US4954386A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Joined ceramic-metal composite substrate and method for production thereof
Assignee: Toshiba Corp
•
Filing: 1988-12-08
•
Granted: 1990-09-04
•
Expires: 2008-12-08
Abstract
Abstract A joined ceramic-metal composite substrate having a copper sheet directly joined to a ceramic substrate and a method for the production thereof. The composite substrate is characterized by having at least one through hole in the copper sheet which is connected to at least one groove formed at a distance from the edge of the copper sheet on the surface of the copper sheet to be joined to the ceramic substrate.
Inventors
- 👤 Nobuyuki Mizunoya
- 👤 Hiroshi Komorita
- 👤 Tadashi Tanaka
- 👤 Kazuo Matsumura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 06:57
CPC Classifications
H; H05; H05K; H05K1/00; H05K3/00; H05K3/38; C; C04; C04B; C04B37/00; C04B37/02; C04B37/021; C04B2235/00; C04B2235/65; C04B2235/656; C04B2235/6567; C04B2235/70; C04B2235/74; C04B2235/78; C04B2235/785; C04B2237/00; C04B2237/30; C04B2237/40; C04B2237/407; C04B2237/50; C04B2237/56; C04B2237/568; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24322; Y10T428/24777; Y10T428/24802; Y10T428/24917; Y10T428/24926; Y10T428/31504; Y10T428/31678
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
65 words
A joined ceramic-metal composite substrate comprising a ceramic substrate having opposite surfaces and a copper sheet having a face directly joined to one of the surfaces of the ceramic substrate, at least one through hole in the copper sheet, and at least one groove on a portion of the face of the copper sheet, the face including a groove-free marginal area completely surrounding said portion.
Claim 2
Dependent Claim
65 words
A joined ceramic-metal composite substrate comprising a ceramic substrate having opposite surfaces and a copper sheet having a face directly joined to one of the surfaces of the ceramic substrate, at least one through hole in the copper sheet, and at least one groove on a portion of the face of the copper sheet, the face including a groove-free marginal area completely surrounding said portion.
Claim 3
Dependent Claim
28 words
The joined ceramic-metal composite substrate according to claim 1 wherein the through hole is cylindrical and has a diameter in the range of 0.02 mm to 1 mm.
Claim 4
Dependent Claim
23 words
The joined ceramic-metal composite substrate according to claim 1 wherein the groove terminates at least 1 mm from the periphery of the face.
Claim 5
Dependent Claim
24 words
The joined ceramic-metal composite substrate according to claim 1 wherein the groove has a width in a range of 0.5 mm to 1 mm.
Claim 6
Dependent Claim
23 words
The joined ceramic-metal composite substrate according to claim 1 wherein the groove has a depth in a range of 0.02 mm -0.008 mm.
Claim 7
Dependent Claim
19 words
The joined ceramic-metal composite substrate according to claim 1 wherein the composite substrate includes a plurality of parallel grooves.
Claim 8
Dependent Claim
28 words
The joined ceramic-metal composite substrate according to claim 6 wherein the distance between center lines of adjacent grooves is in a range of 1 mm to 25 mm.
Claim 9
Dependent Claim
24 words
The joined ceramic-metal composite substrate according to claim 1 wherein the composite substrate includes a plurality of grooves radially extending from the through hole.
Claim 10
Independent Claim
91 words
A method for producing a ceramic-metal composite substrate comprising the steps of: forming at least one groove on a face of a copper circuit board with a groove-free marginal area completely surrounding the face; forming at least one hole through the board and extending into the groove; and heat bonding the face of the board to a ceramic substrate, said groove having a width in a range of 0.01 mm to 3 mmand a maximum depth of the lesser of 0.1 mm and one half the thickness of the copper sheet.
Claim 11
Independent Claim
91 words
A method for producing a ceramic-metal composite substrate comprising the steps of: forming at least one groove on a face of a copper circuit board with a groove-free marginal area completely surrounding the face; forming at least one hole through the board and extending into the groove; and heat bonding the face of the board to a ceramic substrate, said groove having a width in a range of 0.01 mm to 3 mmand a maximum depth of the lesser of 0.1 mm and one half the thickness of the copper sheet.
Claim 12
Dependent Claim
49 words
The joined ceramic-metal composite substrate according to claim 1 wherein the ceramic substrate and the copper sheet have undergone heat treatment and said at least one groove on the face of the copper sheet has substantially collapsed through recovery of plastic deformation against the surface of this ceramic substrate.
Claim 13
Dependent Claim
70 words
The method according to claim 9, wherein the heat bonding step includes superimposing the copper circuit board on the ceramic substrate, heating the circuit board and substrate to a temperature in the range of 1,065 to 1,083° C., joining the circuit board and the substrate by eutectic reaction, and causing said at least one groove to substantially collapse against the surface of said ceramic substrate through recovery of plastic deformation.
References Cited (Backward Citations)
US171451A
Cited
US3826629A
Cited
US4409278A
Cited
US4608321A
Cited
EP0219254A1
Cited
US4739443A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-09-03 | 1994-03-05 | 1994-09-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-09-03 | 1998-03-05 | 1998-09-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-09-03 | 2002-03-05 | 2002-09-04 | $7700.00 | Window Closed / Lapsed |