US5317479A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Plated compliant lead
Assignee: General Dynamics Information Systems Inc
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Filing: 1993-10-01
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Granted: 1994-05-31
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Expires: 2013-10-01
Abstract
Abstract A curved lead provides a mechanical and electrical connection between a board contact on a circuit board and a chip contact associated with a circuit chip. The chip can be mounted to the circuit board, to a chip carrier or to a multiple-chip module. The curved lead is substantially entirely plated with solder and is formed of a single piece of conductive material. The curved lead has a first surface for connection to the chip contact and a second surface, generally parallel to the first surface, for connection to the board contact. The first and second surfaces are connected by at least one curved portion and are arranged to mount the circuit chip to the circuit board with the solder in a compliant, generally parallel arrangement substantially free of stress.
Inventors
- 👤 Deepak K. Pai
- 👤 Terrance A. Krinke
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 06:11
CPC Classifications
H; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/55; H01R12/57; H05; H05K; H05K13/00; H05K13/0092; H05K13/04; H05K13/046; H05K13/0465; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3426; H10; H10W; H10W70/00; H10W70/40; H10W70/479; H10W90/00; H10W90/701; H01F; H01F27/00; H01F27/28; H01F27/29; H01F27/292; H01F2027/295; H05K1/00; H05K1/02; H05K1/0271; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10727; H05K2201/10742; H05K2201/1075; H05K2201/10757; H05K2201/10886; H05K2201/10924; H05K2201/10946; H05K2201/10954; H05K2201/10984; H05K2203/00; H05K2203/10; H05K2203/107; H05K3/36; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
139 words
A system for mounting at least one integrated circuit chip in spaced relation to a circuit board and for providing electrical contact between circuit contacts associated with the chip and board contacts on the circuit board, the system comprising: a plurality of curved leads for providing a resilient connection between the board contacts and the circuit contacts, each curved lead being substantially entirely coated with solder plating in a range of 0.3 mils to 1.5 mils thick, and each curved lead being formed of a single piece of conductive material including: a first leg having a first surface for connection to a circuit contact; and a second leg generally parallel to the first leg and joined to the first leg by at least one curved portion, the second leg having a second surface for connection to a board contact.
Claim 2
Independent Claim
139 words
A system for mounting at least one integrated circuit chip in spaced relation to a circuit board and for providing electrical contact between circuit contacts associated with the chip and board contacts on the circuit board, the system comprising: a plurality of curved leads for providing a resilient connection between the board contacts and the circuit contacts, each curved lead being substantially entirely coated with solder plating in a range of 0.3 mils to 1.5 mils thick, and each curved lead being formed of a single piece of conductive material including: a first leg having a first surface for connection to a circuit contact; and a second leg generally parallel to the first leg and joined to the first leg by at least one curved portion, the second leg having a second surface for connection to a board contact.
Claim 3
Dependent Claim
36 words
The system of claim 1, comprising: a support strip supporting the curved leads in a predetermined spaced relation so the first surfaces of the plurality of curved leads are spaced to mate with the circuit contacts.
Claim 4
Dependent Claim
31 words
The system of claim 2 wherein the support strip is removable from the plurality of curved leads so the second surfaces of the curved leads are mountable to the board contacts.
Claim 5
Dependent Claim
50 words
The system of claim 3 wherein the curved leads are formed to mount the chip to the circuit board in a generally parallel arrangement, to provide a compliant mechanical connection between the chip and the circuit board, and to provide an electrical connection between the chip and the circuit board.
Claim 6
Dependent Claim
32 words
The system of claim 2 wherein the curved leads are supported by the support strip so that the leads have a pitch in the range of approximately 15 mils to 50 mils.
Claim 7
Dependent Claim
22 words
The system of claim 1, comprising: a chip carrier carrying the chip wherein the circuit contacts are supported by the chip carrier.
Claim 8
Dependent Claim
20 words
The system of claim 1, comprising: a substrate carrying the chips wherein the circuit contacts are supported by the substrate.
Claim 9
Dependent Claim
13 words
The system of claim 7 wherein the substrate carries a plurality of chips.
Claim 10
Dependent Claim
12 words
The system of claim 8 wherein the substrate is a ceramic substrate.
Claim 11
Dependent Claim
12 words
The system of claim 8 wherein the substrate is a composite substrate.
Claim 12
Dependent Claim
12 words
The system of claim 8 wherein the substrate is a metal substrate.
Claim 13
Dependent Claim
13 words
The system of claim 8 wherein the substrate is an organic laminate substrate.
Claim 14
Dependent Claim
12 words
The system of claim 1 wherein the curved leads are generally S-shaped.
Claim 15
Dependent Claim
12 words
The system of claim 1 wherein the curved leads are generally Z-shaped.
Claim 16
Dependent Claim
12 words
The system of claim 1 wherein the curved leads are generally C-shaped.
Claim 17
Dependent Claim
42 words
The system of claim 1 wherein the curved leads are sized to permit the solder of the solder plating to flow into junctions between the first surfaces and the respective circuit contacts and between the second surfaces and the respective board contacts.
Claim 18
Independent Claim
129 words
An apparatus for providing a mechanical connection and an electrical connection between a board contact on a circuit board and a chip contact associated with a circuit chip, the apparatus comprising: a curved lead substantially entirely plated with solder plating in a range of 0.3 mils to 1.5 mils thick and being formed of a single piece of conductive material having a first surface for connection to the chip contact and a second surface, generally parallel to the first surface, for connection to the board contact, the first and second surfaces being connected by at least one curved portion, the first and second surfaces being arranged to mount the circuit chip to the circuit board with the solder plating in a compliant, generally flat arrangement substantially free of stress.
Claim 19
Independent Claim
129 words
An apparatus for providing a mechanical connection and an electrical connection between a board contact on a circuit board and a chip contact associated with a circuit chip, the apparatus comprising: a curved lead substantially entirely plated with solder plating in a range of 0.3 mils to 1.5 mils thick and being formed of a single piece of conductive material having a first surface for connection to the chip contact and a second surface, generally parallel to the first surface, for connection to the board contact, the first and second surfaces being connected by at least one curved portion, the first and second surfaces being arranged to mount the circuit chip to the circuit board with the solder plating in a compliant, generally flat arrangement substantially free of stress.
Claim 20
Dependent Claim
12 words
The apparatus of claim 17 wherein the curved lead is substantially S-shaped.
Claim 21
Dependent Claim
12 words
The apparatus of claim 17 wherein the curved lead is substantially C-shaped.
Claim 22
Dependent Claim
12 words
The apparatus of claim 17 wherein the curved lead is substantially Z-shaped.
Claim 23
Dependent Claim
42 words
The apparatus of claim 17 wherein the curved leads are sized to permit the solder of the solder plating to flow into junctions between the first surfaces and the respective circuit contacts and between the second surfaces and the respective board contacts.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-05-30 | 1997-11-29 | 1998-05-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-05-30 | 2001-11-29 | 2002-05-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-05-30 | 2005-11-29 | 2006-05-31 | $7700.00 | Window Closed / Lapsed |