Patent US5325583A successfully refreshed from Google Patents.
US5325583A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for manufacturing printed circuit board
Assignee: Toshiba Corp
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Filing: 1992-10-08
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Granted: 1994-07-05
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Expires: 2012-10-08
Abstract
Abstract There is disclosed a method for manufacturing a printed circuit board in which fine copper circuit patterns are transferred onto a thermoplastic resin, without producing a large amount of waste liquors in which copper is dissolved unlike in a subtract method. The method for manufacturing a printed circuit board includes the steps of manufacturing a printed circuit original plate having protruding patterns which have the same shape as circuit patterns to be formed and a height at least the same as the thickness of a copper foil used and each of which is constituted by a flat or projecting curved surface to be brought into contact with the copper foil and side surfaces different from the flat or projecting curved surface, and heating under pressure the protruding patterns of the original plate against a thermoplastic resin with the copper foil interposed therebetween to transfer portions of the copper foil in contact with the protruding patterns onto the surface of the thermoplastic resin, thereby forming the circuit patterns.
Inventors
- 👤 Seizaburo Shimizu
- 👤 Osamu Sasaki
- 👤 Akira Yoshizumi
- 👤 Hideo Ohta
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 15:21
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/02; H05K3/04; H05K3/041; H05K3/20; H05K3/40; H05K3/4038; H05K3/4084; H05K3/46; H05K3/4611; H05K3/4614; H05K3/4617; H05K3/4626; H05K3/4632; H05K3/4635; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/036; H05K1/0393; H05K1/11; H05K1/118; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/05; H05K2201/055; H05K2201/09; H05K2201/09009; H05K2201/09081; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0108; H05K2203/0147; H05K2203/0156; H05K2203/0195; H05K2203/08; H05K2203/085; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1062; Y10T156/107; Y10T156/1089; Y10T156/109; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49158; Y10T29/4916; Y10T29/49165; Y10T29/49167; Y10T29/53; Y10T29/5313; Y10T29/532
Claims Analysis
Total Claims: 40
Claim 1
Independent Claim
136 words
A method for manufacturing a printed circuit board, comprising the steps of: manufacturing a printed circuit original plate having protruding patterns which have the same shape as circuit patterns to be formed and a height at least the same as a thickness of a metal foil used and each of which is constituted by a flat or projecting curved surface to be brought into contact with said metal foil and side surfaces converging inwardly from said flat or projecting curved surface over at least a portion of said side surfaces; and heating under pressure said protruding patterns of said original plate against a thermoplastic resin with said metal foil interposed therebetween to transfer portions of said metal foil in contact with said protruding patterns onto a surface of said thermoplastic resin, thereby forming said circuit patterns.
Claim 2
Independent Claim
136 words
A method for manufacturing a printed circuit board, comprising the steps of: manufacturing a printed circuit original plate having protruding patterns which have the same shape as circuit patterns to be formed and a height at least the same as a thickness of a metal foil used and each of which is constituted by a flat or projecting curved surface to be brought into contact with said metal foil and side surfaces converging inwardly from said flat or projecting curved surface over at least a portion of said side surfaces; and heating under pressure said protruding patterns of said original plate against a thermoplastic resin with said metal foil interposed therebetween to transfer portions of said metal foil in contact with said protruding patterns onto a surface of said thermoplastic resin, thereby forming said circuit patterns.
Claim 3
Dependent Claim
20 words
The method according to claim 1, wherein said thermoplastic resin has a softening temperature of not less than 200° C.
Claim 4
Independent Claim
207 words
A method for manufacturing a printed circuit board, comprising the steps of: manufacturing a printed circuit original plate having protruding patterns which have the same shape as circuit patterns to be formed and a height at least the same as a thickness of a metal foil used and each of which is constituted by a flat or projecting curved surface to be brought into contact with said metal foil and side surfaces converging inwardly from said flat or projecting curved surface over at least a portion of said side surfaces; heating under pressure said protruding patterns of said original plate against a resin film with said metal foil interposed therebetween to transfer portions of said metal foil in contact with said protruding patterns onto a surface of said resin film to form said circuit patterns, thereby manufacturing a single-sided printed circuit base plate; folding said circuit patterns of said single-sided printed circuit base plate and desired portions of said film toward the lower surface of the film, thereby forming a large number of folded portions having conductive portions formed integrally with said circuit patterns; and superposing a plurality of single-sided printed circuit base plates having said folded portions, and laminating said base plates by heating under pressure.
