Patent US5330574A successfully refreshed from Google Patents.
US5330574A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electrode forming apparatus
Assignee: Murata Manufacturing Co Ltd
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Filing: 1992-03-31
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Granted: 1994-07-19
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Expires: 2012-03-31
Abstract
Abstract An electrode forming apparatus comprises a recovery blade for collecting electrode paste on the bottom surface of a dipping vessel toward a first end of the dipping vessel and a levelling blade for levelling the electrode paste, being collected toward the first end, toward a second end of the dipping vessel for adjusting the same to a constant film thickness. The recovery blade and the levelling blade are supported by a blade support frame, which is horizontally reciprocated with respect to the dipping vessel. The recovery blade is vertically moved by a cylinder, while the vertical position of the levelling blade is finely controlled by a levelling control motor. Thus, the film thickness of the electrode paste can be accurately adjusted with excellent repeatability, thereby carrying out homogeneous electrode application.
Inventors
- 👤 Tadahiro Nakagawa
- 👤 Shizuma Tazuke
- 👤 Mitsuro Hamuro
- 👤 Hirokazu Higuchi
- 👤 Katsuyuki Moriyasu
- 👤 Akihiko Takahashi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 21:47
CPC Classifications
H; H05; H05K; H05K13/00; H05K13/02; H05K13/028; H01; H01G; H01G13/00; H01G13/006
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
220 words
An apparatus for forming a layer of electrode paste on a bottom surface of a dipping vessel for applying electrodes onto ends of chip type electronic components, said apparatus comprising: a frame; a dipping vessel on the frame; a recovery blade mounted on the frame for collecting said electrode paste on the bottom surface of said dipping vessel by moving the paste toward a first end of said dipping vessel; a levelling blade mounted on the frame for levelling said electrode paste collected at said first end of said dipping vessel, by moving the paste toward a second end of said dipping vessel while forming the paste to have a constant thickness over the bottom surface of said dipping vessel; driving means for relatively reciprocating said recovery blade and said levelling blade with respect to said dipping vessel for collecting and levelling the paste; first moving means for moving said recovery blade between a position in contact with the bottom surface of said dipping vessel when collecting the paste and a retracted position when not collecting the paste; and second moving means for moving said levelling blade between a position spaced from the bottom surface of said dipping vessel by a distance corresponding to said constant thickness when levelling the paste, and a retracted position when not levelling the paste.
Claim 2
Independent Claim
220 words
An apparatus for forming a layer of electrode paste on a bottom surface of a dipping vessel for applying electrodes onto ends of chip type electronic components, said apparatus comprising: a frame; a dipping vessel on the frame; a recovery blade mounted on the frame for collecting said electrode paste on the bottom surface of said dipping vessel by moving the paste toward a first end of said dipping vessel; a levelling blade mounted on the frame for levelling said electrode paste collected at said first end of said dipping vessel, by moving the paste toward a second end of said dipping vessel while forming the paste to have a constant thickness over the bottom surface of said dipping vessel; driving means for relatively reciprocating said recovery blade and said levelling blade with respect to said dipping vessel for collecting and levelling the paste; first moving means for moving said recovery blade between a position in contact with the bottom surface of said dipping vessel when collecting the paste and a retracted position when not collecting the paste; and second moving means for moving said levelling blade between a position spaced from the bottom surface of said dipping vessel by a distance corresponding to said constant thickness when levelling the paste, and a retracted position when not levelling the paste.
Claim 3
Dependent Claim
87 words
An apparatus according to claim 1, wherein said dipping vessel is in a fixed position on the frame and is provided with sliding means on opposite side portions of the dipping vessel; a blade support frame, being slidable along said sliding means and being reciprocated by said driving means, said blade support frame being arranged to extend across said dipping vessel; and said recovery blade and said levelling blade being mounted on said blade support frame via said first moving means and said second moving means, respectively.
Claim 4
Dependent Claim
69 words
An electrode forming apparatus in accordance with claim 1, further comprising sliding means on said frame; said dipping vessel being slidable along said sliding means, and being reciprocated by said driving means; and a blade support frame mounted in a fixed position on said frame via said first moving means and said second moving means, said recovery blade and said levelling blade being mounted on said blade support frame.
Claim 5
Independent Claim
160 words
An apparatus for forming a layer of electrode paste on a bottom surface of a dipping vessel for applying electrodes onto ends of chip type electronic components, said apparatus comprising: a blade assembly having a recovery blade for collecting the electrode paste on the bottom surface of a dipping vessel and a levelling blade for levelling the collected paste to a constant thickness over the bottom surface of such dipping vessel; moving means for relatively moving the recovery blade with respect to be in contact with and along the bottom surface to collect the paste, and away from the bottom surface after collecting the paste; and for moving the levelling blade to a position separated from the bottom surface by a predetermined gap corresponding to said constant thickness, and of relatively moving the levelling blade with respect to and along the bottom surface, to form the layer of electrode paste, and away from the bottom surface after levelling the paste.
Claim 6
Independent Claim
160 words
An apparatus for forming a layer of electrode paste on a bottom surface of a dipping vessel for applying electrodes onto ends of chip type electronic components, said apparatus comprising: a blade assembly having a recovery blade for collecting the electrode paste on the bottom surface of a dipping vessel and a levelling blade for levelling the collected paste to a constant thickness over the bottom surface of such dipping vessel; moving means for relatively moving the recovery blade with respect to be in contact with and along the bottom surface to collect the paste, and away from the bottom surface after collecting the paste; and for moving the levelling blade to a position separated from the bottom surface by a predetermined gap corresponding to said constant thickness, and of relatively moving the levelling blade with respect to and along the bottom surface, to form the layer of electrode paste, and away from the bottom surface after levelling the paste.
