US5041700A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Circuit board including an aluminum nitride substrate and a multilayered metal oxynitride structure
Assignee: Toshiba Corp
•
Filing: 1990-09-27
•
Granted: 1991-08-20
•
Expires: 2010-09-27
Abstract
Abstract A circuit board includes an aluminum nitride substrate, and a circuit pattern formed on the substrate and having a multilayered structure in which a metal oxynitride layer represented by formula AluMlvM2xOyNz (wherein M1 represents a metal selected from the group consisting of Ti, Cr, Ta, and Zr, M2 represents a metal selected from the group consisting of Ni, Pt, Pd, W, Nb, and Mo, u represents 3 to 50 atm %, v represents 3 to 78 atm %, x represents 0 to 50 atm %, y represents 0.005 to 25 atm %, and z represents 5 to 70 atm %), a bonding layer consisting essentially of a metal represented by M1, a barrier layer consisting essentially of a metal represented by M2, and a conductor layer consisting essentially of Au are stacked in the order named.
Inventors
- 👤 Kiyoshi Iyogi
- 👤 Takaaki Yasumoto
- 👤 Toshirou Yanazawa
- 👤 Nobuo Iwase
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 19:05
CPC Classifications
C; C04; C04B; C04B41/00; C04B41/009; C04B41/45; C04B41/52; C04B41/80; C04B41/81; C04B41/89; H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/66; H10W70/67; H10W70/69; H10W70/692; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K3/00; H05K3/38
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
140 words
A circuit board comprising: an aluminum nitride substrate; and a circuit pattern formed on said substrate and having a multilayered structure in which a metal oxynitride layer represented by formula Al u M1 v M2 x O y N z (wherein M1 represents a metal selected from the group consisting of Ti, Cr, Ta, and Zr, M2 represents a metal selected from the group consisting of Ni, Pt, Pd, W, Nb, and Mo, u represents 3 to 50 atm%, v represents 3 to 78 atm%, x represents 0 to 50 atm%, y represents 0.005 to 25 atm%, and z represents 5 to 70 atm%), a bonding layer consisting essentially of a metal represented by M1, a barrier layer consisting essentially of a metal represented by M2, and a conductor layer consisting essentially of Au are stacked in the order named.
Claim 2
Dependent Claim
140 words
A circuit board comprising: an aluminum nitride substrate; and a circuit pattern formed on said substrate and having a multilayered structure in which a metal oxynitride layer represented by formula Al u M1 v M2 x O y N z (wherein M1 represents a metal selected from the group consisting of Ti, Cr, Ta, and Zr, M2 represents a metal selected from the group consisting of Ni, Pt, Pd, W, Nb, and Mo, u represents 3 to 50 atm%, v represents 3 to 78 atm%, x represents 0 to 50 atm%, y represents 0.005 to 25 atm%, and z represents 5 to 70 atm%), a bonding layer consisting essentially of a metal represented by M1, a barrier layer consisting essentially of a metal represented by M2, and a conductor layer consisting essentially of Au are stacked in the order named.
Claim 3
Dependent Claim
40 words
The circuit board according to claim 1, wherein said metal oxynitride layer is represented by formula Al u M1 v O y N z (wherein M1, u, v, y, and z have the same meanings as described in claim 1).
Claim 4
Dependent Claim
55 words
The circuit board according to claim 1, wherein said metal oxynitride layer consists of a material represented by formula Al u Ti v O y N z (wherein u, v, y, and z have the same meanings as described in claim 1), said bonding layer consists of Ti, and said barrier layer consists of Ni.
Claim 5
Dependent Claim
50 words
The circuit board according to claim 1, wherein said metal oxynitride layer is represented by formula Al u M1 v M2 x O y N z (wherein M1, M2, u, v, y and z have the same meanings as described in claim 1, and x represents 0.0001 to 50 atm%).
Claim 6
Dependent Claim
64 words
The circuit board according to claim 1, wherein said metal oxynitride layer consists of a material represented by formula Al u Ti v Ni x O y N z (wherein u, v, y, and z have the same meanings as described in claim 1, and x represents 0.0001 to 50 atm%), said bonding layer consists of Ti, and said barrier layer consists of Ni.
