Selective area platinum film deposition

Claim 2

A process for selectively depositing platinum on a conductive or semiconductive substrate, comprising the steps of; patterning a polyimide layer on said substrate, thereby patterning said substrate to have exposed areas and unexposed areas; and at an operating temperature and an operating pressure, flowing a platinum precursor gas over said substrate, wherein said platinum precursor gas comprises Pt(PF 3 ) 4 , wherein said operating temperature is at least a temperature at which platinum deposition on said substrate is effected, wherein said operating temperature is less than a temperature at which either said polyimide degrades or said platinum fails to selectively deposit on said substrate, wherein said operating pressure is less than a pressure at which platinum will fail to selectively deposit on said substrate, thereby selectively depositing platinum on said exposed areas on said substrate.

Claim 3

The process of claim 1, further comprising contacting said patterned substrate with a mixture of strong acid and hydrogen peroxide before said step of flowing said platinum precursor gas over said substrate.

Claim 4

The process of claim 2, wherein said strong acid is H 2 SO 4 .

Claim 5

The process of claim 2, further comprising contacting said patterned substrate with HF before said step of flowing said platinum precursor gas over said substrate.

Claim 6

The process of claim 1, further comprising contacting said patterned substrate with HF before said step of flowing said platinum precursor gas over said substrate.

Claim 7

The process of claim 1, wherein said step of flowing said platinum precursor gas over said substrate further comprises diluting said platinum precursor gas in a carrier gas by a factor of between about 5 and about 1000, wherein said carrier gas is selected from the group of gases consisting of gases that are not significantly reactive with said platinum precursor gas and are reducing or nonreactive with said platinum film, said substrate and said polyimide.

Claim 8

The process of claim 6, wherein said carrier gas is selected from the group consisting of H 2 , N 2 , He, Ne, Ar, Kr, and Xe.

Claim 9

The process of claim 1, wherein said substrate is selected from the group consisting of conductive metals, and wherein said operating temperature is between about 150° C. and about 300° C.

Claim 10

The process of claim 1, wherein said substrate is selected from the group consisting of semiconductive substrates, and wherein said operating temperature is between about 200° C. and about 300° C.

Claim 11

The process of claim 9, wherein said semiconductive substrate is selected from the group consisting of Si, GaAs, Ge, and diamond.

Claim 12

A process for selectively depositing platinum on a conductive or semiconductive substrate, comprising the steps of; patterning a polyimide layer on said substrate, thereby patterning said substrate to have exposed areas and unexposed areas; treating said patterned substrate by contacting said patterned substrate with a mixture of H 2 SO 4 and H 2 O 2 ; treating said patterned substrate by contacting said patterned substrate with HF; bringing said patterned and treated substrate to a temperature between about 150° C. and about 300° C; placing said patterned substrate in a vacuum chamber, and reducing the base pressure about said patterned substrate to between about 10 -8 torr and about 10 -2 torr; contacting said substrate with a flow of platinum precursor gas and carrier gas, wherein said platinum precursor gas comprises Pt(PF 3 ) 4 and wherein said carrier gas comprises a gas selected from the group consisting of H 2 , N 2 , He, Ne, Ar, Kr, and Xe.

Claim 13

A process for selectively depositing platinum on a conductive or semiconductive substrate, comprising the steps of; patterning a polyimide layer on said substrate, thereby patterning said substrate to have exposed areas and unexposed areas; treating said patterned substrate by contacting said patterned substrate with a mixture of H 2 SO 4 and H 2 O 2 ; treating said patterned substrate by contacting said patterned substrate with HF; bringing said patterned and treated substrate to a temperature between about 150° C. and about 300° C; placing said patterned substrate in a vacuum chamber, and reducing the base pressure about said patterned substrate to between about 10 -8 torr and about 10 -2 torr; contacting said substrate with a flow of platinum precursor gas and carrier gas, wherein said platinum precursor gas comprises Pt(PF 3 ) 4 and wherein said carrier gas comprises a gas selected from the group consisting of H 2 , N 2 , He, Ne, Ar, Kr, and Xe.