Patent US5334279A successfully refreshed from Google Patents.
US5334279A
Expired / Lapsed
US
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Method and apparatus for making printed circuit boards
Assignee: Individual
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Filing: 1993-08-27
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Granted: 1994-08-02
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Expires: 2013-08-27
Abstract
Abstract A new and improved printed circuit board tool and method of making and using it, to produce three dimensional printed circuit boards having grooves with strongly bonded or laminated metallic pads therein. The printed circuit board tool includes a metallized male mold substrate having a plurality of groove forming projections disposed in the substrate surface. The method of making the metallized mold includes forming a female parent or predecessor master tool that may be used to produce a large number of the metallized male molds for producing new and improved three-dimensional printed circuit boards. The new and improved three-dimensional printed circuit board includes a substrate composed of a high heat deflective plastic, and a plurality of recesses or grooves molded into the substrate surface for receiving therein the fine pitch, closely spaced-apart leads of an integrated circuit. A plurality of metallized sunken pads or lands are adhered or bonded within the grooves for establishing an electrical path within each groove.
Inventors
- 👤 George D. Gregoire
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 21:11
CPC Classifications
B; B29; B29C; B29C33/00; B29C33/38; B29C33/3842; B29C33/3857; B29C33/3878; B44; B44C; B44C1/00; B44C1/22; B29C33/42; B29C33/56; H; H01; H01K; H01K3/00; H01K3/22; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K3/00; H05K3/0011; H05K3/0014; H05K3/10; H05K3/20; H05K3/205; B29L; B29L2031/00; B29L2031/34; B29L2031/3425; H05K1/0284; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09018; H05K2201/09036; H05K2201/09118; H05K2201/09209; H05K2201/095; H05K2201/09581; H05K2201/09818; H05K2201/09827; H05K2201/09863; H05K2201/09981; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0108; H05K2203/0113; H05K2203/03; H05K2203/0315; H05K3/02; H05K3/022; H05K3/025; H05K3/06; H05K3/061; H05K3/107; H05K3/38; H05K3/382; H05K3/384; H05K3/385; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49158; Y10T29/49165; Y10T428/00; Y10T428/24; Y10T428/24479; Y10T428/24521; Y10T428/24537; Y10T428/2457; Y10T428/24802; Y10T428/24917
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
238 words
In a method of making a printed circuit board including a planar substrate having thereon a desired electrical circuit pattern with metallized solder lands thereof disposed out of the plane of the substrate, the steps of making a three dimensional female predecessor tool, comprising: using a photo tool having emulsion areas thereon corresponding to the desired electrical circuit pattern and the metallized out of plane solder lands thereof; dimensioning a metallic plate to conform to the planar surface area of the printed circuit board; coating at least one surface of said metallic plate with a light sensitive material; placing said photo tool on the coated surface of said metallic plate so the emulsion areas thereon are properly aligned on the surface to facilitate formation of the desired electrical circuit pattern and the metallized out of plane solder lands thereof; exposing said photo tool disposed on said plate to high intensity light to form a desired pattern in said light sensitive material to facilitate formation of the desired metallized out of plane solder lands of the printed circuit board; removing the unwanted areas of said light sensitive material to expose portions of the metallic plate to be etched with said desired pattern; and etching said desired pattern in the exposed surface of said metallic plate to form in the resulting three dimensional predecessor tool out of plane portions corresponding substantially to the solder lands of the printed circuit board.
Claim 2
Dependent Claim
238 words
In a method of making a printed circuit board including a planar substrate having thereon a desired electrical circuit pattern with metallized solder lands thereof disposed out of the plane of the substrate, the steps of making a three dimensional female predecessor tool, comprising: using a photo tool having emulsion areas thereon corresponding to the desired electrical circuit pattern and the metallized out of plane solder lands thereof; dimensioning a metallic plate to conform to the planar surface area of the printed circuit board; coating at least one surface of said metallic plate with a light sensitive material; placing said photo tool on the coated surface of said metallic plate so the emulsion areas thereon are properly aligned on the surface to facilitate formation of the desired electrical circuit pattern and the metallized out of plane solder lands thereof; exposing said photo tool disposed on said plate to high intensity light to form a desired pattern in said light sensitive material to facilitate formation of the desired metallized out of plane solder lands of the printed circuit board; removing the unwanted areas of said light sensitive material to expose portions of the metallic plate to be etched with said desired pattern; and etching said desired pattern in the exposed surface of said metallic plate to form in the resulting three dimensional predecessor tool out of plane portions corresponding substantially to the solder lands of the printed circuit board.
