High-permittivity dielectric capacitor for use in a semiconductor device and process for making the same

Claim 2

A process for fabricating a high-permittivity dielectric capacitor for use in a semiconductor device comprising: providing a semiconductor substrate and an insulating layer, wherein the insulating layer lies over the semiconductor substrate; forming a first electrode on the insulating layer; forming a patterned refractory-metal oxide layer including an opening, wherein at least a portion of the refractory-metal oxide layer lies over a portion of the first electrode and all of the opening lies over a portion of the first electrode thereby leaving an exposed portion of the first electrode; forming a patterned high-permittivity dielectric layer overlying the refractory-metal oxide and the exposed portion of the first electrode, wherein the patterned high-permittivity dielectric layer is separated from the insulating layer by at least the refractory-metal oxide in all regions away from the exposed portion of the first electrode; and forming a second electrode overlying the high-permittivity dielectric layer.

Claim 3

The process of claim 1, wherein the step of forming a high-permittivity dielectric layer comprises depositing a perovskite material selected from a group consisting of lead titanate, lead zirconium titanate, and lead lanthanum zirconium titanate.

Claim 4

The process of claim 1, wherein the step of forming the first electrode comprises the step of depositing a refractory-metal material selected from the group consisting of ruthenium dioxide, platinum, and a composite layer of platinum overlying titanium.

Claim 5

The process of claim 1, wherein the step of forming a patterned refractory-metal oxide comprises the step of depositing a refractory-metal oxide selected from the group consisting of titanium dioxide, hafnium dioxide, zirconium dioxide, and tantalum pentoxide.

Claim 6

The process of claim 1, wherein the step of forming a patterned refractory-metal oxide layer comprises the step of depositing a refractory-metal oxide, wherein the deposition process is selected from a group consisting of reactive sputter deposition, metal-organic chemical vapor deposition, and chemical vapor deposition of a refractory-metal followed by an anneal in an oxygen ambient.

Claim 7

The process of claim 5, wherein the step of forming a patterned refractory-metal oxide layer further comprises the steps of: forming a photomask on the refractory-metal oxide; and etching the refractory-metal oxide to form the patterned refractory-metal oxide layer including the opening.

Claim 8

The process of claim 5 further comprising the steps of photomasking and etching the refractory-metal oxide to form the patterned refractory-metal oxide layer including the opening.

Claim 9

The process of claim 1, wherein the step of forming a patterned high-permittivity dielectric layer comprises the steps of: depositing a layer of high-permittivity dielectric material onto the substrate to overlie the refractory-metal oxide and the first electrode; crystallizing the high-permittivity dielectric material; forming a photomask on the crystallized high-permittivity dielectric material; and etching the crystallized high-permittivity dielectric material using the refractory-metal oxide layer as an etch-stop.

Claim 10

The process of claim 8, wherein the step of depositing a layer of high-permittivity dielectric material comprises spin coating a sol-gel solution.

Claim 11

The process of claim 8 further comprising the step of etching the refractory-metal oxide using the photomask as an etch mask.

Claim 12

The process of claim 8, wherein the step of forming the second electrode comprises the step of depositing a layer selected from a group consisting of ruthenium dioxide and platinum onto the crystallized high-permittivity dielectric material prior to forming the photomask.

Claim 13

The process of claim 1, wherein the step of forming the second electrode comprises the steps of: depositing a layer selected from a group consisting of ruthenium dioxide and platinum to overlie the patterned high-permittivity dielectric layer and the refractory-metal oxide; and etching the electrode material to form the second electrode, wherein the second electrode overlies additional patterned high-permittivity dielectric capacitors on the semiconductor substrate.

