US5316975A
Expired / Lapsed
US
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Method of forming multilevel interconnections in a semiconductor integrated circuit
Assignee: NEC Corp
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Filing: 1992-01-21
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Granted: 1994-05-31
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Expires: 2012-01-21
Abstract
Abstract A method is disclosed for producing integrated circuit apparatus in which electroconductive interconnection films are disposed adjacent to each other and have an insulating film sandwiched therebetween. The electroconductive films are electrically connected with each other via a through-hole formed in the insulating film. First, a through-hole is formed in an insulating film so as to extend to the surface of a first electroconductive interconnection film. Then, extraneous materials existing on the surfaces of the insulating film and the electroconductive film exposed in the through-hole are removed by a sputter etching method. Next, an insulating film covering film ("covering film") is formed by a sputtering method on said insulating film by using a material which is the same material that is used for forming a second electroconductive interconnection film. Subsequently, the sputter etching method is used again to remove the covering film. Finally, the second electroconductive interconnection film is formed on the insulating film and makes electrical contact with the first electroconductive film via the through-hole.
Inventors
- 👤 Akitoshi Maeda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 09:38
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/056; Y; Y10; Y10S; Y10S148/00; Y10S148/05; Y10S438/00; Y10S438/902; Y10S438/906
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
227 words
A method of forming multilevel interconnections in a semiconductor integrated circuit wherein electroconductive films are disposed adjacently with an insulating film sandwiched therebetween, said conductive films being connected to each other via a through-hole formed in said insulating film, said method comprising: a first step of forming a first insulating film on a first electroconductive film; a second step of forming a through-hole into said first insulating film, said through-hole reaching a surface of said first electroconductive film; a third step of sputter etching to remove any extraneous material which may be existing on a surface of said first electroconductive film which is exposed into said through-hole; a fourth step of forming a covering film on said first insulating film, said covering film being made of a material which is the same material that is used for forming a part of a second electroconductive film, that is closest to the covering film; a fifth step of sputter etching to remove said covering film until extraneous material generated in said third step on said exposed surface of said first electroconductive film is fully removed and a surface of said first insulating film is fully exposed; and a sixth step of forming said second electroconductive film on said surface of said first insulating film to electrically interconnect said second electroconductive film with said first electroconductive film via said through-hole.
Claim 2
Independent Claim
227 words
A method of forming multilevel interconnections in a semiconductor integrated circuit wherein electroconductive films are disposed adjacently with an insulating film sandwiched therebetween, said conductive films being connected to each other via a through-hole formed in said insulating film, said method comprising: a first step of forming a first insulating film on a first electroconductive film; a second step of forming a through-hole into said first insulating film, said through-hole reaching a surface of said first electroconductive film; a third step of sputter etching to remove any extraneous material which may be existing on a surface of said first electroconductive film which is exposed into said through-hole; a fourth step of forming a covering film on said first insulating film, said covering film being made of a material which is the same material that is used for forming a part of a second electroconductive film, that is closest to the covering film; a fifth step of sputter etching to remove said covering film until extraneous material generated in said third step on said exposed surface of said first electroconductive film is fully removed and a surface of said first insulating film is fully exposed; and a sixth step of forming said second electroconductive film on said surface of said first insulating film to electrically interconnect said second electroconductive film with said first electroconductive film via said through-hole.
Claim 3
Dependent Claim
16 words
A method as claimed in claim 1, wherein said fourth step is carried out by sputtering.
Claim 4
Dependent Claim
21 words
A method as claimed in claim 2, wherein said third, fourth and fifth steps are successively carried out in a vacuum.
Claim 5
Dependent Claim
17 words
A method as claimed in claim 1, wherein said second electroconductive film is a single electroconductive layer.
Claim 6
Dependent Claim
50 words
A method as claimed in claim 1, wherein said second electroconductive film is a stacked plurality of electroconductive layers, and in which said covering film is a material which is the same material that forms the one of said stacked electroconductive layers which is nearest to said first electroconductive film.
Claim 7
Dependent Claim
40 words
A method as claimed in claim 1, wherein said covering film removed in said fifth step is removed from the bottom of the through-hole while leaving a portion thereof on a side surface of said through-hole in said insulating film.
Claim 8
Dependent Claim
35 words
A method as claimed in claim 1, wherein said sputter etching in said fifth step removes all particles from said insulating film to prevent unstable ohmic contacts which might otherwise be caused by said particles.
Claim 9
Independent Claim
215 words
A method of forming a multilevel interconnection structure in a semiconductor integrated circuit apparatus, said method comprising: a first step of forming a first insulating film on a first electroconductive film; a second step of forming a through-hole into said first insulating film which reaches a surface of said first electroconductive film; a third step of sputter etching to remove any extraneous material existing on a surface of said first electroconductive film exposed into said through-hole; a fourth step of forming a covering film on said first insulating film, said covering film being made of a material which is the same material that is used for forming a part of a second electroconductive film; that is closest to the covering film; a fifth step of sputter etching to remove said covering film until extraneous material generated in said third step on said exposed surface of said first electroconductive film is fully removed and a surface of said first insulating film is fully exposed; and a sixth step of forming said second electroconductive film on said surface of said first insulating film to electrically interconnect said first and second electroconductive films via said through-hole; said fourth step being carried out by sputtering, and said third, fourth and fifth steps being carried out successively in a vacuum.
Claim 10
Independent Claim
215 words
A method of forming a multilevel interconnection structure in a semiconductor integrated circuit apparatus, said method comprising: a first step of forming a first insulating film on a first electroconductive film; a second step of forming a through-hole into said first insulating film which reaches a surface of said first electroconductive film; a third step of sputter etching to remove any extraneous material existing on a surface of said first electroconductive film exposed into said through-hole; a fourth step of forming a covering film on said first insulating film, said covering film being made of a material which is the same material that is used for forming a part of a second electroconductive film; that is closest to the covering film; a fifth step of sputter etching to remove said covering film until extraneous material generated in said third step on said exposed surface of said first electroconductive film is fully removed and a surface of said first insulating film is fully exposed; and a sixth step of forming said second electroconductive film on said surface of said first insulating film to electrically interconnect said first and second electroconductive films via said through-hole; said fourth step being carried out by sputtering, and said third, fourth and fifth steps being carried out successively in a vacuum.
Claim 11
Dependent Claim
17 words
A method as claimed in claim 8, wherein said second electroconductive film is a single electroconductive layer.
Claim 12
Dependent Claim
49 words
A method as claimed in claim 8, wherein said second electroconductive film is a stacked plurality of electroconductive layers, said covering film being made of a material which is the same as the material of the one of said electroconductive layers which is nearest to said first electroconductive film.
Claim 13
Dependent Claim
41 words
A method as claimed in claim 8, wherein said covering film is removed from the bottom of said through-hole by the sputter of the fifth step while leaving a portion of said covering film on a side surface of said through-hole.
Claim 14
Dependent Claim
34 words
A method as claimed in claim 8, wherein said sputter etching in said fifth step removes particles from said insulating film to prevent unstable ohmic contacts which might otherwise be caused by said particles.
References Cited (Backward Citations)
US4902645A
Cited
US5081064A
Cited
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