Claim 7
Dependent Claim
43 words
An apparatus according to claim 4, further comprising a frame and means for holding such dipping vessel in a fixed position with respect to the frame; wherein the moving means moves the blades with respect to the fixed position of such dipping vessel.
Claim 8
Dependent Claim
44 words
An apparatus according to claim 4, wherein said moving means comprises driving means for causing relative movement of the blade assembly and such dipping vessel so as to move the recovery blade and the levelling blade along the bottom surface of such dipping vessel.
Claim 9
Dependent Claim
95 words
An apparatus according to claim 6, wherein said blade assembly comprises a blade support frame for mounting the recovery blade and the levelling blade on the frame, the blades being mounted on the blade support frame with means for moving the blades toward and away from the bottom surface of such vessel, and the blade support frame being reciprocated by the driving means; and guide means for being attached to such dipping vessel for guiding the blade support frame relative to such dipping vessel when the blade support frame is reciprocated by the driving means.
Claim 10
Dependent Claim
44 words
An apparatus according to claim 4, further comprising a frame and means for holding the blade assembly in a fixed position with respect to the frame; wherein the moving means moves such dipping vessel with respect to the fixed position of the blade assembly.
Claim 11
Dependent Claim
93 words
An apparatus according to claim 8, further comprising guide means for being attached to such dipping vessel for guiding such dipping vessel relative to the blade assembly when the moving means moves such dipping vessel; and a blade support frame for mounting the recovery blade and the levelling blade on the frame, the blades being mounted on the blade support frame with means for moving the blades toward and away from the bottom surface of such vessel, the blade support frame being held in a constant position with respect to such dipping vessel.
Claim 12
Dependent Claim
46 words
An apparatus according to claim 4, further comprising a frame; and mounting means for demountably holding such dipping vessel and blade assembly on the frame, the dipping vessel and such blade assembly being interconnected so as to retain their relative position when demounted from the frame.
Claim 13
Independent Claim
207 words
An apparatus for forming a layer of electrode paste on a bottom surface of a dipping vessel for applying electrodes onto ends of chip type electronic components, said apparatus comprising: a recovery blade for collecting the electrode paste on the bottom surface of a dipping vessel and a levelling blade for levelling the collected paste to a constant thickness over the bottom surface of such dipping vessel; first vertical moving means for vertically moving the recovery blade to contact the bottom surface to collect the paste, and away from the bottom surface after collection of the paste; second vertical moving means for vertically moving the levelling blade to a position separated from the bottom surface by a predetermined gap corresponding to the constant thickness of the layer of electrode paste, and away from that position after levelling the paste; and driving means for relatively horizontally reciprocating the recovery blade and the levelling blade with respect to such dipping vessel so that the recovery blade collects the electrode paste at a first end of such dipping vessel when the recovery blade is in contact with the bottom surface, and the levelling blade levels the electrode paste toward a second opposite end to form the layer of electrode paste.
Claim 14
Independent Claim
207 words
An apparatus for forming a layer of electrode paste on a bottom surface of a dipping vessel for applying electrodes onto ends of chip type electronic components, said apparatus comprising: a recovery blade for collecting the electrode paste on the bottom surface of a dipping vessel and a levelling blade for levelling the collected paste to a constant thickness over the bottom surface of such dipping vessel; first vertical moving means for vertically moving the recovery blade to contact the bottom surface to collect the paste, and away from the bottom surface after collection of the paste; second vertical moving means for vertically moving the levelling blade to a position separated from the bottom surface by a predetermined gap corresponding to the constant thickness of the layer of electrode paste, and away from that position after levelling the paste; and driving means for relatively horizontally reciprocating the recovery blade and the levelling blade with respect to such dipping vessel so that the recovery blade collects the electrode paste at a first end of such dipping vessel when the recovery blade is in contact with the bottom surface, and the levelling blade levels the electrode paste toward a second opposite end to form the layer of electrode paste.
Claim 15
Dependent Claim
102 words
An apparatus according to claim 11, further comprising such dipping vessel held in a constant horizontal position; a blade support frame for mounting the recovery blade and the levelling blade, the blade support frame extending across such dipping vessel and being reciprocated by the driving means, the blades being mounted on the blade support frame with the first vertical moving means and the second vertical moving means, respectively; and sliding means attached to opposite side portions of such dipping vessel so that the blade support frame is horizontally slidable, with respect to such dipping vessel, on being reciprocated by the driving means.
Claim 16
Dependent Claim
103 words
An apparatus according to claim 11, further comprising such dipping vessel being reciprocated by the driving means; sliding means attached to such dipping vessel so that such dipping vessel is horizontally slidable, with respect to the blades, on being reciprocated by the driving means; and a blade support frame for mounting the recovery blade and the levelling blade, the blade support frame extending across such dipping vessel and being held in a constant horizontal position with respect to the dipping vessel, the blades being mounted on the blade support frame with the first vertical moving means and the second vertical moving means, respectively.
Claim 17
Dependent Claim
34 words
An apparatus according to claim 11, further comprising mounting means for demountably holding such dipping vessel, such dipping vessel and the blade assembly being interconnected so as to retain their relative position when demounted.
References Cited (Backward Citations)
US4392450A
Cited
US4450226A
Cited
US4509455A
Cited
US4698192A
Cited
DE3435507A1
Cited
US4909841A
Cited
JPH0344404A
Cited
US5044306A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-07-18 | 1998-01-17 | 1998-07-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-07-18 | 2002-01-17 | 2002-07-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-07-18 | 2006-01-17 | 2006-07-19 | $7700.00 | Window Closed / Lapsed |