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US5345365A Expired / Lapsed US ⏱️ 0.0 years remaining

Interconnection system for high performance electronic hybrids

Assignee: Massachusetts Institute of Technology
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Filing: 1992-05-05
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Granted: 1994-09-06
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Expires: 2012-05-05
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Abstract

Abstract An interconnection system for high performance electronic hybrids employs micro-machined features on a substrate to connect directly to miniature electronic components, such as integrated circuits. The micro-machined features may include posts for connecting to bonding pads of standard components and may also include rails for alignment of components and connections to specially made components.

Inventors

  • 👤 Terry O. Herndon
  • 👤 Jack I. Raffel

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 08:18
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H10W72/00; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K3/32; H05K3/325; H05K3/326; H05K3/40; H05K3/4007

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 180 words
A system for electrically interconnecting a plurality of electrical contacts disposed on a surface of a plurality of miniature electronic components, said system comprising: a substrate for receiving said at least one miniature electronic component; a plurality of raised elements disposed on said substrate, including a plurality of raised elements positioned for corresponding engagement with said plurality of electrical contacts of each said component; and conductive wiring disposed on said substrate and further extending over said plurality of raised elements positioned for corresponding engagement with said plurality of electrical contacts; and means for applying a force between said at least one component and said plurality of raised elements to urge said electrical contacts into intimate engagement with said conductive wiring extending over said plurality of raised elements and thus to establish and maintain electrical connections there between, including a pressure plate for receiving a force from said means for applying a force and means disposed in engagement with said plurality of components for causing a force received by said pressure plate to be evenly distributed across said plurality of components.
Claim 2
Independent Claim 180 words
A system for electrically interconnecting a plurality of electrical contacts disposed on a surface of a plurality of miniature electronic components, said system comprising: a substrate for receiving said at least one miniature electronic component; a plurality of raised elements disposed on said substrate, including a plurality of raised elements positioned for corresponding engagement with said plurality of electrical contacts of each said component; and conductive wiring disposed on said substrate and further extending over said plurality of raised elements positioned for corresponding engagement with said plurality of electrical contacts; and means for applying a force between said at least one component and said plurality of raised elements to urge said electrical contacts into intimate engagement with said conductive wiring extending over said plurality of raised elements and thus to establish and maintain electrical connections there between, including a pressure plate for receiving a force from said means for applying a force and means disposed in engagement with said plurality of components for causing a force received by said pressure plate to be evenly distributed across said plurality of components.
Claim 3
Dependent Claim 70 words
A system as defined in claim 1, wherein said means for causing a force received by said pressure plate to be evenly distributed further comprises: a plurality of recesses defined in said pressure plate for receiving said plurality of components and having depths such that each said surface of said plurality of components on which said electrical contacts are disposed are coplanar when said plurality of components have been received.
Claim 4
Dependent Claim 42 words
A system as defined in claim 1, wherein said means for causing a force received by said pressure plate to be evenly distributed further comprises: a sack filled with a non-compressible fluid, disposed between said pressure plate and said plurality of components.
Claim 5
Dependent Claim 39 words
A system as defined in claim 3, wherein said sack further comprises: means for accepting the introduction of a flow of fluid into said sack; and means for allowing the extraction of a flow of fluid from said sack.
Claim 6
Dependent Claim 37 words
A system as defined in claim 1, wherein said means for causing a force received by said pressure plate to be evenly distributed further comprises: compressible material, disposed between said pressure plate and said plurality of components.
Claim 7
Dependent Claim 32 words
A system as defined in claim 5, wherein said means for causing a force received by said pressure plate to be evenly distributed further comprises: a sack for containing the compressible material.
Claim 8
Dependent Claim 40 words
A system as defined in claim 1, wherein said means for causing a force received by said pressure plate to be evenly distributed further comprises: a quantity of compressible foam, disposed between said pressure plate and said plurality of components.
Claim 9
Independent Claim 169 words
A system for electrically interconnecting a plurality of electrical contacts disposed on a surface of at least one miniature electronic component including at least one alignment rail having the electrical contacts disposed thereon, said system comprising: a substrate for receiving said at least one miniature electronic component; a plurality of raised elements disposed on said substrate, including a plurality of raised elements positioned for corresponding engagement with said plurality of electrical contacts of each said component; and conductive wiring disposed on said substrate and further extending over said plurality of raised elements positioned for corresponding engagement with said plurality of electrical contacts; and means for applying a force between said at least one component and said plurality of raised elements to urge said electrical contacts into intimate engagement with said conductive wiring extending over said plurality of raised elements and thus to establish and maintain electrical connections there between, and wherein said plurality of raised elements are sidewalls of mating rails for engaging said at least one alignment ridge.
Claim 10
Independent Claim 169 words
A system for electrically interconnecting a plurality of electrical contacts disposed on a surface of at least one miniature electronic component including at least one alignment rail having the electrical contacts disposed thereon, said system comprising: a substrate for receiving said at least one miniature electronic component; a plurality of raised elements disposed on said substrate, including a plurality of raised elements positioned for corresponding engagement with said plurality of electrical contacts of each said component; and conductive wiring disposed on said substrate and further extending over said plurality of raised elements positioned for corresponding engagement with said plurality of electrical contacts; and means for applying a force between said at least one component and said plurality of raised elements to urge said electrical contacts into intimate engagement with said conductive wiring extending over said plurality of raised elements and thus to establish and maintain electrical connections there between, and wherein said plurality of raised elements are sidewalls of mating rails for engaging said at least one alignment ridge.
Claim 11
Independent Claim 165 words
A system for electrically interconnecting a plurality of electrical contacts disposed on a surface of at least one miniature electronic component having sides, said system comprising: a substrate for receiving said at least one miniature electronic component; a plurality of raised elements disposed on said substrate, including a plurality of raised elements positioned for corresponding engagement with said plurality of electrical contacts of each said component; and conductive wiring disposed on said substrate and further extending over said plurality of raised elements positioned for corresponding engagement with said plurality of electrical contacts; and means for applying a force between said at least one component and said plurality of raised elements to urge said electrical contacts into intimate engagement with said conductive wiring extending over said plurality of raised elements and thus to establish and maintain electrical connections there between, and wherein said plurality of raised elements include alignment fences for properly aligning said components when said sides are in intimate contact with said alignment fences.
Claim 12
Independent Claim 165 words
A system for electrically interconnecting a plurality of electrical contacts disposed on a surface of at least one miniature electronic component having sides, said system comprising: a substrate for receiving said at least one miniature electronic component; a plurality of raised elements disposed on said substrate, including a plurality of raised elements positioned for corresponding engagement with said plurality of electrical contacts of each said component; and conductive wiring disposed on said substrate and further extending over said plurality of raised elements positioned for corresponding engagement with said plurality of electrical contacts; and means for applying a force between said at least one component and said plurality of raised elements to urge said electrical contacts into intimate engagement with said conductive wiring extending over said plurality of raised elements and thus to establish and maintain electrical connections there between, and wherein said plurality of raised elements include alignment fences for properly aligning said components when said sides are in intimate contact with said alignment fences.

References Cited (Backward Citations)

WO1985000467A1 Cited
WO1987004009A1 Cited
US4924353A Cited
EP0295914A2 Cited
US4813129A Cited
WO1990006592A1 Cited
JPH046841A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-09-05 1998-03-07 1998-09-06 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2001-09-05 2002-03-07 2002-09-06 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2005-09-05 2006-03-07 2006-09-06 $7700.00 Window Closed / Lapsed

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