Claim 5
Independent Claim
207 words
A method for manufacturing a printed circuit board, comprising the steps of: manufacturing a printed circuit original plate having protruding patterns which have the same shape as circuit patterns to be formed and a height at least the same as a thickness of a metal foil used and each of which is constituted by a flat or projecting curved surface to be brought into contact with said metal foil and side surfaces converging inwardly from said flat or projecting curved surface over at least a portion of said side surfaces; heating under pressure said protruding patterns of said original plate against a resin film with said metal foil interposed therebetween to transfer portions of said metal foil in contact with said protruding patterns onto a surface of said resin film to form said circuit patterns, thereby manufacturing a single-sided printed circuit base plate; folding said circuit patterns of said single-sided printed circuit base plate and desired portions of said film toward the lower surface of the film, thereby forming a large number of folded portions having conductive portions formed integrally with said circuit patterns; and superposing a plurality of single-sided printed circuit base plates having said folded portions, and laminating said base plates by heating under pressure.
Claim 6
Dependent Claim
25 words
The method according to claim 3, wherein said resin film consists of a thermoplastic resin having a softening temperature of not less than 200° C.
Claim 7
Dependent Claim
27 words
The method according to claim 3, wherein said resin film consists of a thermoplastic resin film having a softening temperature difference between upper and lower surfaces thereof.
Claim 8
Dependent Claim
23 words
The method according to claim 5, wherein said thermoplastic resin film is obtained by laminating two thermoplastic resin layers having different softening temperatures.
Claim 9
Dependent Claim
47 words
The method according to claim 6, wherein when said metal foil is brought into contact with a low-softening temperature thermoplastic resin layer of said thermoplastic resin film, a thickness of said low-softening temperature thermoplastic resin layer is equal to or smaller than that of said metal foil.
Claim 10
Dependent Claim
30 words
The method according to claim 5, wherein said laminating step is performed at a temperature at which a low-softening temperature thermoplastic resin layer of said thermoplastic resin film is melted.
Claim 11
Dependent Claim
24 words
The method according to claim 3, wherein said resin film has a softening temperature difference between upper and lower surfaces and an interior thereof.
Claim 12
Dependent Claim
49 words
The method according to claim 9, wherein said thermoplastic resin film is obtained by coating two surfaces of a thermoplastic resin layer with thermoplastic resin layers each having a thickness smaller than that of said metal foil and a softening temperature lower than that of said thermoplastic resin layer.
Claim 13
Dependent Claim
30 words
The method according to claim 9, wherein said laminating step is performed at a temperature at which a low-softening temperature thermoplastic resin layer of said thermoplastic resin film is melted.
Claim 14
Dependent Claim
36 words
The method according to claim 3, wherein said resin film consists of a thermoplastic resin film, a surface of which is to be brought into contact with said metal foil is coated with an adhesive layer.
Claim 15
Dependent Claim
90 words
The method according to claim 3, wherein said step of forming folded portions is performed by inserting a notching member having a single-edged blade at a distal end thereof into circuit patterns of said single-sided printed circuit base plate and desired portions of said film to extend notched portions constituted by said circuit patterns and said film downward in an insertion direction of said notching member, and folding said notched portions such that the film of each notched portion overlaps the lower surface of the film of said base plate.
Claim 16
Independent Claim
155 words
A method for manufacturing a printed circuit board, comprising the steps of: manufacturing a printed circuit original plate having protruding patterns which have the same shape as circuit patterns to be formed and a height at least the same as a thickness of a metal foil used and each of which is constituted by a flat or projecting curved surface to be brought into contact with said metal foil and side surfaces converging inwardly from said flat or projecting curved surface over at least a portion of said side surfaces; pressing said protruding patterns of said original plate against a film consisting of a resin or rubber with a metal foil interposed therebetween to transfer portions of said metal foil in contact with said protruding patterns onto a surface of said film to form said circuit patterns, thereby manufacturing a transfer film; and retransferring said circuit patterns of said transfer film onto an insulating base.
