← Back to Patent Explorer
US5347158A Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor device having a particular terminal arrangement

Assignee: Toshiba Corp
•
Filing: 1993-08-18
•
Granted: 1994-09-13
•
Expires: 2013-08-18
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A semiconductor device for accomplishing high speed switchings with a large current includes a radiation plate, a first conductor fixed on said radiation plate, a first insulating layer fixed on said first conductor, a second conductor fixed on said first insulating layer, at least one semiconductor element and a second insulating layer fixed on said second conductor, a third conductor fixed on said second insulating layer, a fourth conductor for electrically connecting the surface electrode of said semiconductor element with said third conductor, a first power terminal fixed on said second conductor, and a second power terminal fixed on said third conductor. To reduce the internal inductance, said first and second power terminals have a flat part whose width is larger in length than the height. Also, these terminals are adjacently arranged substantially parallel to each other. In this device, the main currents on said first and second power terminals, and on said second and fourth conductors flow in the opposite directions, thus further reducing the internal inductance.

Inventors

  • 👤 Tadashi Matsuda
  • 👤 Tetsujiro Tsunoda

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 16:40
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/501; H10W40/00; H10W40/60; H02; H02M; H02M7/00; H02M7/003; H10W20/00; H10W20/40; H10W40/20; H10W40/22; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/658; H10W72/00; H10W72/851; H10W90/00; H10W72/50; H10W72/531; H10W72/5363; H10W72/541; H10W72/5445; H10W72/551; H10W72/552; H10W72/5524; H10W74/00; H10W90/701; H10W90/751; H10W90/754

Claims Analysis

Total Claims: 18
Claim 1
Independent Claim 93 words
A semiconductor device, comprising: a radiation plate; a first conductor fixed on said radiation plate; a first insulating layer fixed on said first conductor; a second conductor fixed on said first insulating layer; at least one semiconductor element and a second insulating layer fixed on said second conductor; a third conductor fixed on said second insulating layer; a fourth conductor for electrically connecting the surface electrode of said semiconductor element with said third conductor; a first power terminal fixed on said second conductor; and a second power terminal fixed on said third conductor.
Claim 2
Dependent Claim 93 words
A semiconductor device, comprising: a radiation plate; a first conductor fixed on said radiation plate; a first insulating layer fixed on said first conductor; a second conductor fixed on said first insulating layer; at least one semiconductor element and a second insulating layer fixed on said second conductor; a third conductor fixed on said second insulating layer; a fourth conductor for electrically connecting the surface electrode of said semiconductor element with said third conductor; a first power terminal fixed on said second conductor; and a second power terminal fixed on said third conductor.
Claim 3
Dependent Claim 25 words
The semiconductor device as claimed in claim 1, wherein said second insulating layer has areas existing between said semiconductor element and said first power terminal.
Claim 4
Dependent Claim 35 words
The semiconductor device as claimed in claim 1, wherein said device is so structured that the main current on said second conductor flows in the opposite direction of the main current on said fourth conductor.
Claim 5
Dependent Claim 100 words
A semiconductor device, comprising: a radiation plate; a plurality of packaging substrates fixed on said radiation plate; each of said packaging substrates having a first conductor, a first insulating layer fixed on said first conductor, a second conductor fixed on said first insulating layer, a second insulating layer fixed on said second conductor, and a third conductor fixed on said second insulating layer; at least one semiconductor element fixed on said second conductor contained in said at least one packaging substrate; and fourth conductors for electrically connecting said plurality of packaging substrates with each other at a plurality of points.
Claim 6
Dependent Claim 100 words
A semiconductor device, comprising: a radiation plate; a plurality of packaging substrates fixed on said radiation plate; each of said packaging substrates having a first conductor, a first insulating layer fixed on said first conductor, a second conductor fixed on said first insulating layer, a second insulating layer fixed on said second conductor, and a third conductor fixed on said second insulating layer; at least one semiconductor element fixed on said second conductor contained in said at least one packaging substrate; and fourth conductors for electrically connecting said plurality of packaging substrates with each other at a plurality of points.
Claim 7
Dependent Claim 29 words
The semiconductor device as claimed in claim 4, wherein said packaging substrates are fixed on said radiation plate in such a way of facing each other in point symmetry.
Claim 8
Dependent Claim 16 words
The semiconductor device as claimed in claim 4, wherein said packaging substrates have the same structure.
Claim 9
Dependent Claim 91 words
A semiconductor device, comprising: a first conductor; a first insulating layer fixed on said first conductor; a second conductor fixed on said first insulating layer; at least one semiconductor element fixed on said second conductor; a first power terminal electrically connected with the front surface electrode of said semiconductor element; and a second power terminal electrically connected with the back surface electrode of said semiconductor element; wherein either one of said first or second power terminal has a flat part in which the width is larger than the height in magnitude.
Claim 10
Dependent Claim 91 words
A semiconductor device, comprising: a first conductor; a first insulating layer fixed on said first conductor; a second conductor fixed on said first insulating layer; at least one semiconductor element fixed on said second conductor; a first power terminal electrically connected with the front surface electrode of said semiconductor element; and a second power terminal electrically connected with the back surface electrode of said semiconductor element; wherein either one of said first or second power terminal has a flat part in which the width is larger than the height in magnitude.
Claim 11
Dependent Claim 21 words
The semiconductor device as claimed in claim 7, wherein said flat part of said power terminal has a plurality of bumpers.
Claim 12
Dependent Claim 25 words
The semiconductor device as claimed in claim 7, wherein said flat part of said power terminal has a plurality of bumpers arranged in a row.
Claim 13
Dependent Claim 33 words
The semiconductor device as claimed in claim 9, wherein the width of said flat part is wider than the distance between said bumpers which exist at the both ends of this flat part.
Claim 14
Dependent Claim 31 words
The semiconductor device as claimed in claim 7, wherein each of said first and second power terminals has said flat part, and these parts are arranged substantially parallel to each other.
Claim 15
Dependent Claim 49 words
The semiconductor device as claimed in claim 11, wherein the distance between said flat parts of said first and second power terminals is less than 1/5 of the flat part width of either one of said first or second terminal whose width is smaller than that of the other.
Claim 16
Dependent Claim 31 words
The semiconductor device as claimed in claim 11, wherein each flat part of said first and second power terminals has bumpers, and these bumpers are arranged substantially parallel with each other.
Claim 17
Dependent Claim 27 words
The semiconductor device as claimed in claim 7, wherein either one of said first or second power terminal has a plurality of holes for connecting external wires.
Claim 18
Dependent Claim 37 words
The semiconductor device as claimed in claim 7, wherein said device is so constructed that the main current on said first power terminal flows in the opposite direction of the main current on said second power terminal.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-09-12 1998-03-14 1998-09-13 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2001-09-12 2002-03-14 2002-09-13 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2005-09-12 2006-03-14 2006-09-13 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag