent Claim
16 words
The printed wiring board of claim 1 wherein the micropores of said photopolymer are fractal micropores.
Claim 5
Dependent Claim
42 words
The printed wiring board of claim 1 wherein said photopolymer comprises the polymerized product of an ethylenically unsaturated monomer, a polymerization initiator activatable by actinic radiation, at least one preformed, water-soluble, polymeric binder, and a particulate inorganic filler transparent to actinic radiation.
Claim 6
Dependent Claim
16 words
The printed wiring board of claim 4 wherein said filler is chemically bonded to said binder.
Claim 7
Dependent Claim
26 words
The printed wiring board of claim 1 wherein said via layer comprises two layers of a cured microporous photopolymer separated by a layer of woven fabric.
Claim 8
Dependent Claim
34 words
The printed wiring board of claim 6 wherein said woven fabric comprises a material capable of bonding to said photopolymer and having a refractive index that substantially matches the refractive index of said photopolymer.
Claim 9
Dependent Claim
28 words
The printed wiring board of claim 6 wherein the thickness of the uppermost layer of said photopolymer is less than the diameter of the micropores in said photopolymer.
Claim 10
Dependent Claim
43 words
The printed wiring board of claim 6 wherein said microporous photopolymer comprises the polymerized product of an ethylenically unsaturated monomer, a polymerization initiator activatable by actinic radiation, at least one preformed, water-soluble, polymeric binder, and a particulate inorganic filler transparent to actinic radiation.
Claim 11
Dependent Claim
16 words
The printed wiring board of claim 7 wherein said filler is chemically bonded to said binder.
Claim 12
Dependent Claim
26 words
The printed wiring board of claim 1 wherein said circuit layer comprises a cured moderately hydrophobic photopolymer having a wetting tension of less than 40 dynes/cm.
Claim 13
Dependent Claim
51 words
The printed wiring board of claim 11 wherein said hydrophobic photopolymer comprises the polymerized product of a monomer which is a half acryloyl ester of bisphenol A epoxy monomer, a polymerization initiator activatable by actinic radiation, and at least one preformed elastomeric polymeric binder that is substantially free of acidic groups.
Claim 14
Dependent Claim
17 words
The printed wiring board of claim 12 wherein said said hydrophobic photopolymer further comprises an acrylated urethane.
Claim 15
Dependent Claim
15 words
A circuit component comprising an inductor, transformer, or capacitor fabricated from a microporous photoprocessable material.
Claim 16
Dependent Claim
15 words
A circuit component comprising an inductor, transformer, or capacitor fabricated from a microporous photoprocessable material.
Claim 17
Dependent Claim
37 words
The component of claim 14 wherein said photoprocessable material comprises an ethylenically unsaturated monomer, a polymerization initiator activatable by actinic radiation, at least one preformed, water-soluble, polymeric bonder, and a particulate inorganic filler transparent to actinic radiation.
Claim 18
Dependent Claim
14 words
The component of claim 15 wherein said filler is chemically bonded to said binder.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-10-10 | 1998-04-11 | 1998-10-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-10-10 | 2002-04-11 | 2002-10-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-10-10 | 2006-04-11 | 2006-10-11 | $7700.00 | Window Closed / Lapsed |