Claim 17
Independent Claim
155 words
A method for manufacturing a printed circuit board, comprising the steps of: manufacturing a printed circuit original plate having protruding patterns which have the same shape as circuit patterns to be formed and a height at least the same as a thickness of a metal foil used and each of which is constituted by a flat or projecting curved surface to be brought into contact with said metal foil and side surfaces converging inwardly from said flat or projecting curved surface over at least a portion of said side surfaces; pressing said protruding patterns of said original plate against a film consisting of a resin or rubber with a metal foil interposed therebetween to transfer portions of said metal foil in contact with said protruding patterns onto a surface of said film to form said circuit patterns, thereby manufacturing a transfer film; and retransferring said circuit patterns of said transfer film onto an insulating base.
Claim 18
Dependent Claim
12 words
The method according to claim 14, wherein said rubber is silicone rubber.
Claim 19
Dependent Claim
23 words
The method according to claim 14, wherein said insulating base is a prepreg obtained by impregnating a thermosetting resin into a glass cloth.
Claim 20
Dependent Claim
27 words
The method according to claim 14, wherein said insulating base is a thermoplastic resin film, at least one surface of which is coated with an adhesive layer.
Claim 21
Independent Claim
143 words
A method for manufacturing a printed circuit board, comprising the steps of: manufacturing a printed circuit original plate having protruding patterns which have the same shape as circuit patterns to be formed and a height at least the same as a thickness of a metal foil used, each of said protruding patterns having a flat or projecting curved surface to be brought into contact with said metal foil, said original plate having a plurality of holes positioned in non-protruding regions; and heating under pressure said protruding patterns of said original plate against a resin film with said metal foil interposed therebetween while drawing said metal foil for said original plate by suction through said holes of said original plate to transfer portions of said metal foil in contact with said protruding patterns onto a surface of said resin, thereby forming said circuit patterns.
Claim 22
Independent Claim
143 words
A method for manufacturing a printed circuit board, comprising the steps of: manufacturing a printed circuit original plate having protruding patterns which have the same shape as circuit patterns to be formed and a height at least the same as a thickness of a metal foil used, each of said protruding patterns having a flat or projecting curved surface to be brought into contact with said metal foil, said original plate having a plurality of holes positioned in non-protruding regions; and heating under pressure said protruding patterns of said original plate against a resin film with said metal foil interposed therebetween while drawing said metal foil for said original plate by suction through said holes of said original plate to transfer portions of said metal foil in contact with said protruding patterns onto a surface of said resin, thereby forming said circuit patterns.
Claim 23
Dependent Claim
23 words
The method according to claim 18, wherein said resin is a thermoplastic resin having a softening temperature of not less than 200° C.
Claim 24
Independent Claim
176 words
A method for manufacturing a printed circuit board, comprising the steps of: manufacturing a printed circuit original plate having protruding patterns which have the same shape as circuit patterns to be formed and a height at least the same as a thickness of a metal foil used, each of said protruding patterns having a flat or projecting curved surface to be brought into contact with said metal foil; heating under pressure said protruding patterns of said original plate against a resin film with said metal foil interposed therebetween to transfer portions of said metal foil in contact with said protruding patterns onto a surface of said resin film to form said circuit patterns, thereby manufacturing a single-sided printed circuit base plate; folding said circuit patterns of said single-sided printed circuit base plate and desired portions of said film toward the lower surface of the film, thereby forming a large number of folded portions having conductive portions formed integrally with said circuit patterns; and superposing a plurality of single-sided printed circuit base plates by heating under pressure.
Claim 25
Independent Claim
176 words
A method for manufacturing a printed circuit board, comprising the steps of: manufacturing a printed circuit original plate having protruding patterns which have the same shape as circuit patterns to be formed and a height at least the same as a thickness of a metal foil used, each of said protruding patterns having a flat or projecting curved surface to be brought into contact with said metal foil; heating under pressure said protruding patterns of said original plate against a resin film with said metal foil interposed therebetween to transfer portions of said metal foil in contact with said protruding patterns onto a surface of said resin film to form said circuit patterns, thereby manufacturing a single-sided printed circuit base plate; folding said circuit patterns of said single-sided printed circuit base plate and desired portions of said film toward the lower surface of the film, thereby forming a large number of folded portions having conductive portions formed integrally with said circuit patterns; and superposing a plurality of single-sided printed circuit base plates by heating under pressure.
Claim 26
Dependent Claim
25 words
The method according to claim 20, wherein said resin film consists of a thermoplastic resin having a softening temperature of not less than 200° C.