Claim 3
Dependent Claim
14 words
A three dimensional female predecessor tool made according to the method of claim 1.
Claim 4
Dependent Claim
153 words
In a method of making a printed circuit board including a planar substrate having thereon a desired electrical circuit with metallized solder lands thereof disposed out of the plane of the substrate, the steps of making a three dimensional male tool, comprising: coating a three dimensional female predecessor master tool having out of plane portions corresponding substantially to the out of plane solder lands of the printed circuit board, with a weak adhesion material; depositing a thin layer of metallic material on the out of plane portions of the coated female predecessor master tool; forming a backing on the deposited metallic material to help rigidify it; separating said thin layer of metallic material from said female predecessor master tool to form the resulting three dimensional male mold tool, said male mold tool having metallized out of plane portions complementary shaped relative to the out of plane solder lands of the printed circuit board.
Claim 5
Dependent Claim
153 words
In a method of making a printed circuit board including a planar substrate having thereon a desired electrical circuit with metallized solder lands thereof disposed out of the plane of the substrate, the steps of making a three dimensional male tool, comprising: coating a three dimensional female predecessor master tool having out of plane portions corresponding substantially to the out of plane solder lands of the printed circuit board, with a weak adhesion material; depositing a thin layer of metallic material on the out of plane portions of the coated female predecessor master tool; forming a backing on the deposited metallic material to help rigidify it; separating said thin layer of metallic material from said female predecessor master tool to form the resulting three dimensional male mold tool, said male mold tool having metallized out of plane portions complementary shaped relative to the out of plane solder lands of the printed circuit board.
Claim 6
Dependent Claim
14 words
A three dimensional male mold tool made according to the method of claim 3.
Claim 7
Dependent Claim
21 words
A method of making a three dimensional female predecessor tool according to claim 1, wherein said light sensitive material is photoresist.
Claim 8
Dependent Claim
22 words
A method of making a three dimensional female predecessor tool according to claim 1, wherein said high intensity light is ultraviolet light.
Claim 9
Independent Claim
107 words
A method of making a metallized plastic member, comprising: coating a mold member with a thin layer of weak adhesion material; electroplating to said mold member a thin layer of metallic material; coating one surface of said thin layer of metallic material with a strong adhesion promoting substance; engaging said mold member with another mold member to form a two part mold with a cavity disposed therebetween; filling substantially said cavity with a sufficient quantity of plastic material to form a plastic member having a desired configuration; whereby said thin layer of metallic material is bonded adhesively to said plastic member to form the metallized plastic member.
Claim 10
Independent Claim
107 words
A method of making a metallized plastic member, comprising: coating a mold member with a thin layer of weak adhesion material; electroplating to said mold member a thin layer of metallic material; coating one surface of said thin layer of metallic material with a strong adhesion promoting substance; engaging said mold member with another mold member to form a two part mold with a cavity disposed therebetween; filling substantially said cavity with a sufficient quantity of plastic material to form a plastic member having a desired configuration; whereby said thin layer of metallic material is bonded adhesively to said plastic member to form the metallized plastic member.
Claim 11
Dependent Claim
34 words
A method of making a metallized plastic member according to claim 7, wherein said mold member is configured in the shape of a substrate with a plurality of grooves disposed in the surface thereof.
Claim 12
Dependent Claim
22 words
A method of making a metallized plastic member according to claim 8, wherein said substrate is a blank printed circuit board substrate.
Claim 13
Dependent Claim
28 words
A method of making a metallized plastic member according to claim 7, wherein said step of electroplating includes coating said mold member with a weak adhesion metallic material.
Claim 14
Dependent Claim
18 words
A molded plastic member having an adhesive bonded metallized surface made according to the method of claim 7.
