US5326623A
Expired / Lapsed
US
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Circuit board
Assignee: Toshiba Corp
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Filing: 1993-01-28
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Granted: 1994-07-05
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Expires: 2013-01-28
Abstract
Abstract A circuit board including a circuit pattern adhered firmly to a ceramic substrate and capable of eliminating an increase in resistivity due to an influence of an external environment, particularly, a thermal influence is disclosed. The circuit board comprises a ceramic substrate, and a circuit pattern formed on the substrate and having a multilayered structure in which a bonding layer comprising Ti and at least one element selected from the group consisting of N and O, a conductor layer consisting essentially of Cu, and a protective layer comprising Ti and at least one element selected from the group consisting of N and O are stacked in the order named.
Inventors
- 👤 Koji Yamakawa
- 👤 Kaoru Koiwa
- 👤 Takaaki Yasumoto
- 👤 Kiyoshi Iyogi
- 👤 Nobuo Iwase
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 09:40
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/66; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/24926
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
82 words
A circuit board, comprising: a ceramic substrate; and a circuit pattern formed on said substrate and having a multilayered structure in which a bonding layer comprising Ti and at least one element selected from the group consisting of N and O, a conductor layer consisting essentially of Cu and O to 5 atomic % of Ti, and a protective layer comprising Ti and at least one element selected from the group consisting of N and O are stacked in the order named.
Claim 2
Dependent Claim
82 words
A circuit board, comprising: a ceramic substrate; and a circuit pattern formed on said substrate and having a multilayered structure in which a bonding layer comprising Ti and at least one element selected from the group consisting of N and O, a conductor layer consisting essentially of Cu and O to 5 atomic % of Ti, and a protective layer comprising Ti and at least one element selected from the group consisting of N and O are stacked in the order named.
Claim 3
Dependent Claim
21 words
The circuit board according to claim 1, wherein said ceramic substrate has a composition containing aluminum nitride as a main component.
Claim 4
Dependent Claim
40 words
The circuit board according to claim 1, wherein said bonding layer consists of 30 to 99.5 atom % of Ti and 0.5 to 70 atom % of at least one element selected from the group consisting of N and O.
Claim 5
Dependent Claim
40 words
The circuit board according to claim 1, wherein said bonding layer consists of 50 to 99.5 atom % of Ti and 0.5 to 50 atom % of at least one element selected from the group consisting of N and O.
Claim 6
Dependent Claim
29 words
The circuit board according to claim 1, wherein said bonding layer consists of Ti, at least one element selected from the group consisting of N and O, and Cu.
Claim 7
Dependent Claim
25 words
The circuit board according to claim 5, wherein Cu is contained in an amount of not more than 50 atom % in said bonding layer.
Claim 8
Dependent Claim
25 words
The circuit board according to claim 5, wherein Cu is contained in an amount of not more than 20 atom % in said bonding layer.
Claim 9
Dependent Claim
46 words
The circuit board according to claim 1, wherein said ceramic substrate has a composition containing aluminum nitride as a main component, and said bonding layer consists of Ti, at least one element selected from the group consisting of N and O, and aluminum of said substrate.
Claim 10
Dependent Claim
28 words
The circuit board according to claim 8, wherein aluminum of said substrate is contained in an amount of not more than 11 atomic % in said bonding layer.
Claim 11
Dependent Claim
14 words
The circuit board according to claim 1, wherein said conductor layer consists of Cu.
Claim 12
Dependent Claim
40 words
The circuit board according to claim 1, wherein said protective layer consists of 30 to 99.5 atom % of Ti and 0.5 to 70 atom % of at least one element selected from the group consisting of N and O.
Claim 13
Dependent Claim
40 words
The circuit board according to claim 1, wherein said protective layer consists of 33 to 66 atom % of Ti and 34 to 67 atom % of at least one element selected from the group consisting of N and O.
Claim 14
Dependent Claim
29 words
The circuit board according to claim 1, wherein said protective layer consists of Ti, at least one element selected from the group consisting of N and O, and Cu.
Claim 15
Dependent Claim
25 words
The circuit board according to claim 13, wherein Cu is contained in an amount of not more than 20 atom % in said protective layer.
Claim 16
Dependent Claim
25 words
The circuit board according to claim 13, wherein Cu is contained in an amount of not more than 5 atom % in said protective layer.
Claim 17
Dependent Claim
20 words
The circuit board according to claim 1, wherein said bonding layer has a thickness of 2 nm to 1,000 nm.
Claim 18
Dependent Claim
20 words
The circuit board according to claim 1, wherein said conductor layer has a thickness of 0.2 μm to 20 μm.
Claim 19
Dependent Claim
20 words
The circuit board according to claim 1, wherein said protective layer has a thickness of 5 nm to 1,000 nm.
References Cited (Backward Citations)
US5041700A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-07-04 | 1998-01-03 | 1998-07-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-07-04 | 2002-01-03 | 2002-07-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-07-04 | 2006-01-03 | 2006-07-05 | $7700.00 | Window Closed / Lapsed |