US5328751A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ceramic circuit board with a curved lead terminal
Assignee: Toshiba Corp
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Filing: 1992-07-10
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Granted: 1994-07-12
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Expires: 2012-07-10
Abstract
Abstract This invention provides a ceramic circuit board comprising: a ceramic base board; a metal circuit plate integrally bonded onto a surface of the ceramic base board; a terminal connecting port formed by bending a part of the metal circuit plate for connecting a terminal of a module, the terminal connecting port being formed so that the terminal connecting port is raised from a surface of the ceramic base board, and a curvature radius of the bent portion provided on the terminal connecting port is set to 0.2 mm or more. An empty communication hole such as groove or through hole may also be formed at a bonding surface between the metal circuit plate and the ceramic base board.
Inventors
- 👤 Hiroshi Komorita
- 👤 Nobuyuki Mizunoya
- 👤 Kazuo Matsumura
- 👤 Kazuo Ikeda
- 👤 Takayuki Naba
- 👤 Tadashi Tanaka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 14:31
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/479; H05; H05K; H05K1/00; H05K1/02; H05K1/0271; H05K3/00; H05K3/40; H05K3/4092; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/098; H05K3/38; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5524; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/24926
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
89 words
A ceramic circuit board comprising: a ceramic base board; a metal circuit plate integrally bonded onto a surface of the ceramic base board; and a terminal connecting port formed by bending a part of the metal circuit plate for connecting a terminal of a module, the terminal connecting port being formed so that the terminal connecting port is raised from the surface of the ceramic base board, and a radius of curvature of the bent portion provided on the terminal connecting port is set to 0.2 mm or more.
Claim 2
Dependent Claim
89 words
A ceramic circuit board comprising: a ceramic base board; a metal circuit plate integrally bonded onto a surface of the ceramic base board; and a terminal connecting port formed by bending a part of the metal circuit plate for connecting a terminal of a module, the terminal connecting port being formed so that the terminal connecting port is raised from the surface of the ceramic base board, and a radius of curvature of the bent portion provided on the terminal connecting port is set to 0.2 mm or more.
Claim 3
Dependent Claim
28 words
A ceramic circuit board according to claim 1, wherein the ceramic base board and the metal circuit plate are directly bonded by a eutectic phase to each other.
Claim 4
Dependent Claim
44 words
A ceramic circuit board according to claim 1, wherein the ceramic base board and the metal circuit plate are bonded to each other through a bonding layer containing an active metal selected from the group consisting of Ti, Zr, Hf, V, Nb and Ta.
Claim 5
Dependent Claim
21 words
A ceramic circuit board according to claim 1, wherein the terminal connecting port is formed in a shape of a cantilever.
Claim 6
Dependent Claim
17 words
A ceramic circuit board according to claim 1, wherein the metal circuit plate is composed of copper.
Claim 7
Dependent Claim
102 words
A ceramic circuit board comprising: a ceramic base board; a metal circuit plate integrally bonded onto a surface of the ceramic base board through a bonding layer containing an active metal selected from the group consisting of Ti, Zr, Hf, V, Nb and Ta; and a semiconductor chip bonded onto a surface of the metal circuit plate, the metal circuit plate being provided with an empty communication hole at a bonding surface between the metal circuit plate and the ceramic base board so as to communicate the bonding surface with an outside of the ceramic base board through the empty communication hole.
Claim 8
Dependent Claim
102 words
A ceramic circuit board comprising: a ceramic base board; a metal circuit plate integrally bonded onto a surface of the ceramic base board through a bonding layer containing an active metal selected from the group consisting of Ti, Zr, Hf, V, Nb and Ta; and a semiconductor chip bonded onto a surface of the metal circuit plate, the metal circuit plate being provided with an empty communication hole at a bonding surface between the metal circuit plate and the ceramic base board so as to communicate the bonding surface with an outside of the ceramic base board through the empty communication hole.
Claim 9
Dependent Claim
39 words
A ceramic circuit board according to claim 6, wherein the empty communication hole is a through hole formed so as to pass through the metal circuit plate in a direction perpendicular to a plane of the metal circuit plate.
