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US5340408A Expired / Lapsed US ⏱️ 0.0 years remaining

Inverse delta-doping for improved open circuit voltage of solar cells or photo diodes

Assignee: University of Delaware
•
Filing: 1993-04-19
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Granted: 1994-08-23
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Expires: 2013-04-19
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Abstract

Abstract A solar cell or photo diode has an n-type semiconductor layer and a p-type semiconductor layer which form a pn-junction at the metallurgical interface of the layers. A thin sheet of undoped semiconductor is located at the interface or the lower doped layer. The sheet has less recombination centers than its adjacent regions and prevents cross-doping of donors and acceptors from the n- and p-side by cross-diffusion to increase the open circuit voltage and fill-factor of the solar cells or photo diode.

Inventors

  • 👤 Karl W. Boer

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 01:50
CPC Classifications
H; H10; H10F; H10F77/00; H10F77/10; H10F77/14; H10F10/00; H10F10/10; H10F10/14; Y; Y02; Y02E; Y02E10/00; Y02E10/50; Y02E10/547

Claims Analysis

Total Claims: 20
Claim 1
Independent Claim 81 words
In a solar cell or photo diode device having an n-type semiconductor layer and a p-type semiconductor layer forming a pn-junction at the metallurgical interface of said layers, the improvement being in that a thin sheet with reduced density of recombination centers is inserted into a lesser doped region of said layers, said thin sheet being an inverse delta-doped sheet, said sheet having less recombination centers than its adjacent regions, to increase the open circuit voltage and fill-factor of said device.
Claim 2
Dependent Claim 81 words
In a solar cell or photo diode device having an n-type semiconductor layer and a p-type semiconductor layer forming a pn-junction at the metallurgical interface of said layers, the improvement being in that a thin sheet with reduced density of recombination centers is inserted into a lesser doped region of said layers, said thin sheet being an inverse delta-doped sheet, said sheet having less recombination centers than its adjacent regions, to increase the open circuit voltage and fill-factor of said device.
Claim 3
Dependent Claim 20 words
The device of claim 1 wherein said sheet of reduced density of recombination centers is of about 5-100 nm thickness.
Claim 4
Dependent Claim 25 words
The device of claim 2 wherein said inverse delta doped sheet is located where the electron and hole density are about equal to each other.
Claim 5
Dependent Claim 18 words
The device of claim 3 wherein said sheet is applied by molecular beam epitaxy onto a single crystal.
Claim 6
Dependent Claim 26 words
The device of claim 1 wherein one of said semiconductor layers is a top semiconductor layer which is heavily doped and applied by molecular beam epitaxy.
Claim 7
Dependent Claim 11 words
The device of claim 1 wherein said junction is a homojunction.
Claim 8
Dependent Claim 24 words
The device of claim 1 wherein said junction is a heterojunction, and said sheet is applied at or near the interface of said heterojunction.
Claim 9
Dependent Claim 19 words
The device of claim 1 wherein said sheet is located where the electron and hole density are about equal.
Claim 10
Dependent Claim 41 words
The device of claim 1 wherein within or close to said sheet of reduced recombination centers there is inserted a thin layer devoid of shallow dopants to prevent cross-doping of donors and acceptors and thereby avoid formation of close donor-acceptor pairs.
Claim 11
Dependent Claim 37 words
The device of claim 9 wherein said layer devoid of shallow dopants is located at a position close to n=p where it is able to reduce most effectively the recombinations caused by close donor-acceptor pairs near n=p.
Claim 12
Dependent Claim 17 words
The device of claim 9 wherein said thin layer is an i-layer of 2-20 atomic layers thick.
Claim 13
Dependent Claim 18 words
The device of claim 9 wherein said layer devoid of shallow dopants is within said inverse delta-doped sheet.
Claim 14
Dependent Claim 26 words
The device of claim 9 wherein said layer devoid of shallow dopants is in a layer between said inverse delta-doped sheet and a heavily doped layer.
Claim 15
Dependent Claim 23 words
The device of claim 9 wherein said layer devoid of shallow dopants is applied at the metallurgical boundary separating the n- and p-doping.
Claim 16
Dependent Claim 83 words
In a method of improving the open circuit voltage of a solar cell or photo diode device, wherein the device has an n-type semiconductor and a p-type semiconductor layer forming a pn-junction at the metallurgical interface of the layers, the improvement being in inserting within one of the layers a thin layer of an undoped semiconductor preventing formation of close donor-acceptor pairs, and inserting a thin sheet within one of the layers, with the sheet having less recombination centers than its adjacent regions.
Claim 17
Dependent Claim 83 words
In a method of improving the open circuit voltage of a solar cell or photo diode device, wherein the device has an n-type semiconductor and a p-type semiconductor layer forming a pn-junction at the metallurgical interface of the layers, the improvement being in inserting within one of the layers a thin layer of an undoped semiconductor preventing formation of close donor-acceptor pairs, and inserting a thin sheet within one of the layers, with the sheet having less recombination centers than its adjacent regions.
Claim 18
Dependent Claim 29 words
The method of claim 15 wherein said sheet is an inverse delta-doped sheet of 5-100 nm thickness and the undoped layer is of about a few atomic layers thickness.
Claim 19
Dependent Claim 20 words
The method of claim 16 including locating the inverse delta-doped sheet where the electron and hole densities are about equal.
Claim 20
Dependent Claim 33 words
The method of claim 17 wherein the device is made by growing of the semiconductors layers on top of a wafer, and forming the undoped layer and the sheet by molecular beam epitaxy.

References Cited (Backward Citations)

US4524237A Cited
US4681983A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-08-22 1998-02-21 1998-08-23 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2001-08-22 2002-02-21 2002-08-23 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2005-08-22 2006-02-21 2006-08-23 $7700.00 Window Closed / Lapsed

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