Patent US5316559A successfully refreshed from Google Patents.
US5316559A
Expired / Lapsed
US
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Dicing blade composition
Assignee: KETECA USA Inc
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Filing: 1991-12-18
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Granted: 1994-05-31
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Expires: 2011-12-18
Abstract
Abstract A dicing blade is formed by plating a composition of diamond particles and silicon carbide whiskers suspended in a nickel solution upon an aluminum hub. To obtain bonding rather than capturing of the diamond particles, nickel coated diamond particles may be used to form an inter-metallic bond between the coated diamond particles, the silicon carbide whiskers and the nickel matrix.
Inventors
- 👤 Harold R. Klievoneit
- 👤 Augustine G. Esposito
- 👤 Robert C. Runyon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 21:39
CPC Classifications
B; B24; B24D; B24D18/00; B24D18/0018; B23; B23D; B23D61/00; B23D61/02; B23D61/025; B23D61/026; B28; B28D; B28D1/00; B28D1/02; B28D1/12; B28D1/121
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
46 words
A dicing saw blade for cutting wafers into die, said dicing saw blade comprising in combination: a) an aluminum hub; and b) a dicing blade electroplated upon said hub, said dicing blade being of a composition including at least nickel, diamond grit and silicon carbide whiskers.
Claim 2
Dependent Claim
46 words
A dicing saw blade for cutting wafers into die, said dicing saw blade comprising in combination: a) an aluminum hub; and b) a dicing blade electroplated upon said hub, said dicing blade being of a composition including at least nickel, diamond grit and silicon carbide whiskers.
Claim 3
Dependent Claim
19 words
The dicing saw blade as set forth in claim 1 wherein said diamond grit is nickel coated diamond grit.
Claim 4
Dependent Claim
20 words
The dicing saw blade as set forth in claim 1 wherein said diamond is grit coated with electrically conductive material.
Claim 5
Dependent Claim
76 words
A dicing saw blade mountable upon a rotatable spindle to rotate said wafer saw for cutting wafers into die, said wafer saw comprising in combination: a) a hub mountable upon the rotatable spindle; and b) a dicing blade secured to said hub, said dicing blade being formed from an electroplated composition including at least an electrically conductive plating material, whiskers of electrically conductive material and an abrasive grit retained by said plating material and said whiskers.
Claim 6
Dependent Claim
76 words
A dicing saw blade mountable upon a rotatable spindle to rotate said wafer saw for cutting wafers into die, said wafer saw comprising in combination: a) a hub mountable upon the rotatable spindle; and b) a dicing blade secured to said hub, said dicing blade being formed from an electroplated composition including at least an electrically conductive plating material, whiskers of electrically conductive material and an abrasive grit retained by said plating material and said whiskers.
Claim 7
Dependent Claim
17 words
The dicing saw blade as set forth in claim 4 wherein said abrasive material is diamond grit.
Claim 8
Dependent Claim
29 words
The dicing saw blade as set forth in claim 4 wherein said abrasive material is diamond grit coated with electrically conductive material responsive to electroplating with said plating material.
Claim 9
Dependent Claim
17 words
The dicing saw blade as set forth in claim 4 wherein said whiskers are silicon carbide whiskers.
Claim 10
Dependent Claim
48 words
A dicing saw blade for cutting wafers into die, said dicing saw blade comprising in combination: a) a hub of electrically conductive material; and b) a dicing blade electroformed on said hub, said dicing blade being formed from a plating solution containing abrasive grit and electrically conductive whiskers.
Claim 11
Dependent Claim
48 words
A dicing saw blade for cutting wafers into die, said dicing saw blade comprising in combination: a) a hub of electrically conductive material; and b) a dicing blade electroformed on said hub, said dicing blade being formed from a plating solution containing abrasive grit and electrically conductive whiskers.
Claim 12
Dependent Claim
17 words
The dicing saw blade as set forth in claim 8 wherein said whiskers comprise silicon carbide whiskers.
Claim 13
Dependent Claim
17 words
The dicing saw blade as set forth in claim 9 wherein said abrasive grit comprises diamond grit.
Claim 14
Dependent Claim
22 words
The dicing saw blade as set forth in claim 9 wherein said abrasive grit comprises diamond grit covered with electrically conductive material.
Claim 15
Dependent Claim
17 words
The dicing saw blade as set forth in claim 8 wherein said abrasive grit comprises diamond grit.
Claim 16
Dependent Claim
25 words
The dicing saw blade as set forth in claim 12 wherein said abrasive grit comprises diamond grit at least partially coated with electrically conductive material.
Claim 17
Dependent Claim
47 words
A dicing saw blade for cutting wafers into die, said dicing saw blade comprising in combination: a) a hub of electrically conductive material; and b) a dicing blade electroplated on said hub, said dicing blade comprising a matrix of plating material, abrasive grit and electrically conductive whiskers.
Claim 18
Dependent Claim
47 words
A dicing saw blade for cutting wafers into die, said dicing saw blade comprising in combination: a) a hub of electrically conductive material; and b) a dicing blade electroplated on said hub, said dicing blade comprising a matrix of plating material, abrasive grit and electrically conductive whiskers.
Claim 19
Dependent Claim
17 words
The dicing saw blade as set forth in claim 14 wherein said whiskers comprise silicon carbide whiskers.
Claim 20
Dependent Claim
17 words
The dicing saw blade as set forth in claim 14 wherein said abrasive grit comprises diamond grit.
Claim 21
Dependent Claim
22 words
The dicing saw blade as set forth in claim 14 wherein said abrasive grit comprises diamond grit coated with electrically conductive material.
Claim 22
Dependent Claim
17 words
The dicing saw blade as set forth in claim 17 wherein said whiskers comprise silicon carbide whiskers.
Claim 23
Dependent Claim
16 words
The dicing saw blade as set forth in claim 18 wherein said plating material comprises nickel.
Claim 24
Dependent Claim
53 words
A dicing saw blade comprising a hub of electrically conductive material and a dicing blade formed by the steps of electroplating an annular radially aligned band of nickel, abrasive grit and silicon carbide whiskers on said hub and removing an annular section of said hub to expose opposed sides of said dicing blade.
Claim 25
Dependent Claim
53 words
A dicing saw blade comprising a hub of electrically conductive material and a dicing blade formed by the steps of electroplating an annular radially aligned band of nickel, abrasive grit and silicon carbide whiskers on said hub and removing an annular section of said hub to expose opposed sides of said dicing blade.
Claim 26
Dependent Claim
44 words
The dicing saw blade as set forth in claim 20 wherein the abrasive grit is diamond grit coated with an electrically conductive material and including the steps of forming an intermetallic matrix of nickel, diamond grit and silicon whiskers during said step of electroplating.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-05-30 | 1997-11-29 | 1998-05-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-05-30 | 2001-11-29 | 2002-05-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-05-30 | 2005-11-29 | 2006-05-31 | $7700.00 | Window Closed / Lapsed |