US5322207A — Method and apparatus for wire bonding semiconduct…

Claim 1

Independent Claim 149 words

In semiconductor manufacture a method of wire bonding semiconductor dice attached to a leadframe strip comprising: providing a wire bonding apparatus having a heat block for heating the dice and leadframe strip, a clamp having multiple bond site windows spaced apart to match the spacing of the dice on the leadframe strip and a bonding tool for wire bonding; indexing the semiconductor leadframe strip to a precise location within the wire bonding apparatus; clamping multiple semiconductor dice attached to the leadframe strip between the heat block and clamp of the wire bonding apparatus; wire bonding bond pads on a first die to lead fingers of the leadframe strip using the bonding tool of the wire bonding apparatus placed through a first bond site window; and moving the bonding tool to successively wire bond each die clamped between the clamp and heat block with a single index of the leadframe.

Claim 2

Dependent Claim 149 words

In semiconductor manufacture a method of wire bonding semiconductor dice attached to a leadframe strip comprising: providing a wire bonding apparatus having a heat block for heating the dice and leadframe strip, a clamp having multiple bond site windows spaced apart to match the spacing of the dice on the leadframe strip and a bonding tool for wire bonding; indexing the semiconductor leadframe strip to a precise location within the wire bonding apparatus; clamping multiple semiconductor dice attached to the leadframe strip between the heat block and clamp of the wire bonding apparatus; wire bonding bond pads on a first die to lead fingers of the leadframe strip using the bonding tool of the wire bonding apparatus placed through a first bond site window; and moving the bonding tool to successively wire bond each die clamped between the clamp and heat block with a single index of the leadframe.

Claim 3

Dependent Claim 17 words

The method as recited in claim 1 and wherein two dice are clamped and successively wire bonded.

Claim 4

Dependent Claim 28 words

The method as recited in claim 1 and further comprising retaining multiple dice in contact with the heat block using multiple vacuum ports formed in the heat block.

Claim 5

Dependent Claim 30 words

The method as recited in claim 1 and wherein the semiconductor dice and leadframe are suitable for forming DIP, ZIP, SOJ, TSOP, PLCC, SOIC, PQFP, or IDF type semiconductor packages.

Claim 6

Dependent Claim 118 words

In semiconductor manufacture, a method of wire bonding bond pads on semiconductor dice with lead fingers of a semiconductor leadframe comprising; attaching multiple semiconductor dice to mounting paddles of the leadframe; providing a wire bonding apparatus having a heat block for heating the dice and a clamp for clamping the dice for wire bonding by a bond tool, with the heat block and clamp adapted to simultaneously clamp and heat multiple dice; indexing the leadframe to a precise location for clamping multiple semiconductor dice between the clamp and heat block for wire bonding; and moving the bonding tool to successively wire bond each die clamped between the clamp and heat block with a single index of the leadframe.

Claim 7

Dependent Claim 118 words

In semiconductor manufacture, a method of wire bonding bond pads on semiconductor dice with lead fingers of a semiconductor leadframe comprising; attaching multiple semiconductor dice to mounting paddles of the leadframe; providing a wire bonding apparatus having a heat block for heating the dice and a clamp for clamping the dice for wire bonding by a bond tool, with the heat block and clamp adapted to simultaneously clamp and heat multiple dice; indexing the leadframe to a precise location for clamping multiple semiconductor dice between the clamp and heat block for wire bonding; and moving the bonding tool to successively wire bond each die clamped between the clamp and heat block with a single index of the leadframe.

Claim 8

Dependent Claim 29 words

The method as recited in claim 5 and wherein the heat block and clamp are adapted to wire bond two semiconductor dice with a single index of the leadframe.

Claim 9

Dependent Claim 25 words

The method as recited in claim 5 and wherein the semiconductor dice are either DIP, ZIP, SOJ, TSOP, PLCC, SOIC, PQFP, or IDF type dice.

Claim 10

Dependent Claim 27 words

The method as recited in claim 5 and wherein the heat block includes multiple die paddle contact areas for contacting multiple die paddles and heating multiple dice.

Claim 11

Dependent Claim 29 words

The method as recited in claim 8 and wherein the heat block includes multiple vacuum ports for maintaining the die paddles in contact with the die paddle contact areas.

Claim 12

Dependent Claim 44 words

The method as recited in claim 5 and wherein the leadframe is moved from left to right during indexing and the bond tool wire bonds a die furthest to the right first and then moves to the left to wire bond an adjacent die.

Claim 13

Independent Claim 162 words

A method for wire bonding bond pads formed on a semiconductor die to lead fingers of a semiconductor leadframe, comprising; attaching multiple semiconductor dice to mounting paddles of the leadframe; providing a wire bonding apparatus having a clamp for clamping two semiconductor dice contained on the leadframe to a heat block for heating the dice and leadframe; indexing the leadframe to position two adjacent dice for clamping between the clamp and the heat block; clamping the two adjacent dice between the clamp and the heat block; wire bonding a first clamped die using a bonding tool placed through a first bond site window of the clamp; moving the bonding tool to a second clamped die; wire bonding the second clamped die using the bonding tool placed through a second bond site window of the clamp; and indexing the leadframe to position a next two adjacent dice for clamping between the clamp and heat block and for wire bonding by the bond tool.

Claim 14

Independent Claim 162 words

A method for wire bonding bond pads formed on a semiconductor die to lead fingers of a semiconductor leadframe, comprising; attaching multiple semiconductor dice to mounting paddles of the leadframe; providing a wire bonding apparatus having a clamp for clamping two semiconductor dice contained on the leadframe to a heat block for heating the dice and leadframe; indexing the leadframe to position two adjacent dice for clamping between the clamp and the heat block; clamping the two adjacent dice between the clamp and the heat block; wire bonding a first clamped die using a bonding tool placed through a first bond site window of the clamp; moving the bonding tool to a second clamped die; wire bonding the second clamped die using the bonding tool placed through a second bond site window of the clamp; and indexing the leadframe to position a next two adjacent dice for clamping between the clamp and heat block and for wire bonding by the bond tool.

Claim 15

Dependent Claim 38 words

The method as recited in claim 11 and wherein the heat block includes two die paddle contact areas for contacting the die paddles and two vacuum ports for maintaining the die paddles in contact with the heat block.

Claim 16

Dependent Claim 29 words

The method as recited in claim 12 and wherein the dice are selected from the group consisting of DIP, ZIP, SOJ, TSOP, PLCC, SOIC, PQFP, or IDF type dice.

Claim 17

Dependent Claim 26 words

The method as recited in claim 13 and wherein the spacing of the bond site windows matches a spacing of the semiconductor dice on the leadframe.

Claim 18

Dependent Claim 27 words

The method as recited in claim 14 and wherein the leadframe is moved to the right and a die furthest to the right is wire bonded first.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	1997-06-20	1997-12-20	1998-06-21	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2001-06-20	2001-12-20	2002-06-21	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2005-06-20	2005-12-20	2006-06-21	$7700.00	Window Closed / Lapsed

Method and apparatus for wire bonding semiconductor dice to a leadframe

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