Claim 14

A process for fabricating a high-permittivity dielectric capacitor for use in a semiconductor device comprising: providing a semiconductor substrate; depositing an insulation layer over the substrate; depositing an electrode layer selected from a group consisting of platinum or platinum over titanium onto the insulation layer; etching the electrode layer to form a first electrode; forming a refractory-metal oxide layer selected from a group consisting of titanium dioxide, hafnium dioxide, zirconium dioxide, and tantalum pentoxide to overlie the first electrode layer; etching an opening in the refractory-metal oxide to expose a portion of the first electrode layer; depositing a high-permittivity dielectric layer selected from a group consisting of lead titanate, lead lanthanum zirconium titanate, or lead lanthanum zirconium titanate overlying the refractory-metal oxide and contacting the first electrode layer; annealing the substrate in an oxygen containing ambient to crystallize the high-permittivity dielectric layer; and etching the crystallized high-permittivity dielectric layer to form a capacitor pattern, such that the crystallized high-permittivity dielectric layer is separated from the insulation layer by at least the refractory-metal oxide layer in all regions away from the exposed portion of the first electrode layer.

Claim 15

A process for fabricating a high-permittivity dielectric capacitor for use in a semiconductor device comprising: providing a semiconductor substrate; depositing an insulation layer over the substrate; depositing an electrode layer selected from a group consisting of platinum or platinum over titanium onto the insulation layer; etching the electrode layer to form a first electrode; forming a refractory-metal oxide layer selected from a group consisting of titanium dioxide, hafnium dioxide, zirconium dioxide, and tantalum pentoxide to overlie the first electrode layer; etching an opening in the refractory-metal oxide to expose a portion of the first electrode layer; depositing a high-permittivity dielectric layer selected from a group consisting of lead titanate, lead lanthanum zirconium titanate, or lead lanthanum zirconium titanate overlying the refractory-metal oxide and contacting the first electrode layer; annealing the substrate in an oxygen containing ambient to crystallize the high-permittivity dielectric layer; and etching the crystallized high-permittivity dielectric layer to form a capacitor pattern, such that the crystallized high-permittivity dielectric layer is separated from the insulation layer by at least the refractory-metal oxide layer in all regions away from the exposed portion of the first electrode layer.

Claim 16

The process of claim 13, wherein the step of etching the crystallized high-permittivity dielectric layer comprises a process selected from a group consisting of wet chemical etching and ion milling using the refractory-metal oxide layer as an etch-stop.

Claim 17

The process of claim 13 further comprising depositing a layer of platinum to overlie the crystallized high-permittivity dielectric layer.

Claim 18

A high-permittivity dielectric capacitor for use in a semiconductor device comprising: a semiconductor substrate; an insulating layer overlying the semiconductor substrate; a first electrode on the insulating layer; a refractory-metal oxide layer overlying a portion of the first electrode, refractory-metal oxide layer having an opening exposing a portion of the first electrode; a patterned high-permittivity dielectric layer overlying the refractory-metal oxide and the exposed portion of the first electrode, wherein the patterned high-permittivity dielectric layer is separated from the insulating layer by at least the refractory-metal oxide layer in all regions away from the exposed portion of the first electrode; and a second electrode overlying the high-permittivity dielectric layer.

Claim 19

A high-permittivity dielectric capacitor for use in a semiconductor device comprising: a semiconductor substrate; an insulating layer overlying the semiconductor substrate; a first electrode on the insulating layer; a refractory-metal oxide layer overlying a portion of the first electrode, refractory-metal oxide layer having an opening exposing a portion of the first electrode; a patterned high-permittivity dielectric layer overlying the refractory-metal oxide and the exposed portion of the first electrode, wherein the patterned high-permittivity dielectric layer is separated from the insulating layer by at least the refractory-metal oxide layer in all regions away from the exposed portion of the first electrode; and a second electrode overlying the high-permittivity dielectric layer.

Claim 20

The capacitor of claim 16, wherein the high-permittivity dielectric layer comprises a perovskite material selected from a group consisting of lead titanate, lead zirconium titanate, and lead lanthanum zirconium titanate.

Claim 21

The capacitor of claim 16, wherein the first electrode comprises a refractory-metal material selected from a group consisting of ruthenium dioxide, platinum, and a composite layer of platinum overlying titanium.

Claim 22

The capacitor of claim 16, wherein the refractory-metal oxide is selected from a group consisting of titanium dioxide, hafnium dioxide, zirconium dioxide, and tantalum pentoxide.

Claim 23

The capacitor of claim 16, wherein the first electrode comprises a refractory-metal material selected from a group consisting of ruthenium dioxide and platinum.