Claim 15
Independent Claim
137 words
A method of making a metallized plastic member comprising: coating a mold member with a thin layer of weak adhesion material; electroplating to the coated mold member a thin layer of metallic material; coating one surface of said thin layer of metallic material with a strong adhesion promoting substance; engaging said mold member with another mold member to form a two part mold with a cavity disposed therebetween; filling substantially said cavity with a sufficient quantity of plastic material to form a plastic member having a desired configuration; whereby said thin layer of metallic material is bonded adhesively to said plastic member to form the metallized plastic member; and wherein said step of coating with a thin layer of weak adhesion material includes bathing said mold member in a weak adhesion solution of water and copper sulfate.
Claim 16
Independent Claim
137 words
A method of making a metallized plastic member comprising: coating a mold member with a thin layer of weak adhesion material; electroplating to the coated mold member a thin layer of metallic material; coating one surface of said thin layer of metallic material with a strong adhesion promoting substance; engaging said mold member with another mold member to form a two part mold with a cavity disposed therebetween; filling substantially said cavity with a sufficient quantity of plastic material to form a plastic member having a desired configuration; whereby said thin layer of metallic material is bonded adhesively to said plastic member to form the metallized plastic member; and wherein said step of coating with a thin layer of weak adhesion material includes bathing said mold member in a weak adhesion solution of water and copper sulfate.
Claim 17
Independent Claim
133 words
A method of making a metallized plastic member comprising: coating a mold member with a thin layer of weak adhesion material; electroplating to the coated mold member a thin layer of metallic material; coating one surface of said thin layer of metallic material with a strong adhesion promoting substance; engaging said mold member with another mold member to form a two part mold with a cavity disposed therebetween; filling substantially said cavity with a sufficient quantity of plastic material to form a plastic member having a desired configuration; whereby said thin layer of metallic material is bonded adhesively to said plastic member to form the metallized plastic member; and wherein said step of coating with a thin layer of weak adhesion material includes spraying said mold member with a thin coating of graphite.
Claim 18
Independent Claim
133 words
A method of making a metallized plastic member comprising: coating a mold member with a thin layer of weak adhesion material; electroplating to the coated mold member a thin layer of metallic material; coating one surface of said thin layer of metallic material with a strong adhesion promoting substance; engaging said mold member with another mold member to form a two part mold with a cavity disposed therebetween; filling substantially said cavity with a sufficient quantity of plastic material to form a plastic member having a desired configuration; whereby said thin layer of metallic material is bonded adhesively to said plastic member to form the metallized plastic member; and wherein said step of coating with a thin layer of weak adhesion material includes spraying said mold member with a thin coating of graphite.
Claim 19
Independent Claim
134 words
A method of making a metallized plastic member comprising: coating a mold member with a thin layer of weak adhesion material; electroplating to the coated mold member a thin layer of metallic material; coating one surface of said thin layer of metallic material with a strong adhesion promoting substance; engaging said mold member with another mold member to form a two part mold with a cavity disposed therebetween; filling substantially said cavity with a sufficient quantity of plastic material to form a plastic member having a desired configuration; whereby said thin layer of metallic material is bonded adhesively to said plastic member to form the metallized plastic member; and wherein said step of coating with a thin layer of metallic material includes vacuum metallizing said mold member with a thin coat of metallic material.
Claim 20
Independent Claim
134 words
A method of making a metallized plastic member comprising: coating a mold member with a thin layer of weak adhesion material; electroplating to the coated mold member a thin layer of metallic material; coating one surface of said thin layer of metallic material with a strong adhesion promoting substance; engaging said mold member with another mold member to form a two part mold with a cavity disposed therebetween; filling substantially said cavity with a sufficient quantity of plastic material to form a plastic member having a desired configuration; whereby said thin layer of metallic material is bonded adhesively to said plastic member to form the metallized plastic member; and wherein said step of coating with a thin layer of metallic material includes vacuum metallizing said mold member with a thin coat of metallic material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-08-01 | 1998-01-31 | 1998-08-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-08-01 | 2002-01-31 | 2002-08-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-08-01 | 2006-01-31 | 2006-08-02 | $7700.00 | Window Closed / Lapsed |