Patent US5340407A successfully refreshed from Google Patents.
US5340407A
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Process of removing soldering flux and/or adhesive tape residue from a substrate
Assignee: VANTAGE SPECIALTIES Inc
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Filing: 1992-06-09
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Granted: 1994-08-23
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Expires: 2012-06-09
Abstract
Abstract Disclosed is an industrial cleaning process in which a contaminant comprising soldering flux and/or adhesive tape residue is removed from a substrate contaminated therewith. The process comprises the steps of contacting the substrate with a terpene-based cleaning composition which is substantially free of water-soluble organic material; removing the composition and solubilized contaminant from the substrate by contact with water having a temperature of about 70° F. to about 140° F. for a period of time of no longer than about 10 minutes to provide a substrate having a contamination rating of no greater than about 14 micrograms NaCl equivalent/square inch (MIL-P-28809A), and to thereby form a mixture comprising the composition, contaminant and water. The process also comprises separating the water from said mixture, the separated water being substantially free of water-soluble organic material and having a chemical oxygen demand of no greater than about 1,000 ppm.
Inventors
- 👤 Paul L. Bolden
- 👤 Michael E. Hayes
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 14:40
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/26; C; C11; C11D; C11D3/00; C11D3/16; C11D3/18; C11D3/20; C11D3/2093; C11D3/43; C11D7/00; C11D7/50; C11D7/5004; C11D7/5027; C23; C23G; C23G5/00; C23G5/02; C23G5/024; C23G5/032; G; G03; G03F; G03F7/00; G03F7/26; G03F7/42; G03F7/422; C11D2111/00; C11D2111/10; C11D2111/14; C11D2111/22; C11D7/22; C11D7/24; C11D7/26; C11D7/263; C11D7/264; C11D7/266; H05K2203/00; H05K2203/07; H05K2203/0779; H05K2203/0783
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
151 words
An industrial cleaning process in which a contaminant comprising soldering flux and/or adhesive tape residue is removed from a substrate contaminated therewith consisting essentially of: (A) contacting the substrate with a terpene-based cleaning composition which is substantially free of water-soluble organic material for a period of time sufficient to solubilize the contaminant; (B) removing the composition and solubilized contaminant from the substrate by contact with water having a temperature of about 70° F. to about 140° F. for a period of time of no longer than about 10 minutes to provide a substrate having a contamination rating of no greater than about 14 micrograms NaGl equivalent/square inch (MIL-P-28809A), and to thereby form a mixture comprising the composition, contaminant and water; and (C) separating the water from said mixture, the separated water being substantially free of water-soluble organic material and having a chemical oxygen demand of no greater than about 1,000 ppm.
Claim 2
Dependent Claim
151 words
An industrial cleaning process in which a contaminant comprising soldering flux and/or adhesive tape residue is removed from a substrate contaminated therewith consisting essentially of: (A) contacting the substrate with a terpene-based cleaning composition which is substantially free of water-soluble organic material for a period of time sufficient to solubilize the contaminant; (B) removing the composition and solubilized contaminant from the substrate by contact with water having a temperature of about 70° F. to about 140° F. for a period of time of no longer than about 10 minutes to provide a substrate having a contamination rating of no greater than about 14 micrograms NaGl equivalent/square inch (MIL-P-28809A), and to thereby form a mixture comprising the composition, contaminant and water; and (C) separating the water from said mixture, the separated water being substantially free of water-soluble organic material and having a chemical oxygen demand of no greater than about 1,000 ppm.
Claim 3
Dependent Claim
20 words
A process according to claim 1 wherein the composition and solubized contaminant are removed from the substrate by water spray.
Claim 4
Dependent Claim
28 words
A process according to claim 1 wherein said contact with water is effected under conditions to provide a substrate having a cleanliness rating of below about 10 micrograms.
Claim 5
Dependent Claim
17 words
A process according to claim 1 wherein the water is separated from the mixture by gravitational force,
Claim 6
Dependent Claim
16 words
A process according to claim 4 wherein the separated water is discharged to a sewage system.
Claim 7
Dependent Claim
20 words
A process according to claim 5 wherein the COD of the separated water is no greater than about 300 ppm.
Claim 8
Dependent Claim
20 words
A process according to claim 6 wherein the COD of the separated water is no greater than about 150 ppm.
Claim 9
Dependent Claim
14 words
A process according to claim 1 wherein the substrate is contaminated with soldering flux.
Claim 10
Dependent Claim
12 words
A process according to claim 1 wherein the flux is rosin flux.
Claim 11
Dependent Claim
32 words
A process according to claim 1 wherein the temperature of the water is about 110° F. to about ]30° F. and the period of time is no longer than about 5 minutes.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-08-22 | 1998-02-21 | 1998-08-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-08-22 | 2002-02-21 | 2002-08-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-08-22 | 2006-02-21 | 2006-08-23 | $7700.00 | Window Closed / Lapsed |