Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
182 words
A thickness compensation actuator system for enabling automatic, coarse adjustment of wafer height in combination with a stepper mechanism for imposing image patterns on said wafer which comprises: a vacuum chuck capable of supporting a wafer thereon; vacuum applying means capable of providing said vacuum chuck with sufficient vacuum to maintain said wafer in contact with said vacuum chuck, said vacuum applying means including a centrally located vacuum conduit portion; means for adjustably securing said vacuum chuck to said vacuum applying means; an actuator means rotatably disposed about said vacuum conduit portion; and means, including a motor, for reciprocally moving said actuator means such that its movement produces a similar reciprocal movement by said vacuum chuck; and feedback means, including a focus sensor means, a microprocessor, and said motor, said feedback means being operative for automatically, coarsely adjusting the height of said vacuum chuck in response to the thickness variation of said wafer, such that the upper surface of said wafer will lie in a predetermined plane, said thickness variation exceeding the total range of focus accommodation built into the stepper mechanism.
Claim 2
Dependent Claim
182 words
A thickness compensation actuator system for enabling automatic, coarse adjustment of wafer height in combination with a stepper mechanism for imposing image patterns on said wafer which comprises: a vacuum chuck capable of supporting a wafer thereon; vacuum applying means capable of providing said vacuum chuck with sufficient vacuum to maintain said wafer in contact with said vacuum chuck, said vacuum applying means including a centrally located vacuum conduit portion; means for adjustably securing said vacuum chuck to said vacuum applying means; an actuator means rotatably disposed about said vacuum conduit portion; and means, including a motor, for reciprocally moving said actuator means such that its movement produces a similar reciprocal movement by said vacuum chuck; and feedback means, including a focus sensor means, a microprocessor, and said motor, said feedback means being operative for automatically, coarsely adjusting the height of said vacuum chuck in response to the thickness variation of said wafer, such that the upper surface of said wafer will lie in a predetermined plane, said thickness variation exceeding the total range of focus accommodation built into the stepper mechanism.
Claim 3
Dependent Claim
34 words
The system according to claim 1, further comprising a support means disposed about said actuator means such that said actuator means is capable of reciprocally moving along the inner surface of said support means.
Claim 4
Dependent Claim
42 words
The system according to claim 1, wherein a spring is disposed between female threading on said actuator means and female threading on said support means to permit continuous reciprocal movement by said actuator means along the inner surface of the support means.
Claim 5
Dependent Claim
20 words
The system according to claim 1, further comprising a swivel means disposed between said vacuum chuck and said actuator means.
Claim 6
Dependent Claim
24 words
The system according to claim 1, wherein said means for adjustably securing said vacuum chuck to said vacuum conduit portion is a spring means.
Claim 7
Dependent Claim
24 words
The system according to claim 1, wherein said means for reciprocally moving said actuator means is a gear means connected to said actuator means.
Claim 8
Dependent Claim
19 words
The system according to claim 1, further comprising a wafer chuck disposed between said vacuum chuck and said wafer.
Claim 9
Dependent Claim
23 words
The system according to claim 1, wherein said focus sensor means comprises an array of air gauge focus sensors spaced from said wafer.