US5321453A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Probe apparatus for probing an object held above the probe card
Assignee: Tokyo Electron Ltd
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Filing: 1992-08-03
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Granted: 1994-06-14
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Expires: 2012-08-03
Abstract
Abstract A probe apparatus having a probe card having plurality of probes, a member arranged above the probe card to hold an object to be probed, and a test head electrically connected to the probes of the probe card.
Inventors
- 👤 Shigeoki Mori
- 👤 Wataru Karasawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 07:38
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; G01R1/07307; G01R1/07314
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
113 words
A probe apparatus, comprising: a probe card having a plurality of probes; a wafer holding means arranged sideward or upward of said probe card for holding a semiconductor wafer; a test head electrically connected to the probes of the probe card; and a tester electrically connected to said test head for detecting electrical characteristics of the semiconductor wafer based on an output signal generated from the semiconductor wafer; wherein said wafer holding means is provided with an angle adjusting means for adjusting the direction of the semiconductor wafer such that a surface of the semiconductor wafer is adjusted so as to be maintained substantially parallel with a measuring face of the test head.
Claim 2
Dependent Claim
113 words
A probe apparatus, comprising: a probe card having a plurality of probes; a wafer holding means arranged sideward or upward of said probe card for holding a semiconductor wafer; a test head electrically connected to the probes of the probe card; and a tester electrically connected to said test head for detecting electrical characteristics of the semiconductor wafer based on an output signal generated from the semiconductor wafer; wherein said wafer holding means is provided with an angle adjusting means for adjusting the direction of the semiconductor wafer such that a surface of the semiconductor wafer is adjusted so as to be maintained substantially parallel with a measuring face of the test head.
Claim 3
Dependent Claim
35 words
The probe apparatus according to claim 1, wherein the measuring face of the test head has the probe card mounted thereon and is inclined so as to form a predetermined angle with a horizontal plane.
Claim 4
Dependent Claim
21 words
The probe apparatus according to claim 1, wherein the test head and the tester are integrally housed within a single casing.
Claim 5
Dependent Claim
26 words
The probe apparatus according to claim 1, wherein the wafer holding means is provided with a suction means for holding the semiconductor wafer by suction force.
Claim 6
Dependent Claim
33 words
The probe apparatus according to claim 1, wherein said wafer holding means includes an alignment device having a camera and a capacitance sensor for detecting the positions of chips on said semiconductor wafer.
Claim 7
Dependent Claim
25 words
The probe apparatus according to claim 5, further comprising a control means for arithmetically calculating positional information of said chips relative to said probe card.
Claim 8
Dependent Claim
37 words
The probe apparatus according to claim 5, wherein image information is detected by said camera and is stored and used for comparison with subsequent image information obtained from subsequent semiconductor wafers mounted to said wafer holding means.
Claim 9
Dependent Claim
38 words
The probe apparatus according to claim 1, wherein said wafer holding means includes X and Y stages slidable along first and second pairs of guide rails, respectively, for moving said wafer holding means relative to said probe card.
Claim 10
Dependent Claim
35 words
The probe apparatus according to claim 1, wherein said wafer holding means includes a chuck for holding said semiconductor wafer and for moving said wafer reciprocatingly in directions toward or away from said probe card.
Claim 11
Dependent Claim
37 words
The probe apparatus according to claim 9, wherein a reference position member is projected from a side portion of said chuck for enabling the detection of a position of said semiconductor wafer relative to said probe card.
References Cited (Backward Citations)
US4017793A
Cited
US4201939A
Cited
US4589815A
Cited
US4589815B1
Cited
US4626780A
Cited
US4757255A
Cited
US4943767A
Cited
US4786867A
Cited
US4751457A
Cited
US4864227A
Cited
US5084671A
Cited
US4929893A
Cited
US4982153A
Cited
US5077523A
Cited
US5124644A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-06-13 | 1997-12-13 | 1998-06-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-06-13 | 2001-12-13 | 2002-06-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-06-13 | 2005-12-13 | 2006-06-14 | $7700.00 | Window Closed / Lapsed |