US5324890A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Direct bond copper-output footprint
Assignee: Delphi Technologies Inc
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Filing: 1993-09-09
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Granted: 1994-06-28
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Expires: 2013-09-09
Abstract
Abstract The invention includes a flat, planar, single piece copper footprint including a first portion for mounting an aluminum bond pad, and a third portion for mounting a semi-conductor device, and a second portion, interposed between the first and third portions, which is recessed and includes arcuate-shaped sides. The recessed arcuate-shaped sides of the second portion of the copper footprint act as a solder stop preventing solder from flowing from the first portion to the third portion or vice versa.
Inventors
- 👤 Daniel A. Lawlyes
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 18:09
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W72/551; H10W72/552; H10W72/5524; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
122 words
A device comprising: a flat, planar, single-piece electrically conductive footprint including a first substantially rectangular-shaped portion and a third substantially rectangular-shaped portion, and a second portion interposed between the first and third portions of the copper footprint; a metal oxide semi-conductor device soldered to the first portion of the footprint, and an electrically conductive bond pad soldered to the third portion of the footprint; said second portion having a width less than the first and third portions of the footprint and having arcuate-shaped sides constructed and arranged to act as a solder stop preventing solder from flowing from between the first and third portions of the footprint during assembly; and electrical connections provided to the metal-oxide semi-conductor device and the bond pad.
Claim 2
Independent Claim
122 words
A device comprising: a flat, planar, single-piece electrically conductive footprint including a first substantially rectangular-shaped portion and a third substantially rectangular-shaped portion, and a second portion interposed between the first and third portions of the copper footprint; a metal oxide semi-conductor device soldered to the first portion of the footprint, and an electrically conductive bond pad soldered to the third portion of the footprint; said second portion having a width less than the first and third portions of the footprint and having arcuate-shaped sides constructed and arranged to act as a solder stop preventing solder from flowing from between the first and third portions of the footprint during assembly; and electrical connections provided to the metal-oxide semi-conductor device and the bond pad.
Claim 3
Dependent Claim
13 words
A device as set forth in claim 1 wherein said footprint comprises copper.
Claim 4
Independent Claim
100 words
A method of making a semi-conductor assembly comprising: providing a planar electrically conductive footprint including first, second and third portions, said second portion being interposed between said first and third portions, and said second portion having a width less than said first and third portions; soldering a metal-oxide semi-conductor device to the first portion of the footprint and soldering a contact pad to the second portion of the footprint; and said second portion having arcuate-shaped sides constructed and arranged to act as a solder stop preventing solder from flowing between said first and third portions of the footprint during assembly.
Claim 5
Independent Claim
100 words
A method of making a semi-conductor assembly comprising: providing a planar electrically conductive footprint including first, second and third portions, said second portion being interposed between said first and third portions, and said second portion having a width less than said first and third portions; soldering a metal-oxide semi-conductor device to the first portion of the footprint and soldering a contact pad to the second portion of the footprint; and said second portion having arcuate-shaped sides constructed and arranged to act as a solder stop preventing solder from flowing between said first and third portions of the footprint during assembly.
Claim 6
Dependent Claim
13 words
A method as set forth in claim 3 wherein said footprint comprises copper.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-06-27 | 1997-12-27 | 1998-06-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-06-27 | 2001-12-27 | 2002-06-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-06-27 | 2005-12-27 | 2006-06-28 | $7700.00 | Window Closed / Lapsed |