US5313044A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for real-time wafer temperature and thin film growth measurement and control in a lamp-heated rapid thermal processor
Assignee: Duke University
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Filing: 1992-04-28
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Granted: 1994-05-17
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Expires: 2012-04-28
Abstract
Abstract An ellipsometer measures/monitors the change in polarization of light upon reflection from a wafer sample. The temperature of the wafer substrate surface and the film thickness are then simultaneously determined in situ using ellipsometry where the true wafer temperature is determined in real-time by the computer from a calculation based on the known temperature dependence of the refractive index of the wafer. The power output to the lamps is then adjusted accordingly to raise or lower the wafer temperature within the apparatus. This process continues automatically to maintain the desired temperature and film growth rate until the desired film thickness is achieved.
Inventors
- 👤 Hisham Z. Massoud
- 👤 Ronald K. Sampson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 18:33
CPC Classifications
G; G01; G01N; G01N21/00; G01N21/17; G01N21/21; G01N21/211; B; B23; B23K; B23K26/00; B23K26/02; B23K26/03; B23K26/034; B23K26/06; B23K26/064; B23K26/0652; B23K26/12; B23K26/1224; B23K26/123; B24; B24B; B24B37/00; B24B37/005; B24B37/013; H; H10; H10P; H10P74/00; H10P74/23; H10P74/238; H10P74/20; H10P74/203
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
98 words
A method for determining and adjusting temperature of a semiconductor wafer in a rapid thermal processing system comprising the steps of: (a) determining the ellipsometric parameters ψ and Δ in real-time with an ellipsometer; (b) calculating the temperature and film thickness from said ellipsometric parameters of ψ and Δ of a semiconductor wafer positioned in a thermal processing chamber; (c) comparing said measured temperature and film thickness to predetermined temperature and film thickness vs. time data; and (d) adjusting the amount of heat provided to said semiconductor wafer by a lamp module in response to said steps (a)-(c).
Claim 2
Independent Claim
98 words
A method for determining and adjusting temperature of a semiconductor wafer in a rapid thermal processing system comprising the steps of: (a) determining the ellipsometric parameters ψ and Δ in real-time with an ellipsometer; (b) calculating the temperature and film thickness from said ellipsometric parameters of ψ and Δ of a semiconductor wafer positioned in a thermal processing chamber; (c) comparing said measured temperature and film thickness to predetermined temperature and film thickness vs. time data; and (d) adjusting the amount of heat provided to said semiconductor wafer by a lamp module in response to said steps (a)-(c).
Claim 3
Dependent Claim
44 words
A method according to claim 1 wherein the step of determining the said ellipsometric parameters ψ and Δ includes the steps of sampling the output signal from an ellipsometer light detector with reference to the signal from a rotating analyzing prism and attached encoder.
Claim 4
Dependent Claim
93 words
A method according to claim 1 wherein the step of calculating the temperature and film thickness of the semiconductor wafer from the ellipsometric parameters ψ and Δ includes the steps of calculating the temperature of said semiconductor wafer by a polynomial previously fitted to the variation of the ellipsometric parameters ψ and Δ for the wavelength of light emitted from an ellipsometer light source, for the angle of incidence of the light emitted from the light source that impinges on said semiconductor wafer, and for the refractive index of the said film thickness.
Claim 5
Dependent Claim
97 words
A method according to claim 1 wherein the step of calculating the temperature and film thickness of said semiconductor wafer from the ellipsometric parameters ψ and Δ includes the steps of calculating the film thickness of a surface film on said semiconductor wafer by a polynomial previously fitted to the variation of the ellipsometric parameters ψ and Δ for the wavelength of light emitted from an ellipsometer light source, for the angle of incidence of the light emitted from the light source that impinges on said semiconductor wafer, and for the refractive index of the film thickness.
Claim 6
Dependent Claim
124 words
A method according to claim 1 wherein the step of determining the temperature and film thickness of the semiconductor wafer from the ellipsometric parameters ψ and Δ includes the steps of calculating the complex refractive index of the semiconductor wafer substrate and the film thickness by solving the fundamental equation of ellipsometry for the wavelength of light emitted from the light source of a rotating analyzer ellipsometer, for the angle of incidence of the light emitted from the light source that impinges on said semiconductor wafer, and for the refractive index of the film thickness, wherein the temperature of said semiconductor wafer is determined from a polynomial fitted to the variation of the said complex refractive index of said semiconductor wafer substrate with temperature.
Claim 7
Dependent Claim
16 words
A method according to claim 3 or 4 wherein said semiconductor wafer consists essentially of silicon.
Claim 8
Dependent Claim
27 words
A method according to claim 3, 4 or 5 comprising utilizing a helium-neon light source and a rotating analyzer ellipsometer operating at a fixed wavelength of 6328Å.
Claim 9
Independent Claim
17 words
A method according to claims 3 or 4 comprising utilizing a fixed angle of incidence of 70°.
Claim 10
Independent Claim
35 words
A method according to claims 3 or 4 utilizing a film refractive index of between 1.0 and 4.0 corresponding to silicon dioxide for a wavelength of light emitted from the light source of 6328Å .
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1997-05-16 | 1997-11-15 | 1998-05-17 | $2000.00 | Window Closed / Lapsed |
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