Claim 7
Dependent Claim
190 words
A circuit board comprising: an aluminum nitride substrate; and a circuit pattern formed on said substrate and having a multilayered structure in which an undercoating layer represented by formula Al u M1 v M2 w Au x O y N z (wherein M1 represents a metal selected from the group consisting of Ti, Cr, Ta, and Zr, M2 represents a metal selected from the group consisting of Ni, Pt, Pd, W, Nb, and Mo, u represents 0.1 to 40 atm%, v represents 0.5 to 50 atm%, w represents 0.1 to 50 atm%, x represents 0.05 to 30 atm%, y represents 0 to 20 atm%, and z represents 0.1 to 40 atm%) and a main layer represented by formula M1 w M2 x Au y O z (wherein M1 represents a metal selected from the group consisting of Ti, Cr, Ta, and Zr, M2 represents a metal selected from the group consisting of Ni, Pt, Pd, W, Nb, and Mo, w represents 0.5 to 50 atm%, x represents 0.1 to 50 atm%, y represents 0.1 to 80 atm%, and z represents 0 to 1.5 atm%) are stacked in the order named.
Claim 8
Dependent Claim
190 words
A circuit board comprising: an aluminum nitride substrate; and a circuit pattern formed on said substrate and having a multilayered structure in which an undercoating layer represented by formula Al u M1 v M2 w Au x O y N z (wherein M1 represents a metal selected from the group consisting of Ti, Cr, Ta, and Zr, M2 represents a metal selected from the group consisting of Ni, Pt, Pd, W, Nb, and Mo, u represents 0.1 to 40 atm%, v represents 0.5 to 50 atm%, w represents 0.1 to 50 atm%, x represents 0.05 to 30 atm%, y represents 0 to 20 atm%, and z represents 0.1 to 40 atm%) and a main layer represented by formula M1 w M2 x Au y O z (wherein M1 represents a metal selected from the group consisting of Ti, Cr, Ta, and Zr, M2 represents a metal selected from the group consisting of Ni, Pt, Pd, W, Nb, and Mo, w represents 0.5 to 50 atm%, x represents 0.1 to 50 atm%, y represents 0.1 to 80 atm%, and z represents 0 to 1.5 atm%) are stacked in the order named.
Claim 9
Dependent Claim
43 words
The circuit board according to claim 6, wherein said undercoating layer is represented by formula Al u M1 v M2 w Au x N z (wherein M1, M2, u, v, w, x, and z have the same meanings as described in claim 6).
Claim 10
Dependent Claim
41 words
The circuit board according to claim 7, wherein said undercoating layer is represented by formula Al u Ti v Ni w Au x N z (wherein u, v, w, z, and z have the same meanings as described in claim 6).
Claim 11
Dependent Claim
50 words
The circuit board according to claim 6, wherein said undercoating layer is represented by formula Al u M1 w Au x O y N z (wherein M1, M2, u, v, w, x, and z have the same meanings as described in claim 6, and y represents 0.0001 to 20 atm%).
Claim 12
Dependent Claim
50 words
The circuit board according to claim 9, wherein said undercoating layer is represented by formula Al u Ti v Ni w Au x O y N z (wherein u, v, w, x, and z have the same meanings as described in claim 6, and y represents 0.0001 to 20 atm%).
Claim 13
Dependent Claim
37 words
The circuit board according to claim 6, wherein said main layer is represented by formula M1 w M2 x Au y (wherein M1, M2, w, x, and y have the same meanings as described in claim 6).
Claim 14
Dependent Claim
35 words
The circuit board according to claim 11, wherein said main layer is represented by formula Ti w Ni x Au y (wherein w, x, and y have the same meanings as described in claim 6).
Claim 15
Dependent Claim
46 words
The circuit board according to claim 6, wherein said main layer is represented by formula M1 w M2 x Au y O z (wherein M1, M2, w, x, and y have the same meanings as described in claim 6, and z represents 0.0001 to 1.5 atm%).
Claim 16
Dependent Claim
44 words
The circuit board according to claim 13, wherein said main layer is represented by formula Ti w Ni x Au y O z (wherein w, x, and y have the same meanings as described in claim 6 and z represents 0.0001 to 1.5 atm%.
