Inspection of bondability of wire bonding

Abstract

Abstract PURPOSE:To obtain an inspection method which can be applied easily to all product chips without damaging a good product by a method wherein compressed air set to a prescribed pressure value is blown locally to a bonded wire and the bonding strength is judged by inspecting whether the wire is detached or not. CONSTITUTION:When the bondability of a wire bonding operation to connect an electrode of a semiconductor device 1 and another electrode of a semiconductor-device mounting body 2 by using wires 3 is to be inspected, compressed air 5 set to a prescribed pressure value is blown locally to the bonded wires 3 and the bonding strength is judged by inspecting whether the wires are detached or not. For example, a bare chip ic 1 is placed on a substrate 2; an electrode of the bare chip ic 1 and a bonding pad part of a substrate 2 are wire-bonded; compressed air 5 set to a prescribed pressure value by using an air-pressure regulator 4 is blown to the wires 3. This operation is executed at an air pressure of about 1-5 kg/cm<2>; the setting of the prescribed pressure is adjusted by referring to a guaranteed value of the wire strength.

Inventors

• 👤 Hiromasa Tsukamoto
• 👤 弘昌 塚本

Bibliographic Details