Patent US5350811A successfully refreshed from Google Patents.
US5350811A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Epoxy resin and adhesive composition containing the same
Assignee: Resonac Corp
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Filing: 1993-06-17
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Granted: 1994-09-27
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Expires: 2013-06-17
Abstract
Abstract An adhesive composition comprising (a) an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane dianhydride with an alcohol or alcohol derivative, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups and (b) a curing agent is suitable for bonding semiconductor chips to a copper frame with a small warpage of the chips.
Inventors
- 👤 Nobuo Ichimura
- 👤 Mitsuo Yamazaki
- 👤 Kohei Fujita
- 👤 Hidetaka Satou
- 👤 Yasuo Miyamoto
- 👤 Masao Kawasumi
- 👤 Tohru Kikuchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 18:09
CPC Classifications
H; H01; H01B; H01B1/00; H01B1/20; H01B1/22; C; C08; C08G; C08G59/00; C08G59/02; C08G59/12; C08G59/18; C08G59/20; C08G59/32; C08G59/3254; H01B1/24
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
70 words
A process for producing a semiconductor device which comprises bonding a semiconductor chip to a metallic layer with an adhesive composition; said composition comprising an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane dianhydride with an alcohol, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups.
Claim 2
Dependent Claim
70 words
A process for producing a semiconductor device which comprises bonding a semiconductor chip to a metallic layer with an adhesive composition; said composition comprising an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane dianhydride with an alcohol, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups.
Claim 3
Dependent Claim
30 words
A process according to claim 1, wherein an epoxy compound having one epoxy group and the epoxy compound having two or more epoxy groups are reacted with the 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane.
Claim 4
Dependent Claim
114 words
A semiconductor device comprising a lead frame, an adhesive composition coated on an island of the lead frame, a semiconductor element placed on the adhesive composition and bonded to the island of the lead frame via the adhesive composition, wires connecting the semiconductor element and the lead frame, and a molded resin encapsulating the whole of the lead frame and the semiconductor element; wherein said adhesive composition comprises an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane dianhydride with an alcohol, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups.
Claim 5
Dependent Claim
114 words
A semiconductor device comprising a lead frame, an adhesive composition coated on an island of the lead frame, a semiconductor element placed on the adhesive composition and bonded to the island of the lead frame via the adhesive composition, wires connecting the semiconductor element and the lead frame, and a molded resin encapsulating the whole of the lead frame and the semiconductor element; wherein said adhesive composition comprises an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane dianhydride with an alcohol, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-09-26 | 1998-03-28 | 1998-09-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-09-26 | 2002-03-28 | 2002-09-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-09-26 | 2006-03-28 | 2006-09-27 | $7700.00 | Window Closed / Lapsed |