Patent US5329696A successfully refreshed from Google Patents.
US5329696A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing electronic device
Assignee: Mitsubishi Electric Corp
•
Filing: 1992-06-18
•
Granted: 1994-07-19
•
Expires: 2012-06-18
Abstract
Abstract An electronic device comprises a housing made of a polycarbonate resin, and a novel double-sided printed circuit board. The printed circuit board has one side embedded in the housing, and the other side exposed to the interior of the housing. A plurality of refractory electronic components are mounted onto one side of the printed circuit board and include a resistor and a capacitor. A plurality of lower refractory electronic components are mounted onto the other side of the housing and include a semiconductor integrated circuit, and a transformer. Preferably, an insulating layer is applied to cover the one side of the printed circuit board and the refractory electronic components. Also, a metal layer is applied to cover the insulating layer and the inner surface of the housing.
Inventors
- 👤 Takeshi Morita
- 👤 Osamu Hayashi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 10:28
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/284; B; B29; B29C; B29C33/00; B29C33/12; B29C33/14; B29C45/00; B29C45/14; B29C45/14639; B29C70/00; B29C70/68; H05K3/0011; H05K3/0014; H05K3/0058; B29C45/14065; B29C2045/14114; B29C2045/14852; B29K; B29K2069/00; B29L; B29L2031/00; B29L2031/34; B29L2031/3406; B29L2031/3425; B29L2031/3481; H05K2201/00; H05K2201/07; H05K2201/0707; H05K2201/0715; H05K2201/09; H05K2201/09818; H05K2201/09872; H05K2201/0999; H05K2201/10; H05K2201/10007; H05K2201/10015; H05K2201/10022; H05K2201/1003; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K2203/00; H05K2203/13; H05K2203/1305; H05K2203/1316; H05K2203/1322; H05K2203/1327; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146; Y10T29/49155
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
126 words
A method of manufacturing an electronic device, comprising the steps of: mounting a plurality of refractory electronic components onto one side of a printed circuit board; attaching said printed circuit board temporarily to a male mold so as to face said one side of the printed circuit board against a female mold; cooperating with said male mold and said female mold to define a cavity therebetween; introducing a resin into said cavity to mold a housing such that said one side of the printed circuit board is embedded in said housing, and the other side of the printed circuit board is exposed to an interior of said housing; and mounting a plurality of lower refractory electronic components onto the other side of said printed circuit board.
Claim 2
Independent Claim
126 words
A method of manufacturing an electronic device, comprising the steps of: mounting a plurality of refractory electronic components onto one side of a printed circuit board; attaching said printed circuit board temporarily to a male mold so as to face said one side of the printed circuit board against a female mold; cooperating with said male mold and said female mold to define a cavity therebetween; introducing a resin into said cavity to mold a housing such that said one side of the printed circuit board is embedded in said housing, and the other side of the printed circuit board is exposed to an interior of said housing; and mounting a plurality of lower refractory electronic components onto the other side of said printed circuit board.
Claim 3
Dependent Claim
44 words
The method of claim 1, wherein said resin is a polycarbonate resin, and said plurality of refractory electronic components are soldered to said one side of said printed circuit board by a solder material, said solder material including an alloy of lead and silver.
Claim 4
Dependent Claim
49 words
The method of claim 1, wherein said resin has a higher melting point than a polycarbonate resin, and said plurality of refractory electronic components are soldered to said one side of said printed circuit board by a solder material, said solder material including an alloy of gold and silicon.
Claim 5
Dependent Claim
49 words
The method of claim 1, wherein said resin has a higher melting point than a polycarbonate resin, and said plurality of refractory electronic components are soldered to said one side of said printed circuit board by a solder material, said solder material including an alloy of gold and germanium.
Claim 6
Dependent Claim
27 words
The method of claim 1, wherein said plurality of lower refractory electronic components are mounted to the other side of said printed circuit board by resistance welding.
Claim 7
Independent Claim
161 words
A method of manufacturing an electronic device, comprising the steps of: mounting a plurality of refractory electronic components onto one side of a printed circuit board; attaching said printed circuit board temporarily to a male mold so as to face said one side of the printed circuit board against a female mold; applying an insulating layer to cover said one side of the circuit board and said refractory electronic components; applying a metal layer to cover said insulating layer and at least part of said male mold; cooperating with said male mold and said female mold to define a cavity therebetween; introducing a resin into said cavity to mold a housing such that said one side of the printed circuit board is embedded in said housing, and the other side of the printed circuit board is exposed to an interior of said housing; and mounting a plurality of lower refractory electronic components onto the other side of said printed circuit board.
Claim 8
Independent Claim
161 words
A method of manufacturing an electronic device, comprising the steps of: mounting a plurality of refractory electronic components onto one side of a printed circuit board; attaching said printed circuit board temporarily to a male mold so as to face said one side of the printed circuit board against a female mold; applying an insulating layer to cover said one side of the circuit board and said refractory electronic components; applying a metal layer to cover said insulating layer and at least part of said male mold; cooperating with said male mold and said female mold to define a cavity therebetween; introducing a resin into said cavity to mold a housing such that said one side of the printed circuit board is embedded in said housing, and the other side of the printed circuit board is exposed to an interior of said housing; and mounting a plurality of lower refractory electronic components onto the other side of said printed circuit board.
Claim 9
Dependent Claim
44 words
The method of claim 6, wherein said resin is a polycarbonate resin, and said plurality of refractory electronic components are soldered to said one side of said printed circuit board by a solder material, said solder material including an alloy of lead and silver.
Claim 10
Dependent Claim
33 words
The method of claim 6, wherein said insulating layer and said at least part of the male mold are first electrolessly plated with a metal, and then, electrolytically plated with a same metal.
Claim 11
Dependent Claim
24 words
The method of claim 6, wherein a metal is vapor deposited on said insulating layer and said at least part of the male mold.
Claim 12
Dependent Claim
24 words
The method of claim 6, wherein a copper foil is placed on said insulating layer and said at least part of the male mold.
Claim 13
Dependent Claim
24 words
The method of claim 6, wherein an aluminum foil is placed on said insulating layer and said at least part of the male mold.
References Cited (Backward Citations)
US3934074A
Cited
US4710419A
Cited
US4772496A
Cited
JPS6380597A
Cited
US4843520A
Cited
US4811482A
Cited
JPH01112085A
Cited
JPH01243558A
Cited
JPH0214194A
Cited
EP0384927A1
Cited
US5090122A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-07-18 | 1998-01-17 | 1998-07-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-07-18 | 2002-01-17 | 2002-07-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-07-18 | 2006-01-17 | 2006-07-19 | $7700.00 | Window Closed / Lapsed |