Heat treatment apparatus having a wafer boat

Claim 2

A heat treatment apparatus for transferring a semiconductor wafer between a cassette and a heat-resistant boat and for heat-treating a number of wafers loaded on the boat, comprising: the boat having a wafer holding assembly for holding the wafer, a plurality of main posts, and a plurality of tongues equidistantly mounted to said main posts and projecting inward of the main posts; said wafer holding assembly having a ring member fixed to said tongues and a plurality of supporting pieces mounted on an upper surface of said ring member such that wafers are brought into direct contact with said supporting pieces, an outer diameter of said ring member being larger than the wafer diameter; wherein said ring member has a straight portion formed on an inner periphery thereof, and the straight portion corresponds to an orientation flat of the wafer, a major portion of a process gas flowing onto a wafer surface through the straight portion.

Claim 3

A heat treatment apparatus according to claim 1, wherein said ring member has another straight portion on the outer periphery thereof, the respective straight portions on the outer and inner peripheries extending parallel to each other.

Claim 4

A heat treatment apparatus for transferring a semiconductor wafer between a cassette and a heat-resistant boat and for heat-treating a number of wafers loaded on the boat, comprising: gas supply means for supplying a process gas to a lower end side of the boat; and exhaust means for exhausting the process gas from an upper end side of the boat; the boat having a wafer holding assembly for holding the wafer, a plurality of main posts, and a plurality of tongues equidistantly mounted to said main posts and projecting inward of the main posts; said wafer holding assembly having a ring member fixed to said tongue and a plurality of supporting pieces mounted on the upper surface of said ring member such that wafers are brought into direct contact with said supporting pieces, the diameter of said ring member being larger than the wafer diameter; and a clearance being formed between the wafer supported by the supporting piece and the ring member such that a process gas passes through said clearance to flow in a vertical direction within the boat so as to be supplied onto the upper surface of the wafer.

Claim 5

A heat treatment apparatus for transferring a semiconductor wafer between a cassette and a heat-resistant boat and for heat-treating a number of wafers loaded on the boat, comprising: gas supply means for supplying a process gas to a lower end side of the boat; and exhaust means for exhausting the process gas from an upper end side of the boat; the boat having a wafer holding assembly for holding the wafer, a plurality of main posts, and a plurality of tongues equidistantly mounted to said main posts and projecting inward of the main posts; said wafer holding assembly having a ring member fixed to said tongue and a plurality of supporting pieces mounted on the upper surface of said ring member such that wafers are brought into direct contact with said supporting pieces, the diameter of said ring member being larger than the wafer diameter; and a clearance being formed between the wafer supported by the supporting piece and the ring member such that a process gas passes through said clearance to flow in a vertical direction within the boat so as to be supplied onto the upper surface of the wafer.

Claim 6

A heat treatment apparatus according to claim 3, wherein the inside diameter of said ring member is larger than or equal to the diameter of the wafer.

Claim 7

A heat treatment apparatus according to claim 3, wherein an adjacent distance between said main posts on a wafer entering side is wider than that on the other side.

Claim 8

A heat treatment apparatus according to claim 5, wherein said ring member has a straight portion formed on the inner periphery thereof on the side where side adjacent distance between the posts is wider than that on the other side.

Claim 9

A heat treatment apparatus according to claim 5, wherein said main posts are provided with reinforcing ribs for reinforcing the main posts on the side where the distance between the main posts is narrower than that on the other side.

Claim 10

A heat treatment apparatus according to claim 3, further comprising projections arranged at regular intervals on each said main post and supporting said wafer holding assembly.

Claim 11

A heat treatment apparatus according to claim 3, wherein each said supporting piece is a combination of a columnar member projecting over the ring member and a plate member protruding inward from the columnar member toward an axis of the boat so as to extend beyond the inner peripheral of the ring member.

Claim 12

A heat treatment apparatus according to claim 3, wherein each said supporting piece includes a wafer loading portion and a leg portion for supporting the loading portion, said portions being formed integrally with each other.

Claim 13

A heat treatment apparatus according to claim 3, wherein said supporting pieces are arranged at regular intervals on the upper surface of the ring member.

Claim 14

A heat treatment apparatus according to claim 3, wherein said supporting pieces are three in number.

Claim 15

A heat treatment apparatus according to claim 3, wherein said supporting pieces are four in number.

Claim 16

A heat transfer apparatus according to claim 1, wherein said boat is formed of a material selected from the group consisting of quartz, SiC and Al 2 O 3 .

Claim 17

A heat treatment apparatus according to claim 3, wherein the upper surface of said ring member is finished by grinding or baking to have a smooth surface having a roughness not larger than 10 μm.

Claim 18

A heat treatment apparatus according to claim 3, wherein each of said ring member and said tongue is made of quartz, and the ring member is fixed to the tongue by welding.

Claim 19

A heat treatment apparatus according to claim 3, wherein the distance K between the two main posts at the ends of the semi-circular configuration formed by the arrangement of the main posts is larger than the diameter J of the wafer W.