US5349501A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic device adaptive to mounting on a printed wiring board
Assignee: United Microelectronics Corp
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Filing: 1992-10-09
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Granted: 1994-09-20
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Expires: 2012-10-09
Abstract
Abstract An electronic device adaptive to mounting on a printed wiring board, which has outer leads that are not subject to be deformed by external force, which helps improve positioning precision when it is mounted, and which can be transported at a reduced cost. A plurality of conductor leads connected to an electronic circuit provided in the electronic device extend along a peripheral surface of the package, and at least the ends of the conductor leads are fixed to the peripheral surface of the package to constitute input/output terminals of the electronic circuit. Preferably, the conductor leads are formed on a flexible film, bent along the peripheral surface of the package together with the film and are fixed to a bottom surface of the package via the film. Preferably, furthermore, a film in the form of a tape is employed, and a plurality of packages are arranged and supported on the film while maintaining a predetermined distance between one another.
Inventors
- 👤 Youji Kawakami
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 22:57
CPC Classifications
H; H05; H05K; H05K13/00; H05K13/0092
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
96 words
A semiconductor package adaptive to mounting on a circuit board, comprising: a semiconductor element; a substrate made from a flexible material and including a carrying portion for mounting the semiconductor element thereon; a plurality of leads formed on the substrate, electrically connected to the semiconductor element, and extending toward predetermined position on the substrate; and a resin portions molded onto said semiconductor element, the substrate, and portions other than an end portions of the leads; wherein at least ends of said leads remaining in an exposed state are adhered to a surface of said resin portion.
Claim 2
Dependent Claim
96 words
A semiconductor package adaptive to mounting on a circuit board, comprising: a semiconductor element; a substrate made from a flexible material and including a carrying portion for mounting the semiconductor element thereon; a plurality of leads formed on the substrate, electrically connected to the semiconductor element, and extending toward predetermined position on the substrate; and a resin portions molded onto said semiconductor element, the substrate, and portions other than an end portions of the leads; wherein at least ends of said leads remaining in an exposed state are adhered to a surface of said resin portion.
Claim 3
Dependent Claim
30 words
The semiconductor package according to claim 1, wherein said end portions of the leads remaining in the exposed state are bent along a peripheral surface of the molded resin portion.
Claim 4
Dependent Claim
46 words
The semiconductor package according to claim 1, wherein said end portions of the leads remaining in the exposed state are bend along a peripheral surface of the mounted resin portion and adhered to side and bottom surfaces of the molded resin portion by an adhesive agent.
Claim 5
Dependent Claim
30 words
The semiconductor package according to claim 1, wherein said at least the end of said lead remaining in the exposed state is adhered to the surface by an adhesive means.
Claim 6
Dependent Claim
126 words
A semiconductor package adaptive to mounting on a circuit board comprising; a semiconductor element; a substrate made from a flexible material and including a carrying portion for mounting the semiconductor element thereon; a first lead formed on the substrate, electrically connected to said semiconductor element, and extending toward a predetermined position on the substrate; a resin portion molded onto said semiconductor element, the substrate, and portions other than an end portion of the first lead; and a second lead electrically connected to the first lead at the end portion thereof and being exposed on the surface of the molded resin, said second lead extending along the resin portion, with at least end of said second lead being adhered to a peripheral surface of said resin portion.
Claim 7
Dependent Claim
126 words
A semiconductor package adaptive to mounting on a circuit board comprising; a semiconductor element; a substrate made from a flexible material and including a carrying portion for mounting the semiconductor element thereon; a first lead formed on the substrate, electrically connected to said semiconductor element, and extending toward a predetermined position on the substrate; a resin portion molded onto said semiconductor element, the substrate, and portions other than an end portion of the first lead; and a second lead electrically connected to the first lead at the end portion thereof and being exposed on the surface of the molded resin, said second lead extending along the resin portion, with at least end of said second lead being adhered to a peripheral surface of said resin portion.
Claim 8
Dependent Claim
21 words
The semiconductor package according to claim 5, wherein said second lead is formed by plating the surface of said molded resin.
Claim 9
Dependent Claim
20 words
The semiconductor package according to claim 5, wherein said second lead is bent along the surface of the resin portion.
Claim 10
Dependent Claim
39 words
The semiconductor package according to claim 5, wherein said second lead is bent along a peripheral surface of the molded resin portion and is adhered to side and bottom surfaces of the molded resin portion by an adhesive agent.
Claim 11
Dependent Claim
26 words
The semiconductor package according to claim 5, wherein said at least another end of said second lead is adhered to the surface by an adhesive means.
References Cited (Backward Citations)
JPS5854499A
Cited
US4873615A
Cited
US5191404A
Cited
US5065281A
Cited
JPH047862A
Cited
JPH0457349A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-09-19 | 1998-03-21 | 1998-09-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-09-19 | 2002-03-21 | 2002-09-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-09-19 | 2006-03-21 | 2006-09-20 | $7700.00 | Window Closed / Lapsed |