Claim 17
Dependent Claim
251 words
A circuit board comprising: an aluminum nitride substrate; a lead bonding region having a multilayered structure which is formed on said substrate and in which an undercoating layer represented by formula Al u M1 v M2 w Cu x O y N z (wherein M1 represents a metal selected from the group consisting of Ti, Cr, Ta, and Zr, M2 represents a metal selected from the group consisting of Ni, Pt, Pd, W, Nb, and Mo, u represents 0.1 to 25 atm%, v represents 0.2 to 35 atm%, w represents 0.1 to 50 atm%, x represents 0.005 to 1.5 atm%, y represents 0 to 1.5 atm%, and z represents 0.5 to 40 atm%) and a main layer represented by formula M1 x M2 y Cu z (wherein M1 represents a metal selected from the group consisting of Ti, Cr, Ta, and Zr, M2 represents a metal selected from the group consisting of Ni, Pt, Pd, W, Nb, and Mo, x represents 1 to 50 atm%, y represents 10 to 80 atm%, z represents 0.2 to 40 atm%) are stacked in the order named; a circuit pattern formed on said substrate and electrically connected to said lead bonding region; a brazing material layer bonded on said main layer of said lead bonding region and represented by formula Ag x Cu y Au z (wherein x represents 5 to 90 atm%), y represents 1 to 50 atm%, and z represents 1 to 50 atm%); and a lead bonded on said brazing material layer.
Claim 18
Dependent Claim
251 words
A circuit board comprising: an aluminum nitride substrate; a lead bonding region having a multilayered structure which is formed on said substrate and in which an undercoating layer represented by formula Al u M1 v M2 w Cu x O y N z (wherein M1 represents a metal selected from the group consisting of Ti, Cr, Ta, and Zr, M2 represents a metal selected from the group consisting of Ni, Pt, Pd, W, Nb, and Mo, u represents 0.1 to 25 atm%, v represents 0.2 to 35 atm%, w represents 0.1 to 50 atm%, x represents 0.005 to 1.5 atm%, y represents 0 to 1.5 atm%, and z represents 0.5 to 40 atm%) and a main layer represented by formula M1 x M2 y Cu z (wherein M1 represents a metal selected from the group consisting of Ti, Cr, Ta, and Zr, M2 represents a metal selected from the group consisting of Ni, Pt, Pd, W, Nb, and Mo, x represents 1 to 50 atm%, y represents 10 to 80 atm%, z represents 0.2 to 40 atm%) are stacked in the order named; a circuit pattern formed on said substrate and electrically connected to said lead bonding region; a brazing material layer bonded on said main layer of said lead bonding region and represented by formula Ag x Cu y Au z (wherein x represents 5 to 90 atm%), y represents 1 to 50 atm%, and z represents 1 to 50 atm%); and a lead bonded on said brazing material layer.
Claim 19
Dependent Claim
43 words
The circuit board according to claim 15, wherein said undercoating layer is represented by formula Al u M1 v M2 w Cu x N z (wherein M1, M2, u, v, w, x, and z have the same meanings as described in claim 15).
Claim 20
Dependent Claim
41 words
The circuit board according to claim 16, wherein said undercoating layer is represented by formula Al u Ti v Ni w Cu x N z (wherein u, v, w, x, and z have the same meanings as described in claim 15).
Claim 21
Dependent Claim
52 words
The circuit board according to claim 15, wherein said undercoating layer is represented by formula Al u M1 v M2 w Cu x O y N z (wherein M1, M2, u, v, w, x, and z have the same meanings as described in claim 15, and y represents 0.0001 to 1.5 atm%).
Claim 22
Dependent Claim
50 words
The circuit board according to claim 18, wherein said undercoating layer is represented by formula Al u Ti v Ni w Cu x O y N z (wherein u, v, w, x, and z have the same meanings as described in claim 15, and y represents 0.0001 to 1.5 atm%).
Claim 23
Dependent Claim
60 words
The circuit board according to claim 15, wherein a frame-like pattern having a multilayered structure in which said undercoating layer and said main layer are stacked in the order named is formed on the surface of said AlN substrate, said brazing material layer is bonded on said frame-like pattern, and a seal frame is bonded on said brazing material layer.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-08-19 | 1995-02-18 | 1995-08-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-08-19 | 1999-02-18 | 1999-08-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-08-19 | 2003-02-18 | 2003-08-20 | $7700.00 | Window Closed / Lapsed |