Patent US5331513A successfully refreshed from Google Patents.
US5331513A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of mounting electronic part on circuit substrate and circuit substrate including electronic parts mounted thereon
Assignee: Rohm Co Ltd
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Filing: 1992-07-06
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Granted: 1994-07-19
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Expires: 2012-07-06
Abstract
Abstract In order to electrically connect the projecting electrodes of an LSI with a given wiring pattern on a circuit substrate, at least a portion of the electronic part is covered with a heat-shrinkable film member which in turn is fixedly mounted on the circuit substrate by adhesive at the opposite side or all the sides of the heat-shrinkable film member. When the heat-shrinkable film member is heated, the shrinkage of the heat-shrinkable film member presses the LSI against the circuit substrate under pressure. Thus, the bumps of the LSI can be electrically connected with the wiring pattern on the circuit substrate. Therefore, the LSI can be easily mounted on the circuit substrate or replaced by a new one.
Inventors
- 👤 Minoru Hirai
- 👤 Osamu Tanaka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 06:02
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/325; H10; H10W; H10W74/00; H10W74/10; H10W74/131; H10W74/144; H05K3/301; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49147; Y10T29/49169; Y10T29/49174; Y10T29/49176; Y10T29/49178
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
119 words
A circuit substrate with at least one electronic part mounted thereon so that the electrodes of said electronic part are electrically connected with a wiring pattern on said circuit substrate, said circuit substrate comprising: a heat-shrinkable film member fixedly mounted on said circuit substrate at the opposite sides or all the sides thereof, said heat-shrinkable film covering at least a portion of said electronic part on said circuit substrate; and an electrical connection for electrically connecting the electrodes and the wiring pattern by pressure from heat shrinking said heat-shrinkable film member to press said electronic part against said circuit substrate so that the electrodes of said electronic part are electrically connected with the wiring pattern of said circuit substrate.
Claim 2
Dependent Claim
119 words
A circuit substrate with at least one electronic part mounted thereon so that the electrodes of said electronic part are electrically connected with a wiring pattern on said circuit substrate, said circuit substrate comprising: a heat-shrinkable film member fixedly mounted on said circuit substrate at the opposite sides or all the sides thereof, said heat-shrinkable film covering at least a portion of said electronic part on said circuit substrate; and an electrical connection for electrically connecting the electrodes and the wiring pattern by pressure from heat shrinking said heat-shrinkable film member to press said electronic part against said circuit substrate so that the electrodes of said electronic part are electrically connected with the wiring pattern of said circuit substrate.
Claim 3
Dependent Claim
28 words
A circuit substrate with at least one electronic part mounted on as defined in claim 1 wherein said heat-shrinkable film member is a heat-shrinkable film of thermosetting resin.
Claim 4
Dependent Claim
30 words
A circuit substrate with at least one electronic part mounted on as defined in claim 1 wherein said heat-shrinkable film member is fixedly mounted on said circuit substrate by adhesive.
Claim 5
Dependent Claim
57 words
A circuit substrate with at least one electronic part mounted on as defined in claim 3 wherein said heat-shrinkable film member includes apertures formed therethrough at positions at which said heat-shrinkable film member is to be secured to said circuit substrate through said adhesive, said adhesive flowing into said aperture to increase the adhesion from said adhesive.
Claim 6
Dependent Claim
28 words
A circuit substrate with at least one electronic part mounted on as defined in claim 1 wherein said heat-shrinkable film member is a heat-shrinkable film of polyester resin.
Claim 7
Dependent Claim
32 words
A circuit substrate with at least one electronic part mounted on as defined in claim 5 wherein said heat-shrinkable film member is secured to said circuit substrate by an epoxy resin adhesive.
Claim 8
Independent Claim
66 words
A method of mounting at least one electronic part on a circuit substrate, said method comprising the steps of: positioning the electronic part on the circuit substrate; and fixing the electronic part to the circuit substrate by pressure due to the shrinkage of a heat-shrinkable film member so that the electrodes of the electronic part are electrically connected to a wiring pattern on the circuit substrate.
Claim 9
Independent Claim
66 words
A method of mounting at least one electronic part on a circuit substrate, said method comprising the steps of: positioning the electronic part on the circuit substrate; and fixing the electronic part to the circuit substrate by pressure due to the shrinkage of a heat-shrinkable film member so that the electrodes of the electronic part are electrically connected to a wiring pattern on the circuit substrate.
Claim 10
Independent Claim
126 words
A method of mounting at least one electronic part on a circuit substrate so that the electrodes of the electronic part are electrically connected to a given wiring pattern on the circuit substrate, said method comprising the steps of: (a) placing the electronic part on the circuit substrate with the electrodes of the electronic part being coincident with the wiring pattern of the circuit substrate; (b) covering at least a portion of the electronic part with a heat-shrinkable film member; (c) fixing the heat-shrinkable film member to the circuit substrate at the opposite sides or all the sides thereof; and (d) heat shrinking the heat-shrinkable film member to cause the electrodes of the electronic part to connect electrically with the wiring pattern on the circuit substrate.
Claim 11
Independent Claim
126 words
A method of mounting at least one electronic part on a circuit substrate so that the electrodes of the electronic part are electrically connected to a given wiring pattern on the circuit substrate, said method comprising the steps of: (a) placing the electronic part on the circuit substrate with the electrodes of the electronic part being coincident with the wiring pattern of the circuit substrate; (b) covering at least a portion of the electronic part with a heat-shrinkable film member; (c) fixing the heat-shrinkable film member to the circuit substrate at the opposite sides or all the sides thereof; and (d) heat shrinking the heat-shrinkable film member to cause the electrodes of the electronic part to connect electrically with the wiring pattern on the circuit substrate.
Claim 12
Dependent Claim
19 words
A method as defined in claim 8 wherein said heat-shrinkable film member is a heat-shrinkable film of thermosetting resin.
Claim 13
Dependent Claim
21 words
A method as defined in claim 8 wherein said heat-shrinkable film member is fixedly mounted on the circuit substrate by adhesive.
Claim 14
Dependent Claim
35 words
A method as defined in claim 10 wherein said heat-shrinkable film member includes apertures formed therethrough at positions at which said heat-shrinkable film member is to be secured to said circuit substrate by said adhesive.
Claim 15
Dependent Claim
19 words
A method as defined in claim 8 wherein said heat-shrinkable film member is a heat-shrinkable film of polyester resin.
Claim 16
Dependent Claim
23 words
A method as defined in claim 12 wherein said heat-shrinkable film member is secured to said circuit substrate by an epoxy resin adhesive.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-07-18 | 1998-01-17 | 1998-07-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-07-18 | 2002-01-17 | 2002-07-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-07-18 | 2006-01-17 | 2006-07-19 | $7700.00 | Window Closed / Lapsed |