Flexible heat transfer device

Claim 1

A flexible heat transfer device for dissipating heat from first and second electronic elements respectively mounted to first and second circuit boards disposed in a casing, the first circuit board disposed parallel to and below the second circuit board, the device comprising: a plurality of heat dissipation plates disposed on an exterior portion of the casing above the first and second circuit boards; a flexible envelopment defining a receiving space, the flexible envelopment formed as a flat tubular strip of plastic film comprising, a lower section attached to the first electronic element and defining a lower portion of the receiving space, an intermediate section attached to the second electronic element and defining an intermediate portion of the receiving space, and an upper section attached to the dissipation plates and defining an upper portion of the receiving space; a heat transfer fluid disposed within the receiving space and having a boiling point between an ambient temperature outside the casing and a desired temperature of the first and second electronic elements when active; wherein the heat from the first and second elements respectively conducts through the lower and intermediate sections of the envelopment into the lower and intermediate portions of the receiving space and converts the fluid into a vapor; wherein the vapor flows to and condenses in the upper portion of the receiving space, thereby transferring the heat through the upper section of the envelopment to the heat dissipation plates; wherein the condensed vapor flows back to the intermediate and lower portions of the receiving space; and whereby a reciprocal flow of the heat transfer liquid is formed between the upper portion and the intermediate and lower portions of the receiving space and the heat is transferred via the heat transfer fluid to the heat dissipation plates.