Claim 10
Dependent Claim
165 words
A ceramic circuit board comprising: a ceramic base board; a metal circuit plate integrally bonded onto one surface of the ceramic base board through a first bonding layer containing an active metal selected from the group consisting of Ti, Zr, Hf, V, Nb and Ta; a backing metal plate for preventing thermal deformation of the ceramic base board, which is integrally bonded onto another surface of the ceramic base board through a second bonding layer containing an active metal; a semiconductor chip bonded onto a surface of the metal circuit plate through a first solder layer; and a heat sink for releasing heat, which is bonded onto a surface of the backing copper plate through a second solder layer, the metal circuit plate and the backing metal plate being provided with an empty communication hole respectively formed at each of bonding surfaces so as to communicate the each of the bonding surfaces with an outside of the ceramic base board through the empty communication hole.
Claim 11
Dependent Claim
165 words
A ceramic circuit board comprising: a ceramic base board; a metal circuit plate integrally bonded onto one surface of the ceramic base board through a first bonding layer containing an active metal selected from the group consisting of Ti, Zr, Hf, V, Nb and Ta; a backing metal plate for preventing thermal deformation of the ceramic base board, which is integrally bonded onto another surface of the ceramic base board through a second bonding layer containing an active metal; a semiconductor chip bonded onto a surface of the metal circuit plate through a first solder layer; and a heat sink for releasing heat, which is bonded onto a surface of the backing copper plate through a second solder layer, the metal circuit plate and the backing metal plate being provided with an empty communication hole respectively formed at each of bonding surfaces so as to communicate the each of the bonding surfaces with an outside of the ceramic base board through the empty communication hole.
Claim 12
Dependent Claim
51 words
A ceramic circuit board according to claim 8, wherein the empty communication hole is a plurality of through holes respectively formed so as to pass through the metal circuit plate and the backing metal plate in a direction perpendicular to planes of the metal circuit plate and the backing metal plate.
Claim 13
Dependent Claim
96 words
A ceramic circuit board comprising: a ceramic base board; a metal circuit plate integrally bonded onto a surface of the ceramic base board through a bonding layer containing an active metal selected from the group consisting of Ti, Zr, Hf, V, Nb and Ta; and a semiconductor chip bonded onto a surface of the metal circuit plate through a solder layer, the metal circuit plate being provided with a groove at a bonding surface directing to the semiconductor chip so as to communicate the bonding surface with an outside of the semiconductor chip through the groove.
Claim 14
Dependent Claim
96 words
A ceramic circuit board comprising: a ceramic base board; a metal circuit plate integrally bonded onto a surface of the ceramic base board through a bonding layer containing an active metal selected from the group consisting of Ti, Zr, Hf, V, Nb and Ta; and a semiconductor chip bonded onto a surface of the metal circuit plate through a solder layer, the metal circuit plate being provided with a groove at a bonding surface directing to the semiconductor chip so as to communicate the bonding surface with an outside of the semiconductor chip through the groove.
Claim 15
Dependent Claim
159 words
A ceramic circuit board comprising: a ceramic base board; a metal circuit plate integrally bonded onto one surface of the ceramic base board through a first bonding layer containing an active metal selected from the group consisting of Ti, Zr, Hf, V, Nb and Ta; a backing metal plate for preventing thermal deformation, which is integrally bonded onto another surface of the ceramic base board through a second bonding layer containing an active metal; a semiconductor chip bonded onto a surface of the metal circuit plate through a first solder layer; and a heat sink for releasing heat, which is bonded onto a surface of the backing metal plate through a second solder layer, the metal circuit plate and the backing metal plate being provided respectively with a groove formed at each of solder layer side surfaces so as to communicate the each of the solder layer side surfaces with an outside of the semiconductor chip through the groove.
Claim 16
Dependent Claim
159 words
A ceramic circuit board comprising: a ceramic base board; a metal circuit plate integrally bonded onto one surface of the ceramic base board through a first bonding layer containing an active metal selected from the group consisting of Ti, Zr, Hf, V, Nb and Ta; a backing metal plate for preventing thermal deformation, which is integrally bonded onto another surface of the ceramic base board through a second bonding layer containing an active metal; a semiconductor chip bonded onto a surface of the metal circuit plate through a first solder layer; and a heat sink for releasing heat, which is bonded onto a surface of the backing metal plate through a second solder layer, the metal circuit plate and the backing metal plate being provided respectively with a groove formed at each of solder layer side surfaces so as to communicate the each of the solder layer side surfaces with an outside of the semiconductor chip through the groove.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-07-11 | 1998-01-10 | 1998-07-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-07-11 | 2002-01-10 | 2002-07-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-07-11 | 2006-01-10 | 2006-07-12 | $7700.00 | Window Closed / Lapsed |