Patent US5327013A successfully refreshed from Google Patents.
US5327013A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Solder bumping of integrated circuit die
Assignee: NXP USA Inc
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Filing: 1993-07-15
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Granted: 1994-07-05
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Expires: 2013-07-15
Abstract
Abstract A method for forming a solder bump on an integrated circuit die utilizes a terminal (12) formed of an electrically conductive, solder-wettable composite material composed of copper particles and a polymeric binder. The terminal comprises a bond pad (24) overlying a passivation layer (20) on the die and a runner section (26) connecting the bond pad to a metal contact (16). The terminal is applied to the die, for example, as an ink by screen printing, after which a body of solder alloy is reflowed in contact with the bond pad to form the bump. A preferred material for the terminal is composed of silver-plated copper particles and a resol type phenolic binder.
Inventors
- 👤 Kevin D. Moore
- 👤 Carl Missele
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 22:49
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3478; H10; H10W; H10W72/00; H10W72/20; H05K3/346; H10W72/01; H10W72/012; H10W70/00; H10W70/60; H10W72/241; H10W72/244; H10W72/251; H10W72/252; H10W72/281; H10W72/287; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49147; Y10T29/49149
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
106 words
A solder-bumped integrated circuit die comprising a substrate, a passivation layer overlying the substrate, said passivation layer being formed of a material nonwettable by a solder metal and defining an opening, a metal contact exposed through said opening, a terminal formed of an electrically conductive, solder-wettable material comprising copper particles and a polymeric binder, said terminal comprising a bond pad overlying said passivation layer spaced apart from the metal contact and a runner section extending from the bond pad and connected to the metal contact for conducting electrical signals between the bond pad and the metal contact, and a solder bump bonded to the bond pad.
Claim 2
Dependent Claim
106 words
A solder-bumped integrated circuit die comprising a substrate, a passivation layer overlying the substrate, said passivation layer being formed of a material nonwettable by a solder metal and defining an opening, a metal contact exposed through said opening, a terminal formed of an electrically conductive, solder-wettable material comprising copper particles and a polymeric binder, said terminal comprising a bond pad overlying said passivation layer spaced apart from the metal contact and a runner section extending from the bond pad and connected to the metal contact for conducting electrical signals between the bond pad and the metal contact, and a solder bump bonded to the bond pad.
Claim 3
Dependent Claim
121 words
A solder-bumped integrated circuit die comprising a silicon substrate, a passivation layer overlying the silicon substrate and formed of a dielectric polymer nonwettable by a solder metal, said passivation layer defining an opening, an aluminum metal contact on said silicon substrate and exposed through said opening, a terminal formed of an electrically conductive, solder-wettable material comprising silver-coated copper particles and a resol type phenol resin binder, said terminal comprising a bond pad overlying said passivation layer spaced apart from the aluminum metal contact and a runner section extending from the bond pad and connected to the aluminum metal contact for conducting electrical signals between the bond pad and the aluminum metal contact and a solder bump bonded to the bond pad.
Claim 4
Dependent Claim
121 words
A solder-bumped integrated circuit die comprising a silicon substrate, a passivation layer overlying the silicon substrate and formed of a dielectric polymer nonwettable by a solder metal, said passivation layer defining an opening, an aluminum metal contact on said silicon substrate and exposed through said opening, a terminal formed of an electrically conductive, solder-wettable material comprising silver-coated copper particles and a resol type phenol resin binder, said terminal comprising a bond pad overlying said passivation layer spaced apart from the aluminum metal contact and a runner section extending from the bond pad and connected to the aluminum metal contact for conducting electrical signals between the bond pad and the aluminum metal contact and a solder bump bonded to the bond pad.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-07-04 | 1998-01-03 | 1998-07-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-07-04 | 2002-01-03 | 2002-07-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-07-04 | 2006-01-03 | 2006-07-05 | $7700.00 | Window Closed / Lapsed |