US5341685A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for non-destructive testing of inner lead tab bonds and semiconductor chips
Assignee: Lockheed Martin Corp
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Filing: 1993-04-05
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Granted: 1994-08-30
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Expires: 2013-04-05
Abstract
Abstract A method and an apparatus for determining the operability of a semiconductor chip including at least one bond between the semiconductor chip and at least one electrical lead, the at least one electrical lead having a first surface, the at least one bond connecting the first surface to the semiconductor chip. The apparatus has a handling carrier rigidly supporting the semiconductor chip, a test socket containing the handling carrier for providing an electrical path from the test socket to the at least one electrical lead and through the at least one bond to the semiconductor chip and back, and a computer for applying an electrical signal to the electrical path for generating an output signal. A gas nozzle is provided, positionable near the first surface, for directing a gas flow at the first surface while an electrical signal is applied. The gas flow generates a force on the electrical lead in a direction away from the semiconductor chip. The computer compares the output signal with a predetermined, characteristic signal to determine operability of the semiconductor chip.
Inventors
- 👤 Steven Malone
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 08:44
CPC Classifications
G; G01; G01N; G01N3/00; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2853; G01N2203/00; G01N2203/003; G01N2203/0042; G01N2203/0044; G01N2203/02; G01N2203/026; G01N2203/0296; G01N2203/06; G01N2203/0617
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
182 words
An apparatus for determining the operability of a semiconductor chip including at least one bond between the semiconductor chip and at least one electrical lead, the at least one electrical lead having a first surface, the at least one bond connecting the first surface to the semiconductor chip, the apparatus comprising: a handling carrier rigidly supporting the semiconductor chip; a test socket for containing the handling carrier and for providing an electrical path from the test socket to the at least one electrical lead and through the at least one bond to the semiconductor chip and back; means for applying an electrical signal to the electrical path for generating an output signal; a gas nozzle, positionable near the first surface for directing a gas flow at the first surface while an electrical signal is applied to the electrical path, the gas nozzle for generating a force on the electrical lead in a direction away from the semiconductor chip; and means for comparing the output signal with a predetermined, characteristic signal for determining operability of the semiconductor chip and at least one bond.
Claim 2
Independent Claim
182 words
An apparatus for determining the operability of a semiconductor chip including at least one bond between the semiconductor chip and at least one electrical lead, the at least one electrical lead having a first surface, the at least one bond connecting the first surface to the semiconductor chip, the apparatus comprising: a handling carrier rigidly supporting the semiconductor chip; a test socket for containing the handling carrier and for providing an electrical path from the test socket to the at least one electrical lead and through the at least one bond to the semiconductor chip and back; means for applying an electrical signal to the electrical path for generating an output signal; a gas nozzle, positionable near the first surface for directing a gas flow at the first surface while an electrical signal is applied to the electrical path, the gas nozzle for generating a force on the electrical lead in a direction away from the semiconductor chip; and means for comparing the output signal with a predetermined, characteristic signal for determining operability of the semiconductor chip and at least one bond.
Claim 3
Dependent Claim
19 words
The apparatus of claim 1, further comprising: a load board electrically connecting the comparing means to the test socket.
Claim 4
Dependent Claim
11 words
The apparatus of claim 1, wherein: the gas flow includes air.
Claim 5
Dependent Claim
18 words
The apparatus of claim 1, wherein: the at least one electrical lead includes a plurality of electrical leads.
Claim 6
Dependent Claim
25 words
The apparatus of claim 4, further comprising: means for sequentially positioning the gas nozzle from one of the plurality of electrical leads to the next.
Claim 7
Dependent Claim
11 words
The apparatus of claim 1, wherein: the gas flow is continuous.
Claim 8
Dependent Claim
29 words
The apparatus of claim 1, further comprising: means operatively connected to the gas nozzle for directing the gas flow at a predetermined flow rate for a predetermined time interval.
Claim 9
Dependent Claim
12 words
The apparatus of claim 1, wherein: the applying means is a computer.
Claim 10
Dependent Claim
12 words
The apparatus of claim 1, wherein: the comparing means is a computer.
Claim 11
Dependent Claim
14 words
The apparatus of claim 1, wherein: the comparing means is included within a computer.
Claim 12
Independent Claim
171 words
A method for testing the operability of a semiconductor chip including at least one bond between the semiconductor chip and at least one electrical lead, the at least one electrical lead having a first surface, and the at least one bond connecting the first surface to the semiconductor chip, the test comprising the steps of: mounting the semiconductor chip to a support to fixedly hold the semiconductor chip during testing; establishing an electrical path to the at least one electrical lead and through the at least one bond to the semiconductor chip and back; applying an electrical signal through the electrical path generating an output signal; positioning a gas nozzle a predetermined distance from the at least one electrical lead near the first surface; directing a gas flow at the first surface to generate a force on the electrical lead in a direction away from the semiconductor chip; and comparing the output signal with a predetermined, characteristic signal to determine operability of the semiconductor chip and the at least one bond.
Claim 13
Independent Claim
171 words
A method for testing the operability of a semiconductor chip including at least one bond between the semiconductor chip and at least one electrical lead, the at least one electrical lead having a first surface, and the at least one bond connecting the first surface to the semiconductor chip, the test comprising the steps of: mounting the semiconductor chip to a support to fixedly hold the semiconductor chip during testing; establishing an electrical path to the at least one electrical lead and through the at least one bond to the semiconductor chip and back; applying an electrical signal through the electrical path generating an output signal; positioning a gas nozzle a predetermined distance from the at least one electrical lead near the first surface; directing a gas flow at the first surface to generate a force on the electrical lead in a direction away from the semiconductor chip; and comparing the output signal with a predetermined, characteristic signal to determine operability of the semiconductor chip and the at least one bond.
Claim 14
Dependent Claim
41 words
The method of claim 11, wherein the at least one electrical lead is a plurality of electrical leads, the method further comprising the step of: applying the gas pressure successively to each individual electrical lead of the plurality of electrical leads.
Claim 15
Dependent Claim
27 words
The method of claim 11, wherein: the gas flow is directed at the first surface of the at least one electrical lead at a predetermined gas pressure.
Claim 16
Dependent Claim
41 words
The method of claim 11, wherein the at least one electrical lead includes a plurality of electrical leads, the method further comprising the step of: sequentially positioning the gas nozzle from one of the plurality of electrical leads to the next.
Claim 17
Dependent Claim
16 words
The method of claim 11, wherein: the gas flow directed at the first surface is continuous.
Claim 18
Dependent Claim
26 words
The method of claim 11, wherein: the gas flow directed at the first surface is applied at a predetermined flow rate for a predetermined time interval.
Claim 19
Dependent Claim
21 words
The method of claim 11, wherein: a computer applies the electrical signal to the electrical path to generate the output signal.
Claim 20
Dependent Claim
27 words
The method of claim 17, wherein: the computer also compares the output signal with a predetermined, characteristic signal to determine operability of the at least one bond.
Claim 21
Dependent Claim
26 words
The method of claim 11, wherein: a computer compares the output signal with a predetermined, characteristic signal to determine operability of the at least one bond.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-08-29 | 1998-02-28 | 1998-08-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-08-29 | 2002-02-28 | 2002-08-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-08-29 | 2006-02-28 | 2006-08-30 | $7700.00 | Window Closed / Lapsed |