Claim 27
Dependent Claim
27 words
The method according to claim 20, wherein said resin film consists of a thermoplastic resin film having a softening temperature difference between upper and lower surfaces thereof.
Claim 28
Dependent Claim
23 words
The method according to claim 22, wherein said thermoplastic resin film is obtained by laminating two thermoplastic resin layers having different softening temperatures.
Claim 29
Dependent Claim
47 words
The method according to claim 23, wherein when said metal foil is brought into contact with a low-softening temperature thermoplastic resin layer of said thermoplastic resin film, a thickness of said low-softening temperature thermoplastic resin layer is equal to or smaller than that of said metal foil.
Claim 30
Dependent Claim
30 words
The method according to claim 22, wherein said laminating step is performed at a temperature at which a low-softening temperature thermoplastic resin layer of said thermoplastic resin film is melted.
Claim 31
Dependent Claim
24 words
The method according to claim 20, wherein said resin film has a softening temperature difference between upper and lower surfaces and an interior thereof.
Claim 32
Dependent Claim
48 words
The method according to claim 26, wherein said thermoplastic resin film is obtained by coating two surfaces of a thermoplastic resin layer with thermoplastic resin layers each having a thickness smaller than that of said metal foil and softening temperature lower than that of said thermoplastic resin layer.
Claim 33
Dependent Claim
29 words
The method according to claim 26, wherein said laminating step is performed at a temperature at which low-softening temperature thermoplastic resin layer of said thermoplastic resin film is melted.
Claim 34
Dependent Claim
36 words
The method according to claim 20, wherein said resin film consists of a thermoplastic resin film, a surface of which is to be brought into contact with said metal foil is coated with an adhesive layer.
Claim 35
Dependent Claim
89 words
The method according to claim 20, wherein said step of forming portions is performed by inserting a notching member having a single-edge blade at a distal end thereof into circuit patterns of said single-sided printed circuit base plate and desired portions of said film to extend notched portions constituted by said circuit patterns and said film downward in an insertion direction of said notching member, and folding said notched portions such that the film of each notched portions overlaps the lower surface of the film of said base plate.
Claim 36
Independent Claim
133 words
A method for manufacturing a printed circuit board, comprising the steps of: manufacturing a printed circuit original plate having protruding patterns which have the same shape as circuit patterns to be formed and a height at least the same as a thickness of a metal foil used, each of said protruding pattern having a flat or projecting curved surface to be brought into contact with said metal foil; pressing said protruding patterns of said original plate against a film consisting of a resin or rubber with a metal foil interposed therebetween to transfer portions of said metal foil in contact with said protruding patterns onto a surface of said film to form said circuit patterns, thereby manufacturing a transfer film, and retransferring said circuit patterns of said transfer film onto an insulating base.
Claim 37
Independent Claim
133 words
A method for manufacturing a printed circuit board, comprising the steps of: manufacturing a printed circuit original plate having protruding patterns which have the same shape as circuit patterns to be formed and a height at least the same as a thickness of a metal foil used, each of said protruding pattern having a flat or projecting curved surface to be brought into contact with said metal foil; pressing said protruding patterns of said original plate against a film consisting of a resin or rubber with a metal foil interposed therebetween to transfer portions of said metal foil in contact with said protruding patterns onto a surface of said film to form said circuit patterns, thereby manufacturing a transfer film, and retransferring said circuit patterns of said transfer film onto an insulating base.
Claim 38
Dependent Claim
12 words
The method according to claim 31, wherein said rubber is silicone rubber.
Claim 39
Dependent Claim
23 words
The method according to claim 31, wherein said insulating base is a prepreg obtained by impregnating a thermosetting resin into a glass cloth.
Claim 40
Dependent Claim
27 words
The method according to claim 29, wherein said insulating base is a thermoplastic resin film, at least one surface of which is coated with an adhesive layer.
References Cited (Backward Citations)
DE808052C
Cited
US2886880A
Cited
CH410087A
Cited
DE1490231A1
Cited
DE1816886A1
Cited
GB1259837A
Cited
DE2107591A1
Cited
JPS51126277A
Cited
US4313995A
Cited
JPS60231392A
Cited
JPS6452792A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 7.5 Years (Year 8) | 2001-07-04 | 2002-01-03 | 2002-07-05 | $3760.00 | Window Closed / Lapsed |
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